MXPA02004625A - Aparato compacto de refluido y lavado. - Google Patents

Aparato compacto de refluido y lavado.

Info

Publication number
MXPA02004625A
MXPA02004625A MXPA02004625A MXPA02004625A MXPA02004625A MX PA02004625 A MXPA02004625 A MX PA02004625A MX PA02004625 A MXPA02004625 A MX PA02004625A MX PA02004625 A MXPA02004625 A MX PA02004625A MX PA02004625 A MXPA02004625 A MX PA02004625A
Authority
MX
Mexico
Prior art keywords
reflow
cleaning apparatus
compact
cleaning
unitary housing
Prior art date
Application number
MXPA02004625A
Other languages
English (en)
Inventor
R Dalton Shean
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Publication of MXPA02004625A publication Critical patent/MXPA02004625A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un horno compacto de refluido y un aparato de lavado combinados en un alojamiento unitario, para ambas funciones, de refluido y de lavado. Esto da por resultado el ahorro de un valioso espacio de suelo util en las areas de montaje de placas de circuito impreso. El alojamiento unitario y el control de las temperaturas en las areas de refluido y de lavado facilitan la remocion de los contaminantes antes de que tales contaminantes se solidifiquen.
MXPA02004625A 1999-11-08 2000-11-07 Aparato compacto de refluido y lavado. MXPA02004625A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/435,650 US6354481B1 (en) 1999-02-18 1999-11-08 Compact reflow and cleaning apparatus
PCT/US2000/041942 WO2001034335A1 (en) 1999-11-08 2000-11-07 Compact reflow and cleaning apparatus

Publications (1)

Publication Number Publication Date
MXPA02004625A true MXPA02004625A (es) 2004-09-10

Family

ID=23729245

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02004625A MXPA02004625A (es) 1999-11-08 2000-11-07 Aparato compacto de refluido y lavado.

Country Status (7)

Country Link
US (1) US6354481B1 (es)
EP (1) EP1230059A1 (es)
AU (1) AU2622201A (es)
CA (1) CA2390587A1 (es)
MX (1) MXPA02004625A (es)
TW (1) TW467786B (es)
WO (1) WO2001034335A1 (es)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000022898A1 (fr) * 1998-10-13 2000-04-20 Matsushita Electric Industrial Co., Ltd. Dispositif de chauffage et procede de chauffage
US6446855B1 (en) * 1999-02-18 2002-09-10 Speedline Technologies, Inc. Compact reflow and cleaning apparatus
JP2001170767A (ja) * 1999-12-10 2001-06-26 Hitachi Ltd はんだ付け装置
JP3397313B2 (ja) * 1999-12-20 2003-04-14 富士通株式会社 半導体装置の製造方法及び電子部品の実装方法
TW482328U (en) * 2000-12-13 2002-04-01 Via Tech Inc IC tray to prevent the IC encapsulant from being placed in wrong direction
TW570856B (en) * 2001-01-18 2004-01-11 Fujitsu Ltd Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
JP3848102B2 (ja) * 2001-05-22 2006-11-22 富士通メディアデバイス株式会社 電子デバイスの封止装置及びその封止方法
US6694637B2 (en) 2002-01-18 2004-02-24 Speedline Technologies, Inc. Flux collection method and system
US6760981B2 (en) * 2002-01-18 2004-07-13 Speedline Technologies, Inc. Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation
DE10202124B4 (de) * 2002-01-22 2011-03-17 Meissner, Werner Durchlaufreinigungseinrichtung
US6715662B2 (en) * 2002-05-29 2004-04-06 Rogers Engineering & Manufacturing Co., Inc. Waste energy recovery system for a controlled atmosphere system
US20050045205A1 (en) * 2003-08-29 2005-03-03 Stach Steven R. Apparatus and method for cleaning printed circuit boards
DE102004030004A1 (de) * 2004-06-22 2006-01-12 Premark Feg L.L.C. (N.D.Ges.D. Staates Delaware), Wilmington Sprühdüse für eine Geschirrspülmaschine
DE102004030001A1 (de) * 2004-06-22 2006-01-12 Premark Feg L.L.C., Wilmington Spülmaschinen-Betriebsverfahren und Transportspülmaschine
DE102004030014A1 (de) * 2004-06-22 2006-01-12 Premark Feg L.L.C., Wilmington Spülmaschinen-Betriebsverfahren und Transportspülmaschine
DE102004030015A1 (de) * 2004-06-22 2006-01-12 Premark Feg L.L.C., Wilmington Spülmaschinen-Betriebsverfahren und Transportspülmaschine
DE102004030003A1 (de) * 2004-06-22 2006-01-12 Premark Feg L.L.C. (N.D.Ges.D. Staates Delaware), Wilmington Spülmaschinen-Betriebsverfahren und Transportspülmaschine
DE102004030013A1 (de) * 2004-06-22 2006-01-12 Premark Feg L.L.C. (N.D.Ges.D. Staates Delaware), Wilmington Geschirrspülmaschine und Betriebsverfahren für eine Geschirrspülmaschine
US20060202332A1 (en) * 2005-01-08 2006-09-14 Samsung Electronics Co., Ltd. Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package
KR101062943B1 (ko) * 2005-01-17 2011-09-07 유겐가이샤 요코타테쿠니카 리플로우 로
US20060260656A1 (en) * 2005-05-20 2006-11-23 Dietrich Berner Commercial dishwasher, in particular glass washer
DE102005035764A1 (de) * 2005-07-29 2007-02-01 Premark Feg L.L.C., Wilmington Transportgeschirrspülmaschine und Betriebsverfahren hierfür
US8557907B2 (en) * 2005-08-26 2013-10-15 Macro-M S.A. De C.V. Reactive block copolymers for the preparation of inorganic tubule-polymer composites
US20080210263A1 (en) * 2007-02-16 2008-09-04 Premark Feg L.L.C. Method and apparatus for washing and rinsing glassware
US7708183B2 (en) 2008-03-28 2010-05-04 Illinois Tool Works Inc. Reflow solder oven with cooling diffuser
WO2010030505A1 (en) * 2008-09-10 2010-03-18 Austin American Technology Corporation Cleaning and testing ionic cleanliness of electronic assemblies
US8196799B2 (en) 2010-06-28 2012-06-12 Illinois Tool Works Inc. Compression box for reflow oven heating with a pressurizing plate
US20130146647A1 (en) * 2011-12-07 2013-06-13 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated Reflow and Cleaning Process and Apparatus for Performing the Same
US9170051B2 (en) 2012-04-02 2015-10-27 Illinois Tool Works Inc. Reflow oven and methods of treating surfaces of the reflow oven
US8940099B2 (en) 2012-04-02 2015-01-27 Illinois Tool Works Inc. Reflow oven and methods of treating surfaces of the reflow oven
US9198300B2 (en) 2014-01-23 2015-11-24 Illinois Tool Works Inc. Flux management system and method for a wave solder machine
US9161459B2 (en) 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
US10390675B2 (en) 2015-06-01 2019-08-27 Illinois Tool Works Inc. Warewash machine cleaning notification and in-situ dilution process
TWI629116B (zh) * 2016-06-28 2018-07-11 荏原製作所股份有限公司 清洗裝置、具備該清洗裝置之鍍覆裝置、以及清洗方法
JP6687495B2 (ja) * 2016-10-14 2020-04-22 株式会社Ｆｕｊｉ 部品実装ライン
US10537031B2 (en) 2017-03-22 2020-01-14 Service Support Specialties, Inc. Reflow soldering apparatus, system and method
JP6478000B1 (ja) 2017-06-05 2019-03-06 千住金属工業株式会社 はんだ付け装置
US11205633B2 (en) * 2019-01-09 2021-12-21 Kulicke And Soffa Industries, Inc. Methods of bonding of semiconductor elements to substrates, and related bonding systems

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3639142A (en) * 1968-06-10 1972-02-01 Bethlehem Steel Corp Method of galvanizing
US4682563A (en) * 1983-04-27 1987-07-28 Kabushiki Kaisha Tamura Seisakusho Jig for supporting array of articles to be soldered and device for transferring articles to jig
JPH01152636A (ja) 1987-12-09 1989-06-15 Mitsubishi Electric Corp 半導体装置用組立部品の搬送方法
DE3840098C1 (es) * 1988-11-28 1989-12-21 Helmut Walter 8900 Augsburg De Leicht
DE4032328A1 (de) 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
US5374331A (en) * 1991-10-22 1994-12-20 Argus International Preflux coating method
JP2760189B2 (ja) * 1991-11-08 1998-05-28 株式会社村田製作所 チップ部品の電極形成装置
JP2793737B2 (ja) 1992-03-18 1998-09-03 株式会社トクヤマ プリコート基板の製造方法
DE4225378A1 (de) * 1992-03-20 1993-09-23 Linde Ag Verfahren zum verloeten von leiterplatten unter niederdruck
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
US5433368A (en) * 1992-11-10 1995-07-18 Spigarelli; Donald J. Soldering system
US5440101A (en) * 1993-04-19 1995-08-08 Research, Incorporated Continuous oven with a plurality of heating zones
US5388327A (en) 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
JP3492742B2 (ja) 1993-12-03 2004-02-03 松下電器産業株式会社 半田付け方法及び半田付け装置
FR2713521B1 (fr) * 1993-12-09 1996-03-22 Lenglen Jean Luc Procédé et machine pour le nettoyage de pièces.
US5494529A (en) 1994-02-22 1996-02-27 Atotech Usa, Inc. Treatment method for cleaning and drying printed circuit boards and the like
US5524810A (en) 1994-04-14 1996-06-11 Sikama International, Inc. Solder reflow processor
FR2735053B1 (fr) * 1995-06-09 1997-07-25 Air Liquide Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche
US6096999A (en) 1995-08-29 2000-08-01 Soltec B.V. Reflow soldering apparatus with a rotative configuration
US5611476C1 (en) * 1996-01-18 2002-02-26 Btu Int Solder reflow convection furnace employing flux handling and gas densification systems
JP3253052B2 (ja) * 1996-03-08 2002-02-04 矢崎総業株式会社 電気コネクタ
US5814789A (en) * 1996-07-18 1998-09-29 Btu International, Inc. Forced convection furnance gas plenum
US5873449A (en) * 1996-11-26 1999-02-23 Ast Research, Inc. Shift table for use in a product conveyor system having workstations
DE29704601U1 (de) 1997-03-13 1997-06-19 Rehm Anlagenbau Gmbh & Co Heizvorrichtung
US5993500A (en) * 1997-10-16 1999-11-30 Speedline Technololies, Inc. Flux management system
US6446855B1 (en) 1999-02-18 2002-09-10 Speedline Technologies, Inc. Compact reflow and cleaning apparatus

Also Published As

Publication number Publication date
AU2622201A (en) 2001-06-06
TW467786B (en) 2001-12-11
WO2001034335A1 (en) 2001-05-17
WO2001034335A9 (en) 2002-08-15
US6354481B1 (en) 2002-03-12
CA2390587A1 (en) 2001-05-17
EP1230059A1 (en) 2002-08-14

Similar Documents

Publication Publication Date Title
MXPA02004625A (es) Aparato compacto de refluido y lavado.
SG65783A1 (en) Printed circuit board socket
SG48362A1 (en) Single-sided straddle mount printed circuit board connector
HK1005111A1 (en) Printed circuit board sparkgap
SG52992A1 (en) Multilayer printed circuit board
SG67434A1 (en) Cover for an edge mounted printed circuit board connector
SG71716A1 (en) Multilayer printed circuit boards
SG52197A1 (en) Printed circuit board connector
EP0677897A3 (de) Leiterplattenanordnung für Steckverbindungen.
EP0908080A4 (en) ASSEMBLY CARRIER FOR PCB WITH SPLASH COOLING
GB9721706D0 (en) Printed circuit boards
EP0624054A3 (en) Printed circuit boards.
HK1008434A1 (en) Device for processing printed circuit boards
EP0715489A3 (en) Assembly of printed circuit boards
SG79881A1 (en) Printed circuit board
GB9304967D0 (en) Printed circuit board for surface mounted electrical components
GB9802869D0 (en) Circuit board
GB2337862B (en) Printed circuit board
TW392984U (en) Connector for circuit board
GB2331844B (en) Apparatus for mounting an electronic circuit component
EP0679054A3 (de) Verfahren zur Codierung von Leiterplatten.
ZA987923B (en) Security feature for printed circuit boards.
GB9508857D0 (en) Printed circuit board
GB9718570D0 (en) Circuit board
GB2287586B (en) Edge connection for printed circuit boards