MXPA05009864A - Metodo de grabado al aguafuerte selectivo utilizando capa de detencion de grabado al aguafuerte. - Google Patents
Metodo de grabado al aguafuerte selectivo utilizando capa de detencion de grabado al aguafuerte.Info
- Publication number
- MXPA05009864A MXPA05009864A MXPA05009864A MXPA05009864A MXPA05009864A MX PA05009864 A MXPA05009864 A MX PA05009864A MX PA05009864 A MXPA05009864 A MX PA05009864A MX PA05009864 A MXPA05009864 A MX PA05009864A MX PA05009864 A MXPA05009864 A MX PA05009864A
- Authority
- MX
- Mexico
- Prior art keywords
- layer
- etch stop
- stop layer
- selective etching
- mirror
- Prior art date
Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
- B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
- B81C1/00793—Avoid contamination, e.g. absorption of impurities or oxidation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
- B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
- B81C1/00801—Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0135—Controlling etch progression
- B81C2201/014—Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
La fabricacion de un dispositivo de MEMS tal como un modulador interferometrico se mejora al emplear una capa de detencion de grabado al aguafuerte entre una capa de sacrificio y una capa de espejo. El reten de grabado al aguafuerte puede reducir el sobre-grabado al aguafuerte indeseable de la capa de sacrificio y la capa de espejo. La capa de detencion de grabado al aguafuerte tambien puede servir como una capa de barrera, capa amortiguadora y/o capa de plantilla.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61341004P | 2004-09-27 | 2004-09-27 | |
US11/090,773 US20060066932A1 (en) | 2004-09-27 | 2005-03-25 | Method of selective etching using etch stop layer |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA05009864A true MXPA05009864A (es) | 2006-03-29 |
Family
ID=35462575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA05009864A MXPA05009864A (es) | 2004-09-27 | 2005-09-14 | Metodo de grabado al aguafuerte selectivo utilizando capa de detencion de grabado al aguafuerte. |
Country Status (11)
Country | Link |
---|---|
US (1) | US20060066932A1 (es) |
EP (1) | EP1640768A1 (es) |
JP (1) | JP2006091852A (es) |
KR (1) | KR20060092871A (es) |
AU (1) | AU2005203258A1 (es) |
BR (1) | BRPI0503833A (es) |
CA (1) | CA2514349A1 (es) |
MX (1) | MXPA05009864A (es) |
RU (1) | RU2005129861A (es) |
SG (1) | SG121046A1 (es) |
TW (1) | TW200626481A (es) |
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TW200506479A (en) * | 2003-08-15 | 2005-02-16 | Prime View Int Co Ltd | Color changeable pixel for an interference display |
TW593127B (en) * | 2003-08-18 | 2004-06-21 | Prime View Int Co Ltd | Interference display plate and manufacturing method thereof |
TWI231865B (en) * | 2003-08-26 | 2005-05-01 | Prime View Int Co Ltd | An interference display cell and fabrication method thereof |
US20050057442A1 (en) * | 2003-08-28 | 2005-03-17 | Olan Way | Adjacent display of sequential sub-images |
JP3979982B2 (ja) * | 2003-08-29 | 2007-09-19 | シャープ株式会社 | 干渉性変調器および表示装置 |
TWI232333B (en) * | 2003-09-03 | 2005-05-11 | Prime View Int Co Ltd | Display unit using interferometric modulation and manufacturing method thereof |
US6982820B2 (en) * | 2003-09-26 | 2006-01-03 | Prime View International Co., Ltd. | Color changeable pixel |
US20050068583A1 (en) * | 2003-09-30 | 2005-03-31 | Gutkowski Lawrence J. | Organizing a digital image |
US6861277B1 (en) * | 2003-10-02 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Method of forming MEMS device |
US7183215B2 (en) * | 2004-07-21 | 2007-02-27 | Hewlett-Packard Development Company, L.P. | Etching with electrostatically attracted ions |
-
2005
- 2005-03-25 US US11/090,773 patent/US20060066932A1/en not_active Abandoned
- 2005-07-25 JP JP2005214923A patent/JP2006091852A/ja active Pending
- 2005-07-26 AU AU2005203258A patent/AU2005203258A1/en not_active Abandoned
- 2005-07-26 SG SG200504626A patent/SG121046A1/en unknown
- 2005-07-29 CA CA002514349A patent/CA2514349A1/en not_active Abandoned
- 2005-08-10 TW TW094127155A patent/TW200626481A/zh unknown
- 2005-09-09 KR KR1020050084154A patent/KR20060092871A/ko not_active Application Discontinuation
- 2005-09-14 EP EP05255661A patent/EP1640768A1/en not_active Withdrawn
- 2005-09-14 MX MXPA05009864A patent/MXPA05009864A/es not_active Application Discontinuation
- 2005-09-23 BR BRPI0503833-2A patent/BRPI0503833A/pt not_active IP Right Cessation
- 2005-09-26 RU RU2005129861/28A patent/RU2005129861A/ru not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
RU2005129861A (ru) | 2007-04-10 |
AU2005203258A1 (en) | 2006-04-13 |
JP2006091852A (ja) | 2006-04-06 |
EP1640768A1 (en) | 2006-03-29 |
SG121046A1 (en) | 2006-04-26 |
KR20060092871A (ko) | 2006-08-23 |
BRPI0503833A (pt) | 2006-05-09 |
US20060066932A1 (en) | 2006-03-30 |
CA2514349A1 (en) | 2006-03-27 |
TW200626481A (en) | 2006-08-01 |
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