MX2022010302A - Aparato y metodo para transferir componentes electronicos desde un primer portador a un segundo portador. - Google Patents

Aparato y metodo para transferir componentes electronicos desde un primer portador a un segundo portador.

Info

Publication number
MX2022010302A
MX2022010302A MX2022010302A MX2022010302A MX2022010302A MX 2022010302 A MX2022010302 A MX 2022010302A MX 2022010302 A MX2022010302 A MX 2022010302A MX 2022010302 A MX2022010302 A MX 2022010302A MX 2022010302 A MX2022010302 A MX 2022010302A
Authority
MX
Mexico
Prior art keywords
carrier
receptacle
placement position
conveying direction
components
Prior art date
Application number
MX2022010302A
Other languages
English (en)
Inventor
Marcel Freimuth
Original Assignee
Muehlbauer Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer Gmbh & Co Kg filed Critical Muehlbauer Gmbh & Co Kg
Publication of MX2022010302A publication Critical patent/MX2022010302A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
    • B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
    • B31D1/02—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
    • B31D1/028—Applying RFID chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Intermediate Stations On Conveyors (AREA)

Abstract

El dispositivo divulgado aquí está diseñado para recibir el primer portador con un primer receptáculo; guiar el segundo portador a lo largo de su extensión longitudinal en una dirección de transporte del segundo portador con un segundo receptáculo; para recibir el primer portador con el primer receptáculo de tal manera que los componentes portados por él estén orientados hacia el segundo receptáculo, para separar los componentes en respuesta a la información señalada por una unidad de control del primer portador con un dispositivo de separación en contacto o sin contacto para transferirlos al segundo portador; transportar el segundo portador, en respuesta a la información señalada por la unidad de control, en su posición relativa a la posición de colocación por medio de un dispositivo de transporte adicional de tal manera que un subconjunto electrónico en el segundo portador alcance la posición de colocación en el segundo receptáculo que guía el segundo portador; teniendo el segundo receptáculo una superficie de contacto para el segundo portador que está curvada en la dirección de transporte del segundo portador; y comprendiendo el segundo receptáculo, al menos parcialmente, un segundo dispositivo de transporte que ocupa solo una parte del segundo receptáculo transversalmente a la dirección de transporte del segundo portador; en el área del segundo receptáculo, se proporciona y dispone una calefacción para actuar sobre el segundo portador con el fin de templarlo antes, en y/o después de la posición de depósito desde su lado opuesto al primer receptáculo.
MX2022010302A 2020-02-21 2021-02-19 Aparato y metodo para transferir componentes electronicos desde un primer portador a un segundo portador. MX2022010302A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020001439.9A DE102020001439B3 (de) 2020-02-21 2020-02-21 Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
PCT/EP2021/054115 WO2021165450A1 (de) 2020-02-21 2021-02-19 Vorrichtung und verfahren zum übertragen elektronischer bauteile von einem ersten zu einem zweiten träger

Publications (1)

Publication Number Publication Date
MX2022010302A true MX2022010302A (es) 2022-11-14

Family

ID=74673217

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022010302A MX2022010302A (es) 2020-02-21 2021-02-19 Aparato y metodo para transferir componentes electronicos desde un primer portador a un segundo portador.

Country Status (9)

Country Link
US (1) US20230056420A1 (es)
EP (1) EP4107776B1 (es)
CN (1) CN115191027A (es)
BR (1) BR112022016458A2 (es)
DE (1) DE102020001439B3 (es)
FI (1) FI4107776T3 (es)
MX (1) MX2022010302A (es)
TW (1) TWI771919B (es)
WO (1) WO2021165450A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020001439B3 (de) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
WO2023136725A1 (en) * 2022-01-17 2023-07-20 Morphotonics Holding B.V. Transfer process for micro elements

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
JPS53100765A (en) * 1977-02-15 1978-09-02 Toshiba Corp Production of semiconductor device
JPS596058B2 (ja) * 1978-11-21 1984-02-08 株式会社東芝 半導体装置の製造装置
DE3336606A1 (de) * 1983-10-07 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur mikropackherstellung
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
US4990051A (en) * 1987-09-28 1991-02-05 Kulicke And Soffa Industries, Inc. Pre-peel die ejector apparatus
JPH05267451A (ja) * 1992-03-19 1993-10-15 Fujitsu Miyagi Electron:Kk 半導体装置の製造方法
EP0565781B1 (de) * 1992-04-13 1995-11-29 Tresky Dr.Ing. Miroslav Ausstossvorrichtung zum Abtrennen eines Chips von einem adhäsiven Träger
JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
EP0949662A3 (en) * 1998-03-27 2001-08-01 Supersensor (Proprietary) Limited Die transfer method and system
DE19822512A1 (de) * 1998-05-19 1999-10-21 Siemens Ag Verfahren zum Vereinzeln und Positionieren von Halbleiter-Bauteilen
DE19840226B4 (de) * 1998-09-03 2006-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen eines Schaltungschips auf einen Träger
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
US6204092B1 (en) * 1999-04-13 2001-03-20 Lucent Technologies, Inc. Apparatus and method for transferring semiconductor die to a carrier
JP2002050670A (ja) * 2000-08-04 2002-02-15 Toshiba Corp ピックアップ装置及びピックアップ方法
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
JP3719182B2 (ja) * 2001-09-28 2005-11-24 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
US7147739B2 (en) * 2002-12-20 2006-12-12 Cree Inc. Systems for assembling components on submounts and methods therefor
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
DE10349847B3 (de) * 2003-10-25 2005-05-25 Mühlbauer Ag Positionierungsvorrichtung und -Verfahren für die Übertragung elektronischer Bauteile
US20060013680A1 (en) * 2004-07-16 2006-01-19 Tessera, Inc. Chip handling methods and apparatus
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
DE102005044866A1 (de) * 2005-09-20 2007-04-19 Siemens Ag Vorrichtung zur Positionsvermessung von elektrischen Bauelementen
DE102006025361A1 (de) * 2006-05-31 2007-12-06 Siemens Ag Ausstoßeinheit zum Abtrennen von Bauelementen aus einer im Wesentlichen ebenen Anordnung von Bauelementen
KR20070120319A (ko) 2006-06-19 2007-12-24 삼성전자주식회사 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법
JP2008084936A (ja) * 2006-09-26 2008-04-10 Toshiba Corp 半導体装置および半導体装置の製造方法
US7665204B2 (en) * 2006-10-16 2010-02-23 Asm Assembly Automation Ltd. Die detachment apparatus comprising pre-peeling structure
JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
DE102009020540B4 (de) * 2009-05-08 2012-06-21 Mühlbauer Ag Verfahren und Vorrichtung zum Herstellen einer elektronischen Baugruppe und mit dem Verfahren oder in der Vorrichtung hergestellte elektronische Baugruppe
JP2010161155A (ja) * 2009-01-07 2010-07-22 Canon Machinery Inc チップ転写方法およびチップ転写装置
CN102656679B (zh) * 2009-10-19 2016-10-26 万佳雷射有限公司 用于加工连续的多段柔性箔片的装置
JP6038035B2 (ja) * 2010-10-14 2016-12-07 ストラ エンソ オーワイジェイ 印刷導電性表面にチップを取り付ける方法及び装置
DE102011017218B4 (de) * 2011-04-15 2018-10-31 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten Träger zu einem zweiten Träger
DE102011104225B4 (de) * 2011-06-15 2017-08-24 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Positionieren eines elektronischen Bauteils und / oder eines Trägers relativ zu einer Ausstoßeinrichtung
DE102013010447A1 (de) * 2013-06-21 2014-12-24 Mühlbauer Ag Verfahren und Vorrichtung zur Herstellung eines Solarmodulstrangs und ein Solarmodulstrang mit flexiblen Solarzellen
WO2015085064A1 (en) * 2013-12-05 2015-06-11 Uniqarta, Inc. Electronic device incorporated into a sheet
DE102015013494B3 (de) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung
US10104784B2 (en) * 2015-11-06 2018-10-16 Nxp B.V. Method for making an electronic product with flexible substrate
DE202016004428U1 (de) * 2016-07-20 2017-10-23 Barry-Wehmiller Papersystems, Inc. Vorrichtung zum Aufbringen von Datenträgern auf eine Trägerbahn
DE102016009765B4 (de) * 2016-08-11 2018-07-05 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen eines elektronischen Bauteils von einem Träger zu einem Substrat
US10504767B2 (en) * 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
DE102018006771B4 (de) * 2018-08-27 2022-09-08 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
DE102018006760A1 (de) * 2018-08-27 2020-02-27 Mühlbauer Gmbh & Co. Kg Inspektion beim Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
US11062923B2 (en) * 2018-09-28 2021-07-13 Rohinni, LLC Apparatus to control transfer parameters during transfer of semiconductor devices
US11232968B2 (en) * 2018-09-28 2022-01-25 Rohinni, LLC Variable pitch multi-needle head for transfer of semiconductor devices
TWI686895B (zh) * 2019-04-19 2020-03-01 台灣愛司帝科技股份有限公司 晶片移轉機台
US11521887B2 (en) * 2019-12-18 2022-12-06 Seoul Viosys Co., Ltd. Method of transferring micro LED and micro LED transferring apparatus
DE102020001439B3 (de) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
TWI761895B (zh) * 2020-07-24 2022-04-21 錼創顯示科技股份有限公司 微型電子元件轉移設備以及微型電子元件轉移方法
US12020959B2 (en) * 2020-10-07 2024-06-25 Asmpt Singapore Pte. Ltd. Detape apparatus for an optical alignment machine

Also Published As

Publication number Publication date
EP4107776A1 (de) 2022-12-28
CN115191027A (zh) 2022-10-14
DE102020001439B3 (de) 2021-06-10
BR112022016458A2 (pt) 2022-10-04
WO2021165450A1 (de) 2021-08-26
TWI771919B (zh) 2022-07-21
EP4107776B1 (de) 2024-04-03
FI4107776T3 (fi) 2024-06-03
US20230056420A1 (en) 2023-02-23
TW202137378A (zh) 2021-10-01

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