MX366581B - Cartucho de soldadura inteligente para la validacion automatica de conexion de soldadura. - Google Patents
Cartucho de soldadura inteligente para la validacion automatica de conexion de soldadura.Info
- Publication number
- MX366581B MX366581B MX2015017938A MX2015017938A MX366581B MX 366581 B MX366581 B MX 366581B MX 2015017938 A MX2015017938 A MX 2015017938A MX 2015017938 A MX2015017938 A MX 2015017938A MX 366581 B MX366581 B MX 366581B
- Authority
- MX
- Mexico
- Prior art keywords
- soldering
- imc
- thickness
- predetermined
- validation
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/03—Soldering irons; Bits electrically heated
- B23K3/033—Soldering irons; Bits electrically heated comprising means for controlling or selecting the temperature or power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/03—Soldering irons; Bits electrically heated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Se describe un cartucho o soldadura inteligente que incluye: un alojamiento; una punta de suelda; un calentador para calentar la punta de suelda; un dispositivo de almacenamiento para almacenar información respecto a las características del cartucho; un procesador para recuperar la información respecto a las características del cartucho, el monitoreo del nivel de energía distribuido a la punta de suelda para detectar la aparición de fase líquida en una unión de soldadura, la determinación de un espesor de un compuesto intermetálico IMC de la unión de soldadura utilizando algo de la información recuperada, la determinación de si el espesor del IMC está o no dentro de un intervalo predeterminado, y la generación de una señal de indicación que indica que es formada una conexión de unión de soldadura confiable cuando el espesor del IMC está dentro del intervalo predeterminado; y una interconexión para transmitir la señal de indicación.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/794,678 US9516762B2 (en) | 2014-08-04 | 2015-07-08 | Soldering iron with automatic soldering connection validation |
US14/966,975 US9327361B2 (en) | 2014-08-04 | 2015-12-11 | Intelligent soldering cartridge for automatic soldering connection validation |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2015017938A MX2015017938A (es) | 2017-01-09 |
MX366581B true MX366581B (es) | 2019-07-15 |
Family
ID=56763206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015017938A MX366581B (es) | 2015-07-08 | 2015-12-21 | Cartucho de soldadura inteligente para la validacion automatica de conexion de soldadura. |
Country Status (11)
Country | Link |
---|---|
EP (2) | EP3799979A1 (es) |
JP (1) | JP6029039B1 (es) |
KR (1) | KR101796364B1 (es) |
CN (2) | CN205519983U (es) |
AU (1) | AU2015275270B2 (es) |
BR (1) | BR102015032801A2 (es) |
CA (1) | CA2915654C (es) |
MX (1) | MX366581B (es) |
MY (1) | MY181855A (es) |
SG (1) | SG10201510623SA (es) |
TW (1) | TWI590905B (es) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2915654C (en) * | 2015-07-08 | 2018-05-01 | Delaware Capital Formation, Inc. | An intelligent soldering cartridge for automatic soldering connection validation |
WO2019031484A1 (ja) * | 2017-08-10 | 2019-02-14 | 白光株式会社 | はんだこて制御装置、カートリッジ、はんだこて管理システム |
JP2019034337A (ja) * | 2017-08-10 | 2019-03-07 | 白光株式会社 | はんだこて制御装置、カートリッジ、はんだこて管理システム |
CN110297013A (zh) | 2018-03-23 | 2019-10-01 | 台达电子工业股份有限公司 | 焊锡制程方法 |
TWI724288B (zh) * | 2018-03-23 | 2021-04-11 | 台達電子工業股份有限公司 | 焊錫製程方法 |
WO2019195249A1 (en) | 2018-04-02 | 2019-10-10 | Apex Brands, Inc. | Intelligent soldering tip |
JP6517412B1 (ja) * | 2018-07-12 | 2019-05-22 | 白光株式会社 | はんだこて制御装置 |
CN109202835B (zh) * | 2018-09-05 | 2023-06-06 | 江苏省特种设备安全监督检验研究院 | 检测开关盖焊条保温筒 |
CN111745249A (zh) * | 2019-03-26 | 2020-10-09 | Ok国际公司 | 可变温度控制的烙铁 |
CN113029063A (zh) * | 2021-02-04 | 2021-06-25 | 深圳市金致卓科技有限公司 | 一种pcba焊脚长度检测工具 |
CN115922021A (zh) * | 2021-08-12 | 2023-04-07 | 台达电子工业股份有限公司 | 自动焊锡加工系统及自动焊锡加工方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5014210A (en) * | 1989-03-06 | 1991-05-07 | Postlewait Lester B | Microprocessor controlled soldering station |
US5223689A (en) * | 1989-06-13 | 1993-06-29 | Metcal, Inc. | Profiles to insure proper heating function |
CA2018561C (en) * | 1989-06-13 | 1994-08-30 | Mark J. Cowell | Solder joint system |
DE4143545C2 (de) * | 1990-11-29 | 2002-09-05 | Matsushita Electric Ind Co Ltd | Verfahren zur Prüfung von Lötstellen |
JPH10137929A (ja) * | 1996-11-12 | 1998-05-26 | Hitachi Ltd | ろう付け方法、および、ろう付け装置 |
JP2984659B1 (ja) * | 1998-07-31 | 1999-11-29 | 米沢日本電気株式会社 | はんだ付け装置およびはんだ供給指示方法 |
US6563087B1 (en) * | 2001-11-14 | 2003-05-13 | Hakko Corporation | Automated soldering system |
SG121898A1 (en) * | 2004-10-06 | 2006-05-26 | Generic Power Pte Ltd | System for 2-D and 3-D vision inspection |
KR200426934Y1 (ko) * | 2006-05-30 | 2006-09-20 | 한국단자공업 주식회사 | 피씨비 납땜 검사 장치 및 이를 적용한 피씨비 납땜용 장치 |
JP3962782B1 (ja) * | 2006-08-11 | 2007-08-22 | 国立大学法人 岡山大学 | 半田付けの検査方法、半田接合方法、及び半田接合装置 |
JP4140860B1 (ja) * | 2007-06-18 | 2008-08-27 | 国立大学法人 岡山大学 | 半田付け方法及び半田付け装置 |
JP2009036736A (ja) * | 2007-08-04 | 2009-02-19 | Djtech Co Ltd | 印刷半田検査方法及び装置 |
JP2009092485A (ja) * | 2007-10-06 | 2009-04-30 | Djtech Co Ltd | 印刷半田検査装置 |
JP2009166062A (ja) * | 2008-01-12 | 2009-07-30 | Engineer Inc | 半田こての温度管理装置 |
JP2009257857A (ja) * | 2008-04-15 | 2009-11-05 | Yamatake Corp | 溶融温度判定装置 |
JP2010029888A (ja) * | 2008-07-25 | 2010-02-12 | Okayama Univ | 半田付け検査方法及び半田付け装置 |
JP5323522B2 (ja) * | 2009-02-06 | 2013-10-23 | 株式会社東海理化電機製作所 | 手作業はんだ付け工程の時間管理装置 |
KR101121994B1 (ko) * | 2010-02-02 | 2012-03-09 | 주식회사 고영테크놀러지 | 검사 프로그램의 생성 방법 |
KR101184875B1 (ko) * | 2011-06-28 | 2012-09-20 | 삼성전기주식회사 | 전기 접속단자 구조체 및 이의 제조방법 |
CN202555934U (zh) * | 2012-03-02 | 2012-11-28 | 廖怀宝 | 自动焊锡机 |
CN103551694B (zh) * | 2013-11-06 | 2015-06-24 | 常州天合光能有限公司 | 智能电烙铁 |
JP6423597B2 (ja) * | 2014-02-28 | 2018-11-14 | 白光株式会社 | 制御ユニット、管理装置及び給電制御装置 |
US9516762B2 (en) * | 2014-08-04 | 2016-12-06 | Ok International Inc. | Soldering iron with automatic soldering connection validation |
CA2915654C (en) * | 2015-07-08 | 2018-05-01 | Delaware Capital Formation, Inc. | An intelligent soldering cartridge for automatic soldering connection validation |
-
2015
- 2015-12-17 CA CA2915654A patent/CA2915654C/en active Active
- 2015-12-21 EP EP20208146.9A patent/EP3799979A1/en not_active Withdrawn
- 2015-12-21 EP EP15201706.7A patent/EP3115142B1/en active Active
- 2015-12-21 MX MX2015017938A patent/MX366581B/es active IP Right Grant
- 2015-12-22 AU AU2015275270A patent/AU2015275270B2/en active Active
- 2015-12-22 TW TW104143136A patent/TWI590905B/zh active
- 2015-12-23 SG SG10201510623SA patent/SG10201510623SA/en unknown
- 2015-12-28 JP JP2015257246A patent/JP6029039B1/ja active Active
- 2015-12-29 BR BR102015032801A patent/BR102015032801A2/pt active Search and Examination
- 2015-12-29 MY MYPI2015003060A patent/MY181855A/en unknown
- 2015-12-29 KR KR1020150188822A patent/KR101796364B1/ko active IP Right Grant
- 2015-12-30 CN CN201521130403.4U patent/CN205519983U/zh not_active Withdrawn - After Issue
- 2015-12-30 CN CN201511020954.XA patent/CN106334853B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP6029039B1 (ja) | 2016-11-24 |
CN205519983U (zh) | 2016-08-31 |
EP3115142A1 (en) | 2017-01-11 |
AU2015275270B2 (en) | 2017-03-16 |
BR102015032801A2 (pt) | 2017-01-24 |
TWI590905B (zh) | 2017-07-11 |
EP3799979A1 (en) | 2021-04-07 |
CA2915654A1 (en) | 2017-01-08 |
MX2015017938A (es) | 2017-01-09 |
EP3115142B1 (en) | 2023-08-09 |
JP2017019012A (ja) | 2017-01-26 |
KR20170007082A (ko) | 2017-01-18 |
CN106334853B (zh) | 2018-12-14 |
CN106334853A (zh) | 2017-01-18 |
SG10201510623SA (en) | 2017-02-27 |
CA2915654C (en) | 2018-05-01 |
KR101796364B1 (ko) | 2017-11-10 |
MY181855A (en) | 2021-01-11 |
AU2015275270A1 (en) | 2017-02-02 |
TW201701987A (zh) | 2017-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GB | Transfer or rights |
Owner name: OK INTERNATIONAL, INC. |
|
FG | Grant or registration |