MY118114A - Holder for polished work and manufacturing method thereof - Google Patents

Holder for polished work and manufacturing method thereof

Info

Publication number
MY118114A
MY118114A MYPI20013217A MYPI20013217A MY118114A MY 118114 A MY118114 A MY 118114A MY PI20013217 A MYPI20013217 A MY PI20013217A MY PI20013217 A MYPI20013217 A MY PI20013217A MY 118114 A MY118114 A MY 118114A
Authority
MY
Malaysia
Prior art keywords
resin portion
polished work
hole
holder
manufacturing
Prior art date
Application number
MYPI20013217A
Other languages
English (en)
Inventor
Motoyuki Nanjo
Kouji Uchihata
Akihiko Uzawa
Kuniyuki Kanai
Original Assignee
Sumitomo Bakelite Co
Artlite Kogyo Co Ltd
Utk System Co Ltd
C R T Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000208289A external-priority patent/JP3439726B2/ja
Application filed by Sumitomo Bakelite Co, Artlite Kogyo Co Ltd, Utk System Co Ltd, C R T Co Ltd filed Critical Sumitomo Bakelite Co
Publication of MY118114A publication Critical patent/MY118114A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
MYPI20013217A 2000-07-10 2001-07-05 Holder for polished work and manufacturing method thereof MY118114A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000208289A JP3439726B2 (ja) 2000-07-10 2000-07-10 被研磨物保持材及びその製造方法

Publications (1)

Publication Number Publication Date
MY118114A true MY118114A (en) 2004-08-30

Family

ID=29695697

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20013217A MY118114A (en) 2000-07-10 2001-07-05 Holder for polished work and manufacturing method thereof

Country Status (4)

Country Link
KR (1) KR20020005980A (ko)
MY (1) MY118114A (ko)
SG (1) SG99915A1 (ko)
TW (1) TW544367B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6792106B2 (ja) * 2017-03-30 2020-11-25 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57177641U (ko) * 1981-04-30 1982-11-10
JPS584349U (ja) * 1981-06-30 1983-01-12 日立金属株式会社 両面研摩機用キヤリヤ
JPH0727747U (ja) * 1993-10-18 1995-05-23 直江津電子工業株式会社 半導体ウエハ等の研磨用キャリア
JPH09155729A (ja) * 1995-12-08 1997-06-17 Seiko Epson Corp 平面研磨板及びこれを用いた平面研磨装置
JPH1110530A (ja) * 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd 両面研磨用キャリア
JP2000015565A (ja) * 1998-06-30 2000-01-18 Toshiba Ceramics Co Ltd キャリア
JP2001105303A (ja) * 1999-10-04 2001-04-17 U T K Syst:Kk 両面研磨用キャリア

Also Published As

Publication number Publication date
TW544367B (en) 2003-08-01
KR20020005980A (ko) 2002-01-18
SG99915A1 (en) 2003-11-27

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