HK1004884A1 - Method of forming metallic conductive patterns on insulating substrates - Google Patents

Method of forming metallic conductive patterns on insulating substrates

Info

Publication number
HK1004884A1
HK1004884A1 HK98104044A HK98104044A HK1004884A1 HK 1004884 A1 HK1004884 A1 HK 1004884A1 HK 98104044 A HK98104044 A HK 98104044A HK 98104044 A HK98104044 A HK 98104044A HK 1004884 A1 HK1004884 A1 HK 1004884A1
Authority
HK
Hong Kong
Prior art keywords
conductive patterns
insulating substrates
metallic conductive
forming metallic
forming
Prior art date
Application number
HK98104044A
Inventor
Luc Boone
Hubert De Steur
Ann Dumoulin
Antoon Mattelin
Josef Van Puymbroeck
Marcel Heermann
Eduard Schoenberger
Original Assignee
Siemens Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Sa filed Critical Siemens Sa
Publication of HK1004884A1 publication Critical patent/HK1004884A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
HK98104044A 1994-04-25 1998-05-11 Method of forming metallic conductive patterns on insulating substrates HK1004884A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4414374 1994-04-25
PCT/EP1995/001514 WO1995029573A1 (en) 1994-04-25 1995-04-21 Method of forming metallic conductive patterns on insulating substrates

Publications (1)

Publication Number Publication Date
HK1004884A1 true HK1004884A1 (en) 1998-12-11

Family

ID=6516365

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98104044A HK1004884A1 (en) 1994-04-25 1998-05-11 Method of forming metallic conductive patterns on insulating substrates

Country Status (4)

Country Link
EP (1) EP0757885B1 (en)
DE (1) DE59503175D1 (en)
HK (1) HK1004884A1 (en)
WO (1) WO1995029573A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10513314A (en) * 1995-11-24 1998-12-15 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ Method for selectively removing a metal layer from a non-metal substrate
CN1173614C (en) * 1997-03-11 2004-10-27 比利时西门子公司 Method for forming metal conductor models on electrically insulating supports
DE19841900A1 (en) * 1998-09-11 2000-03-30 Schott Glas Process for applying metallic conductor tracks as electrodes on a channel plate for large flat screens
ATE228753T1 (en) 1999-03-16 2002-12-15 Siemens Ag METHOD FOR MAKING THROUGH-CONTACT HOLES IN AN ELECTRICALLY INSULATING BASE MATERIAL PROVIDED WITH METAL LAYERS ON BOTH SIDES
DE19944908A1 (en) 1999-09-10 2001-04-12 Atotech Deutschland Gmbh Method of forming a conductor pattern on dielectric substrates
DE10011455B4 (en) * 2000-03-10 2005-12-08 Schott Ag Method for applying metallic conductor tracks as electrodes to a channel plate made of glass for large-surface flat screens
DE10112023A1 (en) 2001-03-07 2002-10-02 Atotech Deutschland Gmbh Method of forming a metal pattern on a dielectric substrate
DE102007005161B4 (en) 2007-01-29 2009-04-09 Nb Technologies Gmbh Process for the metallization of substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3362659D1 (en) * 1982-05-21 1986-04-30 Hewlett Packard Co Method of making printed circuits
DE3320183A1 (en) * 1983-06-03 1984-12-06 ANT Nachrichtentechnik GmbH, 7150 Backnang METHOD FOR PRODUCING PRINTED CIRCUITS
US4943346A (en) * 1988-09-29 1990-07-24 Siemens Aktiengesellschaft Method for manufacturing printed circuit boards
EP0370133A1 (en) * 1988-11-24 1990-05-30 Siemens Aktiengesellschaft Process for producing printed-circuit boards

Also Published As

Publication number Publication date
DE59503175D1 (en) 1998-09-17
EP0757885B1 (en) 1998-08-12
WO1995029573A1 (en) 1995-11-02
EP0757885A1 (en) 1997-02-12

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)