MY129488A - Method for fabricating film bulk acoustic resonators to achieve high-q and low loss - Google Patents
Method for fabricating film bulk acoustic resonators to achieve high-q and low lossInfo
- Publication number
- MY129488A MY129488A MYPI20024661A MYPI20024661A MY129488A MY 129488 A MY129488 A MY 129488A MY PI20024661 A MYPI20024661 A MY PI20024661A MY PI20024661 A MYPI20024661 A MY PI20024661A MY 129488 A MY129488 A MY 129488A
- Authority
- MY
- Malaysia
- Prior art keywords
- bulk acoustic
- film bulk
- achieve high
- low loss
- acoustic resonators
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000000151 deposition Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/023—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the membrane type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/4908—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/023,594 US6662419B2 (en) | 2001-12-17 | 2001-12-17 | Method for fabricating film bulk acoustic resonators to achieve high-Q and low loss |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY129488A true MY129488A (en) | 2007-04-30 |
Family
ID=21816084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20024661A MY129488A (en) | 2001-12-17 | 2002-12-12 | Method for fabricating film bulk acoustic resonators to achieve high-q and low loss |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US6662419B2 (enExample) |
| EP (1) | EP1464116A1 (enExample) |
| JP (1) | JP4058001B2 (enExample) |
| CN (1) | CN1620755B (enExample) |
| AU (1) | AU2002357317A1 (enExample) |
| MY (1) | MY129488A (enExample) |
| TW (1) | TWI264139B (enExample) |
| WO (1) | WO2003052929A1 (enExample) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020158947A1 (en) * | 2001-04-27 | 2002-10-31 | Isaku Kanno | Piezoelectric element, method for manufacturing piezoelectric element, and ink jet head and ink jet recording apparatus having piezoelectric element |
| US6662419B2 (en) * | 2001-12-17 | 2003-12-16 | Intel Corporation | Method for fabricating film bulk acoustic resonators to achieve high-Q and low loss |
| US20030119308A1 (en) * | 2001-12-20 | 2003-06-26 | Geefay Frank S. | Sloped via contacts |
| US6828713B2 (en) * | 2002-07-30 | 2004-12-07 | Agilent Technologies, Inc | Resonator with seed layer |
| US6816035B2 (en) * | 2002-08-08 | 2004-11-09 | Intel Corporation | Forming film bulk acoustic resonator filters |
| WO2004088840A1 (ja) * | 2003-03-31 | 2004-10-14 | Ube Industries, Ltd. | 圧電薄膜デバイス及びその製造方法 |
| US6954121B2 (en) * | 2003-06-09 | 2005-10-11 | Agilent Technologies, Inc. | Method for controlling piezoelectric coupling coefficient in film bulk acoustic resonators and apparatus embodying the method |
| KR100662865B1 (ko) * | 2003-10-08 | 2007-01-02 | 삼성전자주식회사 | 박막 벌크 음향 공진기 및 그 제조방법 |
| JP4373949B2 (ja) * | 2004-04-20 | 2009-11-25 | 株式会社東芝 | 薄膜圧電共振器及びその製造方法 |
| US7114252B2 (en) * | 2004-06-17 | 2006-10-03 | Toko, Inc. | Large scale simultaneous circuit encapsulating apparatus |
| US20060001329A1 (en) * | 2004-06-30 | 2006-01-05 | Valluri Rao | FBAR device frequency stabilized against temperature drift |
| US20060017352A1 (en) * | 2004-07-20 | 2006-01-26 | Aram Tanielian | Thin device and method of fabrication |
| JP2006148402A (ja) * | 2004-11-18 | 2006-06-08 | Matsushita Electric Ind Co Ltd | 共振器の製造方法 |
| US20070063777A1 (en) * | 2005-08-26 | 2007-03-22 | Mircea Capanu | Electrostrictive devices |
| US7528681B2 (en) * | 2005-12-20 | 2009-05-05 | Palo Alto Research Center Incorporated | Acoustic devices using an AlGaN piezoelectric region |
| JP4811924B2 (ja) * | 2006-02-24 | 2011-11-09 | 日本碍子株式会社 | 圧電薄膜デバイス |
| JP5027534B2 (ja) * | 2006-07-07 | 2012-09-19 | 日本碍子株式会社 | 圧電薄膜デバイス |
| CN101796726B (zh) * | 2007-08-24 | 2014-04-02 | 太阳诱电株式会社 | 压电薄膜谐振器、使用该压电薄膜谐振器的滤波器、使用该滤波器的双工器、以及使用该滤波器或该双工器的通信设备 |
| US8291559B2 (en) * | 2009-02-24 | 2012-10-23 | Epcos Ag | Process for adapting resonance frequency of a BAW resonator |
| JP5319491B2 (ja) * | 2009-10-22 | 2013-10-16 | 太陽誘電株式会社 | 圧電薄膜共振子 |
| US9525399B2 (en) * | 2011-10-31 | 2016-12-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Planarized electrode for improved performance in bulk acoustic resonators |
| TWI493868B (zh) * | 2013-01-02 | 2015-07-21 | Ind Tech Res Inst | 微機電共振裝置 |
| FR3004289B1 (fr) | 2013-04-08 | 2015-05-15 | Soitec Silicon On Insulator | Composant a ondes acoustiques de surface et sa methode de fabrication |
| US9374059B1 (en) * | 2015-01-06 | 2016-06-21 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Film bulk acoustic resonator filter |
| KR101730335B1 (ko) * | 2015-01-27 | 2017-04-27 | 주하이 어드밴스드 칩 캐리어스 앤드 일렉트로닉 서브스트레이트 솔루션즈 테크놀러지즈 컴퍼니 리미티드 | 필름 벌크 음향 공진기 필터 제조 방법 |
| US11411169B2 (en) * | 2017-10-16 | 2022-08-09 | Akoustis, Inc. | Methods of forming group III piezoelectric thin films via removal of portions of first sputtered material |
| US11832521B2 (en) * | 2017-10-16 | 2023-11-28 | Akoustis, Inc. | Methods of forming group III-nitride single crystal piezoelectric thin films using ordered deposition and stress neutral template layers |
| US11411168B2 (en) | 2017-10-16 | 2022-08-09 | Akoustis, Inc. | Methods of forming group III piezoelectric thin films via sputtering |
| US11316496B2 (en) * | 2016-03-11 | 2022-04-26 | Akoustis, Inc. | Method and structure for high performance resonance circuit with single crystal piezoelectric capacitor dielectric material |
| US11895920B2 (en) | 2016-08-15 | 2024-02-06 | Akoustis, Inc. | Methods of forming group III piezoelectric thin films via removal of portions of first sputtered material |
| TWI632772B (zh) * | 2016-10-17 | 2018-08-11 | 穩懋半導體股份有限公司 | 具有質量調整結構之體聲波共振器及其應用於體聲波濾波器 |
| US10466572B2 (en) * | 2017-03-24 | 2019-11-05 | Zhuhai Crystal Resonance Technologies Co., Ltd. | Method of fabrication for single crystal piezoelectric RF resonators and filters |
| US10389331B2 (en) * | 2017-03-24 | 2019-08-20 | Zhuhai Crystal Resonance Technologies Co., Ltd. | Single crystal piezoelectric RF resonators and filters |
| CN107809221B (zh) * | 2017-09-27 | 2021-05-11 | 佛山市艾佛光通科技有限公司 | 一种空腔型薄膜体声波谐振器及其制备方法 |
| US11856858B2 (en) | 2017-10-16 | 2023-12-26 | Akoustis, Inc. | Methods of forming doped crystalline piezoelectric thin films via MOCVD and related doped crystalline piezoelectric thin films |
| JP7298991B2 (ja) * | 2018-01-22 | 2023-06-27 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
| CN110120793B (zh) * | 2018-02-05 | 2024-11-12 | 武汉衍熙微器件有限公司 | 具有非c轴优选压电层的薄膜体声波谐振器 |
| DE112020003868T5 (de) * | 2019-08-15 | 2022-06-15 | Akoustis, Inc. | Verfahren zum Ausbilden von piezoelektrischen Dünnfilmen der Gruppe III durch Entfernen von Abschnitten des zuerst gesputterten Materials |
| US11618968B2 (en) | 2020-02-07 | 2023-04-04 | Akoustis, Inc. | Apparatus including horizontal flow reactor with a central injector column having separate conduits for low-vapor pressure metalorganic precursors and other precursors for formation of piezoelectric layers on wafers |
| US12102010B2 (en) | 2020-03-05 | 2024-09-24 | Akoustis, Inc. | Methods of forming films including scandium at low temperatures using chemical vapor deposition to provide piezoelectric resonator devices and/or high electron mobility transistor devices |
| WO2021220544A1 (ja) * | 2020-04-30 | 2021-11-04 | 株式会社村田製作所 | 圧電振動子及びそれを備える圧電発振器 |
| CN111711900B (zh) * | 2020-07-09 | 2021-12-10 | 京东方科技集团股份有限公司 | 显示面板及其制造方法、显示装置 |
| GB2598665B (en) * | 2020-09-04 | 2025-07-23 | Skyworks Solutions Inc | Multi-layer piezoelectric substrate with controllable delta temperature coefficient of frequency |
| US11990889B2 (en) | 2020-12-28 | 2024-05-21 | Win Semiconductors Corp. | Bulk acoustic wave resonator and formation method thereof |
| US12362724B2 (en) * | 2021-08-20 | 2025-07-15 | Raytheon Company | N-polar rare-earth III-nitride bulk acoustic wave resonator |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719383A (en) * | 1985-05-20 | 1988-01-12 | The United States Of America As Represented By The United States Department Of Energy | Piezoelectric shear wave resonator and method of making same |
| US5233259A (en) * | 1991-02-19 | 1993-08-03 | Westinghouse Electric Corp. | Lateral field FBAR |
| US5747857A (en) | 1991-03-13 | 1998-05-05 | Matsushita Electric Industrial Co., Ltd. | Electronic components having high-frequency elements and methods of manufacture therefor |
| US5668057A (en) * | 1991-03-13 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | Methods of manufacture for electronic components having high-frequency elements |
| JP2531891B2 (ja) | 1991-03-20 | 1996-09-04 | 日本碍子株式会社 | セラミック体の欠陥検出方法 |
| JP3371050B2 (ja) * | 1995-10-27 | 2003-01-27 | 三菱電機株式会社 | 薄膜圧電素子 |
| US5596239A (en) * | 1995-06-29 | 1997-01-21 | Motorola, Inc. | Enhanced quality factor resonator |
| EP1012888B1 (en) * | 1996-10-17 | 2009-03-04 | Avago Technologies Wireless IP (Singapore) Pte. Ltd. | Method for fabricating fbars on glass substrates |
| US5935641A (en) * | 1996-10-23 | 1999-08-10 | Texas Instruments Incorporated | Method of forming a piezoelectric layer with improved texture |
| CN100389538C (zh) * | 1998-04-28 | 2008-05-21 | Tdk株式会社 | 压电体振子 |
| JP3649273B2 (ja) * | 1999-03-16 | 2005-05-18 | セイコーエプソン株式会社 | 圧電体薄膜素子の製造方法 |
| FI107660B (fi) * | 1999-07-19 | 2001-09-14 | Nokia Mobile Phones Ltd | Resonaattorirakenne |
| US6349454B1 (en) * | 1999-07-29 | 2002-02-26 | Agere Systems Guardian Corp. | Method of making thin film resonator apparatus |
| US6456173B1 (en) * | 2001-02-15 | 2002-09-24 | Nokia Mobile Phones Ltd. | Method and system for wafer-level tuning of bulk acoustic wave resonators and filters |
| US6566979B2 (en) * | 2001-03-05 | 2003-05-20 | Agilent Technologies, Inc. | Method of providing differential frequency adjusts in a thin film bulk acoustic resonator (FBAR) filter and apparatus embodying the method |
| US6483229B2 (en) * | 2001-03-05 | 2002-11-19 | Agilent Technologies, Inc. | Method of providing differential frequency adjusts in a thin film bulk acoustic resonator (FBAR) filter and apparatus embodying the method |
| US6936954B2 (en) * | 2001-08-29 | 2005-08-30 | Honeywell International Inc. | Bulk resonator |
| KR100541895B1 (ko) * | 2001-09-21 | 2006-01-16 | 가부시끼가이샤 도시바 | 고주파 필터 |
| JP3817730B2 (ja) * | 2001-12-10 | 2006-09-06 | セイコーエプソン株式会社 | 圧電アクチュエータの製造方法、インクジェット式記録ヘッド、及びプリンタ |
| US6662419B2 (en) * | 2001-12-17 | 2003-12-16 | Intel Corporation | Method for fabricating film bulk acoustic resonators to achieve high-Q and low loss |
| US6828713B2 (en) * | 2002-07-30 | 2004-12-07 | Agilent Technologies, Inc | Resonator with seed layer |
| US6894360B2 (en) * | 2002-07-30 | 2005-05-17 | Agilent Technologies, Inc. | Electrostatic discharge protection of thin-film resonators |
| US6816035B2 (en) * | 2002-08-08 | 2004-11-09 | Intel Corporation | Forming film bulk acoustic resonator filters |
-
2001
- 2001-12-17 US US10/023,594 patent/US6662419B2/en not_active Expired - Lifetime
-
2002
- 2002-11-28 TW TW091134597A patent/TWI264139B/zh not_active IP Right Cessation
- 2002-12-12 MY MYPI20024661A patent/MY129488A/en unknown
- 2002-12-17 JP JP2003553710A patent/JP4058001B2/ja not_active Expired - Fee Related
- 2002-12-17 AU AU2002357317A patent/AU2002357317A1/en not_active Abandoned
- 2002-12-17 CN CN028281632A patent/CN1620755B/zh not_active Expired - Fee Related
- 2002-12-17 WO PCT/US2002/040505 patent/WO2003052929A1/en not_active Ceased
- 2002-12-17 EP EP02805205A patent/EP1464116A1/en not_active Withdrawn
-
2003
- 2003-11-19 US US10/716,750 patent/US6861783B2/en not_active Expired - Lifetime
-
2005
- 2005-02-23 US US11/065,511 patent/US7116034B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| AU2002357317A1 (en) | 2003-06-30 |
| US7116034B2 (en) | 2006-10-03 |
| US20040104640A1 (en) | 2004-06-03 |
| US20030112095A1 (en) | 2003-06-19 |
| US6861783B2 (en) | 2005-03-01 |
| EP1464116A1 (en) | 2004-10-06 |
| TW200301576A (en) | 2003-07-01 |
| US6662419B2 (en) | 2003-12-16 |
| CN1620755B (zh) | 2011-06-22 |
| WO2003052929A1 (en) | 2003-06-26 |
| TWI264139B (en) | 2006-10-11 |
| US20050140246A1 (en) | 2005-06-30 |
| CN1620755A (zh) | 2005-05-25 |
| JP2006503448A (ja) | 2006-01-26 |
| JP4058001B2 (ja) | 2008-03-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY129488A (en) | Method for fabricating film bulk acoustic resonators to achieve high-q and low loss | |
| EP1471637A3 (en) | Method for fabricating cantilevered type film bulk acoustic resonator and film bulk acoustic resonator fabricated by the same | |
| EP1227581A3 (en) | Bulk acoustic wave resonator with a conductive acoustic mirror | |
| WO2005034345A8 (en) | Resonator structure and method of producing it | |
| EP1100196A3 (en) | Piezoelectric Resonator | |
| EP0865157A3 (en) | A bulk acoustic wave (BAW) filter | |
| EP0963040A3 (en) | Acoustic resonator and method for making the same | |
| US7299529B2 (en) | Film bulk acoustic resonator (FBAR) process using single-step resonator layer deposition | |
| EP1120910A3 (en) | Multiple frequency acoustic reflector array and monolithic cover for resonators and method | |
| EP1480335A3 (en) | Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby | |
| GB2425417B (en) | Acoustically coupled resonators and method of making the same | |
| AU2002214372A1 (en) | Thin film resonator and method for manufacturing the same | |
| EP1385265A3 (en) | Piezoelectric filter, duplexer, composite piezoelectric resonator, communication device and method for adjusting frequency of piezoelectric filter | |
| ATE479230T1 (de) | Baw filter mit verschiedenen mittenfrequenzen auf einem einzelnen substrat und entsprechende herstellungsmethode | |
| EP1258989A3 (en) | Method of tuning baw resonators | |
| EP1047189A3 (en) | Piezoelectric resonator | |
| WO2006034299A3 (en) | Resonator system with a plurality of individual mechanically coupled resonators and method of making same | |
| WO2002095799A3 (en) | Thin films and production methods thereof | |
| EP1313217A4 (en) | SURFACE WAVE COMPONENT AND METHOD FOR THE PRODUCTION THEREOF | |
| EP1533896A3 (en) | Piezoelectric element, composite piezoelectric element, and filter, duplexer and communication equipment using the same | |
| EP1081853A3 (en) | Surface acoustic wave device and method for manufacturing the same | |
| CA2642731A1 (en) | Method of isolation for acoustic resonator devices | |
| EP1315293A3 (en) | Fabrication of film bulk acoustic resonator | |
| EP1523097A3 (en) | Air-gap type FBAR, method for fabricating the same, and filter and duplexer using the same | |
| MY136656A (en) | Film bulk acoustic resonator structure and method of making |