MX363130B - Sistema de inspeccion y metodo para el analisis de defectos de conexiones de cable. - Google Patents
Sistema de inspeccion y metodo para el analisis de defectos de conexiones de cable.Info
- Publication number
- MX363130B MX363130B MX2016007707A MX2016007707A MX363130B MX 363130 B MX363130 B MX 363130B MX 2016007707 A MX2016007707 A MX 2016007707A MX 2016007707 A MX2016007707 A MX 2016007707A MX 363130 B MX363130 B MX 363130B
- Authority
- MX
- Mexico
- Prior art keywords
- line scan
- light
- slit
- scan camera
- product
- Prior art date
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/701—Line sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
- G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95661—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10024—Color image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10048—Infrared image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Quality & Reliability (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
La invención se refiere a un sistema de inspección (10) para el análisis de defectos de una conexión de cable (11) entre un sustrato (13) y un componente de semiconductor (15, 16) de un producto (12), el sistema de inspección que comprende un primer dispositivo de proyección (24), una cámara de exploración de línea (28) y un dispositivo de procesamiento, el primer dispositivo de proyección que tiene al menos un medio de proyección de hendidura (25), el medio de proyección de hendidura puede proyectar una hendidura de luz (33) sobre un cable (21 , 22) de la conexión del cable, la luz de la hendidura de luz se refleja por el cable en un plano de detección (39) de la cámara de exploración de línea que se extiende perpendicularmente, preferentemente ortogonalmente a una superficie de sustrato (14) que es detectable por medio de la cámara de exploración de línea, la información de imagen de análisis del producto que es derivable a partir de una pluralidad de información de imagen de exploración de línea de la cámara de exploración de línea por medio del dispositivo de procesamiento, en el que el medio de proyección de hendidura está dispuesto con relación a la cámara de exploración de línea de tal manera que la luz hendidura se puede proyectar sobre el producto a fin de extenderse dentro del plano de detección, el sistema de inspección que comprende un segundo dispositivo de proyección, el segundo dispositivo de proyección que tiene al menos un medio de iluminación (27), el medio de iluminación que puede proyectar la luz difusa sobre el producto, la luz difusa de la luz reflejada por el producto en el plano de detección es detectable por medio de la cámara de exploración lineal.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015109431.2A DE102015109431A1 (de) | 2015-06-12 | 2015-06-12 | Inspektionssystem und Verfahren zur Fehleranalyse von Drahtverbindungen |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2016007707A MX2016007707A (es) | 2017-01-09 |
MX363130B true MX363130B (es) | 2019-03-12 |
Family
ID=56557453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016007707A MX363130B (es) | 2015-06-12 | 2016-06-13 | Sistema de inspeccion y metodo para el analisis de defectos de conexiones de cable. |
Country Status (8)
Country | Link |
---|---|
US (1) | US10186025B2 (es) |
EP (1) | EP3104117B1 (es) |
CN (1) | CN106248695B (es) |
DE (1) | DE102015109431A1 (es) |
ES (1) | ES2770791T3 (es) |
MX (1) | MX363130B (es) |
MY (1) | MY187035A (es) |
SG (1) | SG10201604766SA (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3069575B1 (en) | 2013-11-14 | 2018-09-26 | Lifi Labs Inc. | Resettable lighting system and method |
EP3146254B1 (en) | 2014-05-22 | 2020-04-22 | Lifi Labs Inc. | Directional lighting system and method |
US10440794B2 (en) | 2016-11-02 | 2019-10-08 | LIFI Labs, Inc. | Lighting system and method |
NL2021022B1 (en) * | 2018-05-30 | 2019-12-10 | Seleggt Gmbh | Method for determining the gender of a chicken embryo |
CN111380869B (zh) * | 2018-12-28 | 2023-08-15 | 联策科技股份有限公司 | 具有高度信息的光学检测系统与方法 |
CN109632812A (zh) * | 2019-01-11 | 2019-04-16 | 英特尔产品(成都)有限公司 | 用于物体检查的光照设备 |
US11543362B2 (en) * | 2019-05-02 | 2023-01-03 | Asmpt Singapore Pte. Ltd. | Method for measuring the heights of wire interconnections |
CN112179920B (zh) * | 2020-11-29 | 2021-04-13 | 惠州高视科技有限公司 | 一种芯片焊线缺陷的检测方法及系统 |
Family Cites Families (28)
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US4585351A (en) * | 1983-09-20 | 1986-04-29 | At&T Technologies, Inc. | Apparatus for inspecting surface mounted components |
US5247344A (en) | 1988-10-03 | 1993-09-21 | Hughes Aircraft Company | Optical inspection system for solder joints and inspection method |
JP2867687B2 (ja) * | 1990-11-13 | 1999-03-08 | 松下電器産業株式会社 | 半田の外観検査方法 |
JPH05335735A (ja) * | 1992-06-03 | 1993-12-17 | Mitsubishi Electric Corp | レーザolb装置及び半導体装置の実装方法 |
DE4218971C2 (de) | 1992-06-10 | 1994-09-22 | Grecon Greten Gmbh & Co Kg | Verfahren zur Kalibrierung eines Bildverarbeitungssystems |
JP2720759B2 (ja) * | 1993-07-21 | 1998-03-04 | 日本電気株式会社 | ボンディングワイヤー外観自動検査装置 |
DE19609045C1 (de) * | 1996-03-08 | 1997-07-24 | Robert Prof Dr Ing Massen | Verfahren und Vorrichtung zur optischen Prüfung eines Holzprüflings |
EP0935135A1 (en) * | 1998-02-09 | 1999-08-11 | MV Research Limited | System for measuring solder bumps |
US7039228B1 (en) * | 1999-11-19 | 2006-05-02 | Rudolph Technologies, Inc. | System and method for three-dimensional surface inspection |
JP2001176907A (ja) * | 1999-12-16 | 2001-06-29 | Shinko Electric Ind Co Ltd | バンプ検査装置 |
DE10100892A1 (de) * | 2001-01-11 | 2002-07-25 | Bosch Gmbh Robert | Verfahren zur Inspektion von Bondverbindungen |
KR20030026839A (ko) | 2001-09-26 | 2003-04-03 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 화상처리를 이용한 검사대상물의 표면검사방법 및 그 장치 |
WO2003060424A1 (en) * | 2002-01-18 | 2003-07-24 | Mv Research Limited | A machine vision system |
DE10208978B4 (de) * | 2002-02-28 | 2005-06-23 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Bestimmung eines Höhenverlaufs einer Drahtverbindung |
JP4166587B2 (ja) * | 2003-01-24 | 2008-10-15 | 株式会社サキコーポレーション | 外観検査装置および体積検査方法 |
DE10319543B4 (de) * | 2003-04-30 | 2011-03-03 | Byk-Gardner Gmbh | Vorrichtung und Verfahren zur Bestimmung von Oberflächeneigenschaften |
US20050157920A1 (en) * | 2004-01-21 | 2005-07-21 | John Doherty | Machine vision system and method |
DE102005031490A1 (de) * | 2005-07-04 | 2007-02-01 | Massen Machine Vision Systems Gmbh | Kostengünstige multi-sensorielle Oberflächeninspektion |
WO2007054332A1 (de) * | 2005-11-10 | 2007-05-18 | OBE OHNMACHT & BAUMGäRTNER GMBH & CO. KG | Kamerachip, kamera und verfahren zur bildaufnahme |
US7564544B2 (en) * | 2006-03-22 | 2009-07-21 | 3i Systems Corporation | Method and system for inspecting surfaces with improved light efficiency |
EP2136178A1 (en) * | 2007-04-05 | 2009-12-23 | Nikon Corporation | Geometry measurement instrument and method for measuring geometry |
JP2009031150A (ja) * | 2007-07-27 | 2009-02-12 | Omron Corp | 三次元形状計測装置、三次元形状計測方法、三次元形状計測プログラム、および記録媒体 |
CZ2009133A3 (cs) | 2009-03-03 | 2009-07-08 | Witrins S.R.O. | Zarízení, zpusob merení vnejších rozmeru testovaného výrobku a použití tohoto zarízení |
US8144968B2 (en) * | 2009-01-12 | 2012-03-27 | Aceris 3D Inspection Inc. | Method and apparatus for scanning substrates |
CN102439708B (zh) * | 2009-02-06 | 2016-03-02 | 新加坡科技研究局 | 检查基板的接合结构的方法和接合结构检验设备 |
KR101819006B1 (ko) * | 2010-10-27 | 2018-01-17 | 삼성전자주식회사 | 광학 측정 장치 |
DE102012104282A1 (de) * | 2012-05-16 | 2013-11-21 | Isra Vision Ag | Verfahren und Vorrichtung zur Inspektion von Oberflächen eines untersuchten Objekts |
DE102012104745B4 (de) * | 2012-06-01 | 2015-03-19 | SmartRay GmbH | Prüfverfahren und hierzu geeigneter Prüfkopf |
-
2015
- 2015-06-12 DE DE102015109431.2A patent/DE102015109431A1/de not_active Withdrawn
-
2016
- 2016-06-09 EP EP16173747.3A patent/EP3104117B1/de active Active
- 2016-06-09 ES ES16173747T patent/ES2770791T3/es active Active
- 2016-06-10 SG SG10201604766SA patent/SG10201604766SA/en unknown
- 2016-06-10 MY MYPI2016001085A patent/MY187035A/en unknown
- 2016-06-12 CN CN201610407255.9A patent/CN106248695B/zh active Active
- 2016-06-13 US US15/180,837 patent/US10186025B2/en active Active
- 2016-06-13 MX MX2016007707A patent/MX363130B/es unknown
Also Published As
Publication number | Publication date |
---|---|
MY187035A (en) | 2021-08-27 |
EP3104117B1 (de) | 2019-11-06 |
CN106248695B (zh) | 2020-09-11 |
SG10201604766SA (en) | 2017-01-27 |
DE102015109431A1 (de) | 2016-12-15 |
CN106248695A (zh) | 2016-12-21 |
ES2770791T3 (es) | 2020-07-03 |
MX2016007707A (es) | 2017-01-09 |
US10186025B2 (en) | 2019-01-22 |
EP3104117A1 (de) | 2016-12-14 |
US20160364854A1 (en) | 2016-12-15 |
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