MY118700A - Thermosetting resin compositions - Google Patents
Thermosetting resin compositionsInfo
- Publication number
- MY118700A MY118700A MYPI98000177A MYPI9800177A MY118700A MY 118700 A MY118700 A MY 118700A MY PI98000177 A MYPI98000177 A MY PI98000177A MY PI9800177 A MYPI9800177 A MY PI9800177A MY 118700 A MY118700 A MY 118700A
- Authority
- MY
- Malaysia
- Prior art keywords
- thermosetting resin
- csp
- circuit board
- semiconductor device
- resin compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
- C08K5/3155—Dicyandiamide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP00657197A JP3613367B2 (ja) | 1997-01-17 | 1997-01-17 | 熱硬化性樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY118700A true MY118700A (en) | 2005-01-31 |
Family
ID=11642033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI98000177A MY118700A (en) | 1997-01-17 | 1998-01-16 | Thermosetting resin compositions |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0953008A4 (ja) |
JP (1) | JP3613367B2 (ja) |
KR (1) | KR100554323B1 (ja) |
CN (1) | CN1243526A (ja) |
BR (1) | BR9806743A (ja) |
ID (1) | ID22238A (ja) |
MY (1) | MY118700A (ja) |
TW (1) | TW561178B (ja) |
WO (1) | WO1998031738A1 (ja) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100612805B1 (ko) * | 1999-02-18 | 2006-08-18 | 가부시끼가이샤 쓰리본드 | 에폭시 수지 조성물 |
MY140714A (en) * | 1999-07-08 | 2010-01-15 | Sunstar Engineering Inc | Underfilling material for semiconductor package |
US6255500B1 (en) | 2000-01-21 | 2001-07-03 | Loctite Corporation | Process for the epoxidation of diene esters |
US7012120B2 (en) | 2000-03-31 | 2006-03-14 | Henkel Corporation | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
US20050288458A1 (en) | 2002-07-29 | 2005-12-29 | Klemarczyk Philip T | Reworkable thermosetting resin composition |
JP4609617B2 (ja) * | 2000-08-01 | 2011-01-12 | 日本電気株式会社 | 半導体装置の実装方法及び実装構造体 |
US6627683B1 (en) | 2000-09-05 | 2003-09-30 | Henkel Loctite Corporation | Reworkable thermosetting resin compositions and compounds useful therein |
US7108920B1 (en) | 2000-09-15 | 2006-09-19 | Henkel Corporation | Reworkable compositions incorporating episulfide resins |
US6936664B2 (en) | 2000-10-04 | 2005-08-30 | Henkel Corporation | Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
CN1276490C (zh) | 2000-11-14 | 2006-09-20 | 亨凯尔公司 | 硅晶片应用的助焊和填缝材料,和用其制造的层状电子组件 |
TW574739B (en) * | 2001-02-14 | 2004-02-01 | Nitto Denko Corp | Thermosetting resin composition and semiconductor device using the same |
JP5280597B2 (ja) * | 2001-03-30 | 2013-09-04 | サンスター技研株式会社 | 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材 |
JP3566680B2 (ja) * | 2001-09-11 | 2004-09-15 | 富士通株式会社 | 半導体装置の製造方法 |
US6916890B1 (en) | 2001-10-09 | 2005-07-12 | Henkel Corporation | Thermally reworkable epoxy resins and compositions based thereon |
US6887737B1 (en) | 2001-12-13 | 2005-05-03 | Henkel Corporation | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
US7242082B2 (en) | 2002-02-07 | 2007-07-10 | Irvine Sensors Corp. | Stackable layer containing ball grid array package |
JP2007521631A (ja) * | 2003-08-08 | 2007-08-02 | アービン センサーズ コーポレーション | 積層可能な層及びその製造方法 |
JP5175431B2 (ja) * | 2005-09-16 | 2013-04-03 | 日本電気株式会社 | 半導体装置のリペア方法 |
JP2007258207A (ja) * | 2006-03-20 | 2007-10-04 | Three M Innovative Properties Co | バンプ付きチップもしくはパッケージの実装方法 |
WO2007124768A1 (en) | 2006-04-28 | 2007-11-08 | Telecom Italia S.P.A. | Ink-jet printhead and manufacturing method thereof |
WO2007142654A1 (en) * | 2006-06-09 | 2007-12-13 | Advanced Applied Adhesives | Reworkable compositions and methods for use thereof |
US7714426B1 (en) | 2007-07-07 | 2010-05-11 | Keith Gann | Ball grid array package format layers and structure |
CN102057475B (zh) | 2008-06-05 | 2013-01-02 | 住友电木株式会社 | 半导体装置的制造方法以及半导体装置 |
US8450859B2 (en) | 2008-10-27 | 2013-05-28 | Panasonic Corporation | Semiconductor device mounted structure and its manufacturing method |
CN103172306A (zh) * | 2013-04-08 | 2013-06-26 | 天津大学 | 一种水弹性模型材料及其制备方法 |
KR102340799B1 (ko) * | 2018-09-20 | 2021-12-16 | 주식회사 엘지화학 | 금속 박막 코팅용 열경화성 수지 조성물, 이를 이용한 수지 코팅 금속 박막 및 금속박 적층판 |
KR102092649B1 (ko) * | 2018-11-07 | 2020-03-24 | (주)티에이치엔 | 방열 및 방사 기능이 구비된 전자 기기 패키징 장치 제조방법 |
DE102020127468A1 (de) | 2020-10-19 | 2022-04-21 | Werner H. Salewski | Multifunktionale Epoxyd-Systeme |
DE102022120396A1 (de) | 2022-08-12 | 2024-02-15 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Verwendung einer härtbaren und wiederlösbaren Masse zur Herstellung eines Bauteils, und Masse dafür |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5463199A (en) * | 1977-10-31 | 1979-05-21 | Mitsui Petrochem Ind Ltd | Curable composition for elastomers |
SU990781A1 (ru) * | 1979-12-06 | 1983-01-23 | Предприятие П/Я В-8657 | Маркировочна спиртобензостойка краска |
SU1100295A1 (ru) * | 1982-12-24 | 1984-06-30 | Предприятие П/Я В-2756 | Клей |
US4794314A (en) * | 1987-08-28 | 1988-12-27 | Johnson Service Company | Environmental position actuator apparatus having load responsive limit control apparatus |
DD266361A1 (de) * | 1987-12-03 | 1989-03-29 | Leuna Werke Veb | Tauchfaehige umhuellmassen fuer elektrische und elektronische bauelemente |
US4866108A (en) * | 1988-01-19 | 1989-09-12 | Hughes Aircraft Company | Flexible epoxy adhesive blend |
JP2679849B2 (ja) * | 1989-07-26 | 1997-11-19 | 松下電器産業株式会社 | 電子部品の実装方法およびこの方法に用いる接着剤 |
JP3543902B2 (ja) * | 1997-01-17 | 2004-07-21 | ヘンケル ロックタイト コーポレイション | 半導体装置の実装構造および実装方法 |
-
1997
- 1997-01-17 JP JP00657197A patent/JP3613367B2/ja not_active Expired - Fee Related
-
1998
- 1998-01-16 MY MYPI98000177A patent/MY118700A/en unknown
- 1998-01-16 CN CN98801882A patent/CN1243526A/zh active Pending
- 1998-01-16 ID IDW990703A patent/ID22238A/id unknown
- 1998-01-16 KR KR1019997006429A patent/KR100554323B1/ko not_active IP Right Cessation
- 1998-01-16 EP EP98904585A patent/EP0953008A4/en not_active Withdrawn
- 1998-01-16 BR BR9806743-5A patent/BR9806743A/pt not_active Application Discontinuation
- 1998-01-16 WO PCT/US1998/000858 patent/WO1998031738A1/en not_active Application Discontinuation
- 1998-01-17 TW TW087100682A patent/TW561178B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20000070203A (ko) | 2000-11-25 |
CN1243526A (zh) | 2000-02-02 |
KR100554323B1 (ko) | 2006-02-24 |
WO1998031738A1 (en) | 1998-07-23 |
ID22238A (id) | 1999-09-23 |
BR9806743A (pt) | 2000-02-29 |
EP0953008A4 (en) | 2000-05-03 |
TW561178B (en) | 2003-11-11 |
JPH10204259A (ja) | 1998-08-04 |
EP0953008A1 (en) | 1999-11-03 |
JP3613367B2 (ja) | 2005-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY118700A (en) | Thermosetting resin compositions | |
DE69833865D1 (de) | Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen | |
MY118367A (en) | Thermally reworkable binders for flip-chip devices | |
TW200721421A (en) | Semiconductor structure and method of assembly | |
KR940002031A (ko) | 칩 캐리어 | |
MY118368A (en) | Thermosetting encapsulants for electronics packaging | |
MY114561A (en) | Curable organosiloxane compositions and semiconductor devices | |
TW200642055A (en) | Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same | |
MY147837A (en) | Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating | |
EP1198005A4 (en) | SEMICONDUCTOR MODULE AND ITS MOUNTING METHOD | |
TW200611614A (en) | Circuit device and method of producing the same | |
EP1209211A4 (en) | ADHESIVE, ADHESIVE OBJECT, CIRCUIT SUBSTRATE FOR SEMICONDUCTOR MOUNTING WITH AN ADHESIVE AND A SEMICONDUCTOR ARRANGEMENT THAT CONTAINS THESE | |
MY112247A (en) | Chip carrier with protective coating for circuitized surface | |
EP1049152A3 (en) | Semiconductor encapsulating epoxy resin composition and semiconductor device | |
US7790510B1 (en) | Metal lid with improved adhesion to package substrate | |
SG128546A1 (en) | Low cte substrates for use with low-k flip-chip package devices | |
WO1998032159A3 (en) | Mounting structure and mounting process from semiconductor devices | |
TW200515515A (en) | BGA semiconductor device with protection of component on ball-planting surface | |
GB2353528A (en) | Adhesive and encapsulating material with fluxing properties | |
US7498198B2 (en) | Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties | |
WO2002027780A1 (fr) | Composant a semi-conducteur scelle par de la resine, materiau de fixation de puce et materiau de scellement utilise | |
US6975512B1 (en) | Thermally enhanced heat sink BGA package | |
MY121395A (en) | Epoxy resin composition for bonding semiconductor chips | |
US7768139B2 (en) | Power semiconductor module | |
ATE399806T1 (de) | Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage |