MX9804072A - Estructura flexible de bobinado de un transformador de salida horizontal, y su proceso de fabricacion. - Google Patents

Estructura flexible de bobinado de un transformador de salida horizontal, y su proceso de fabricacion.

Info

Publication number
MX9804072A
MX9804072A MX9804072A MX9804072A MX9804072A MX 9804072 A MX9804072 A MX 9804072A MX 9804072 A MX9804072 A MX 9804072A MX 9804072 A MX9804072 A MX 9804072A MX 9804072 A MX9804072 A MX 9804072A
Authority
MX
Mexico
Prior art keywords
coil winding
winding structure
flexible
manufacturing process
flyback transformer
Prior art date
Application number
MX9804072A
Other languages
English (en)
Inventor
Chang-Gu Choi
Ha-Eun Nam
Original Assignee
Daewoo Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daewoo Electronics Co Ltd filed Critical Daewoo Electronics Co Ltd
Publication of MX9804072A publication Critical patent/MX9804072A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/42—Flyback transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/006—Details of transformers or inductances, in general with special arrangement or spacing of turns of the winding(s), e.g. to produce desired self-resonance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F2027/2861—Coil formed by folding a blank
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Of Transformers For General Uses (AREA)

Abstract

Se describe una estructura flexible de bobinado de un transformador de salida horizontal, la cual comprende un nucleo magnetizable en la porcion, central, un par de hojas aislantes flexibles en ambos costados del nucleo magnetizable para aislarlo y diseños de línea conductora primero y segundo arreglados para que puedan proveer un diseño de circuito arrollado alrededor del par de hojas aislantes flexibles. Los diseños de línea conductora primero y segundo incluyen respectivamente una pluralidad de líneas conductoras paralelas primera y segunda que están inclinadas a un ángulo predeterminado. También la estructura de bobinado incluye una abertura, tal como un orificio o ventana corroída químicamente, en una porcion de la hoja aislante que corresponde a las porciones superior e inferior de todas las líneas conductoras y una conexion eléctrica para conectar a través de la abertura las porciones superiores y las porciones inferiores de los diseños de línea conductora primero y segundo para que las líneas conductoras provean el diseño de circuito arrollado. La conexion eléctrica es proveída por soldadura. También se describe un proceso de fabricacion de la estructura flexible de bobinado.
MX9804072A 1995-11-30 1998-05-22 Estructura flexible de bobinado de un transformador de salida horizontal, y su proceso de fabricacion. MX9804072A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR19950069126 1995-11-30
KR19950069127 1995-11-30
KR19950072213 1995-12-31

Publications (1)

Publication Number Publication Date
MX9804072A true MX9804072A (es) 1998-09-30

Family

ID=27349276

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9804072A MX9804072A (es) 1995-11-30 1998-05-22 Estructura flexible de bobinado de un transformador de salida horizontal, y su proceso de fabricacion.

Country Status (8)

Country Link
US (1) US5877669A (es)
KR (1) KR100211814B1 (es)
CN (1) CN1202977A (es)
AU (1) AU1071997A (es)
GB (1) GB2307797B (es)
MX (1) MX9804072A (es)
TW (1) TW416563U (es)
WO (1) WO1997020330A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001076934A (ja) * 1999-06-30 2001-03-23 Toshiba Corp インダクタンス素子とその製造方法、およびそれを用いたスナバー回路
AU2001263348A1 (en) * 2000-05-19 2001-12-03 Philip A. Harding Slot core transformers
CN1261753C (zh) * 2000-09-22 2006-06-28 M-福来克斯多精线电子学公司 电子变压器/电感器器件及其制造方法
US20040004577A1 (en) * 2002-04-29 2004-01-08 Forster Ian J. Flexible curtain antenna for reading RFID tags
US7135952B2 (en) 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
US7436282B2 (en) * 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
EP1861857A4 (en) * 2004-12-07 2009-09-02 Multi Fineline Electronix Inc MINIATURE CIRCUITS AND INDUCTIVE COMPONENTS AND MANUFACTURING METHOD THEREFOR
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
CN101630585B (zh) * 2009-06-19 2011-09-21 西安交通大学 导磁线和导电线混绕的分布式绕组柔性变压器
TWI435438B (zh) * 2011-01-28 2014-04-21 Ajoho Entpr Co Ltd Structure and manufacturing method of inductance element
DE202014005370U1 (de) * 2014-06-27 2014-07-14 Würth Elektronik eiSos Gmbh & Co. KG Induktives Bauteil
JP2016213224A (ja) * 2015-04-30 2016-12-15 Tdk株式会社 コイル、非接触受電装置、及び携帯用電子機器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1126370A (en) * 1965-12-29 1968-09-05 British Aircraft Corp Ltd Improvements relating to printed circuits
DE1614792A1 (de) * 1967-03-23 1970-12-23 Telefunken Patent In Duenn-oder Dickfilmtechnik hergestellte Spule
US3614554A (en) * 1968-10-24 1971-10-19 Texas Instruments Inc Miniaturized thin film inductors for use in integrated circuits
US3858138A (en) * 1973-03-05 1974-12-31 Rca Corp Tuneable thin film inductor
US4308513A (en) * 1978-10-26 1981-12-29 Burroughs Corporation Etched magnetic coil
FR2440615A1 (fr) * 1978-11-03 1980-05-30 Thomson Csf Procede de fabrication de bossages metalliques calibres sur un film support et film support comportant de tels bossages
US5241293A (en) * 1988-06-15 1993-08-31 Murata Manufacturing Co., Ltd. Flyback transformer including a plated metal coil and having reduced leakage flux
JP2615151B2 (ja) * 1988-08-19 1997-05-28 株式会社村田製作所 チップ型コイル及びその製造方法
US5237165A (en) * 1991-04-05 1993-08-17 Tingley Iii Loyal H Multi-turn coil structures and methods of winding same
CA2062710C (en) * 1991-05-31 1996-05-14 Nobuo Shiga Transformer for monolithic microwave integrated circuit
US5487214A (en) * 1991-07-10 1996-01-30 International Business Machines Corp. Method of making a monolithic magnetic device with printed circuit interconnections
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Also Published As

Publication number Publication date
GB2307797A (en) 1997-06-04
GB9624697D0 (en) 1997-01-15
GB2307797B (en) 2000-08-16
KR970051524A (ko) 1997-07-29
AU1071997A (en) 1997-06-19
US5877669A (en) 1999-03-02
TW416563U (en) 2000-12-21
CN1202977A (zh) 1998-12-23
WO1997020330A1 (en) 1997-06-05
KR100211814B1 (ko) 1999-08-02

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