MX2018002686A - Metodo de galvanizado o recubrimiento. - Google Patents

Metodo de galvanizado o recubrimiento.

Info

Publication number
MX2018002686A
MX2018002686A MX2018002686A MX2018002686A MX2018002686A MX 2018002686 A MX2018002686 A MX 2018002686A MX 2018002686 A MX2018002686 A MX 2018002686A MX 2018002686 A MX2018002686 A MX 2018002686A MX 2018002686 A MX2018002686 A MX 2018002686A
Authority
MX
Mexico
Prior art keywords
metal
plating solution
metals
plating
substrate
Prior art date
Application number
MX2018002686A
Other languages
English (en)
Inventor
Wang Yuxin
Chen Weiwei
Leng TAY See
wei Shanghai
Gao Wei
Original Assignee
Auckland Uniservices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auckland Uniservices Ltd filed Critical Auckland Uniservices Ltd
Publication of MX2018002686A publication Critical patent/MX2018002686A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

En las implementaciones de ejemplo, se describe un método para galvanizar un sustrato con un recubrimiento de matriz metálica que contiene dos metales. En un ejemplo, el método incluye proporcionar una solución de galvanizado que comprende iones de los dos metales, en donde una primera concentración de un primer metal de los dos metales y una segunda concentración del segundo metal de los dos metales son diferentes, en donde el primer metal comprende un metal de transición y el segundo metal comprende un metal o metaloide post-transición, que calienta la solución de galvanizado a una temperatura predefinida, insertando el sustrato como un cátodo y un ánodo en la solución de galvanizado, agitando a la solución de galvanizado y aplicando una corriente constante a la solución de galvanizado durante un período de tiempo predefinido a través de un suministro de energía de corriente constante acoplada al cátodo y el ánodo para formar el recubrimiento de matriz metálica sobre el sustrato, en donde el recubrimiento de matriz metálica contiene nanopartículas de un compuesto intermetálico del primer metal y el segundo metal o una aleación del primer metal y el segundo metal.
MX2018002686A 2015-09-02 2016-08-30 Metodo de galvanizado o recubrimiento. MX2018002686A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562213340P 2015-09-02 2015-09-02
PCT/NZ2016/050137 WO2017039460A1 (en) 2015-09-02 2016-08-30 A plating or coating method

Publications (1)

Publication Number Publication Date
MX2018002686A true MX2018002686A (es) 2018-08-01

Family

ID=58188261

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018002686A MX2018002686A (es) 2015-09-02 2016-08-30 Metodo de galvanizado o recubrimiento.

Country Status (4)

Country Link
CN (1) CN108350591B (es)
AU (1) AU2016316565B2 (es)
MX (1) MX2018002686A (es)
WO (1) WO2017039460A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018126174B3 (de) * 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung
US11434577B2 (en) * 2019-10-17 2022-09-06 Rohm And Haas Electronic Materials Llc Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099713A (en) * 1996-11-25 2000-08-08 C. Uyemura & Co., Ltd. Tin-silver alloy electroplating bath and tin-silver alloy electroplating process
US6387229B1 (en) * 1999-05-07 2002-05-14 Enthone, Inc. Alloy plating
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
DE10158227A1 (de) * 2001-11-15 2003-06-05 Siemens Ag Elektrolysebad zum galvanischen Abscheiden von Silber-Zinn-Legierungen
CN1266316C (zh) * 2003-07-11 2006-07-26 中国科学院金属研究所 热生长Al2O3膜型M－A1纳米复合镀层及制备方法和应用
JP2007254860A (ja) * 2006-03-24 2007-10-04 Fujitsu Ltd めっき膜及びその形成方法
US7521128B2 (en) * 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
CN100519842C (zh) * 2006-06-23 2009-07-29 中国科学院金属研究所 一种γ＇-Ni3Al/γ-Ni涂层的制备方法
US8585885B2 (en) * 2007-08-28 2013-11-19 Rohm And Haas Electronic Materials Llc Electrochemically deposited indium composites
JP6088295B2 (ja) * 2013-03-07 2017-03-01 ローム・アンド・ハース電子材料株式会社 スズ合金めっき液

Also Published As

Publication number Publication date
WO2017039460A1 (en) 2017-03-09
AU2016316565A1 (en) 2018-03-22
CN108350591B (zh) 2021-05-25
CN108350591A (zh) 2018-07-31
AU2016316565B2 (en) 2022-06-23

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