MX2009007512A - Metodo para revestir un substrato, equipo para implementar el metodo y dispositivo de suministro de metal para este equipo. - Google Patents
Metodo para revestir un substrato, equipo para implementar el metodo y dispositivo de suministro de metal para este equipo.Info
- Publication number
- MX2009007512A MX2009007512A MX2009007512A MX2009007512A MX2009007512A MX 2009007512 A MX2009007512 A MX 2009007512A MX 2009007512 A MX2009007512 A MX 2009007512A MX 2009007512 A MX2009007512 A MX 2009007512A MX 2009007512 A MX2009007512 A MX 2009007512A
- Authority
- MX
- Mexico
- Prior art keywords
- equipment
- substrate
- coating
- metal
- implementing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3457—Sputtering using other particles than noble gas ions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
La invención se refiere a un método para revestir al menos una superficie de un substrato que avanza mediante la evaporación al vacío de una capa de metal o aleación de metales que puede ser sublimada, en donde el metal o aleación de metales se proporciona opuesto a la superficie del substrato en forma de por lo menos dos lingotes en contacto uno con otro, la superficie de los lingotes siendo orientada hacia la superficie del substrato que está siendo mantenida paralela al substrato a una distancia constante del mismo durante el proceso de revestimiento; la invención se refiere también a un equipo de revestimiento para implementar el método y a un dispositivo de suministro de metal (1) para este equipo.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07290054A EP1947210A1 (fr) | 2007-01-16 | 2007-01-16 | Procede de revetement d'un substrat, installation de mise en oeuvre du procede et dispositif d'alimentation en metal d'une telle installation |
PCT/FR2008/000046 WO2008107538A2 (fr) | 2007-01-16 | 2008-01-16 | Procédé de revêtement d'un substrat, installation de mise en oeuvre du procédé et dispositif d'alimentation en métal d'une telle installation |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2009007512A true MX2009007512A (es) | 2009-08-13 |
Family
ID=38118569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2009007512A MX2009007512A (es) | 2007-01-16 | 2008-01-16 | Metodo para revestir un substrato, equipo para implementar el metodo y dispositivo de suministro de metal para este equipo. |
Country Status (17)
Country | Link |
---|---|
US (1) | US9051642B2 (es) |
EP (2) | EP1947210A1 (es) |
JP (1) | JP5276013B2 (es) |
KR (1) | KR101472605B1 (es) |
CN (1) | CN101622371B (es) |
BR (1) | BRPI0806610B8 (es) |
CA (1) | CA2675271C (es) |
ES (1) | ES2730837T3 (es) |
HU (1) | HUE043907T2 (es) |
MA (1) | MA31095B1 (es) |
MX (1) | MX2009007512A (es) |
PL (1) | PL2111477T3 (es) |
RU (1) | RU2458180C2 (es) |
TR (1) | TR201908607T4 (es) |
UA (1) | UA101607C2 (es) |
WO (1) | WO2008107538A2 (es) |
ZA (1) | ZA200904774B (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017017484A1 (en) * | 2015-07-30 | 2017-02-02 | Arcelormittal | Method for the manufacture of a hardened part which does not have lme issues |
CN106399945B (zh) * | 2016-09-30 | 2020-09-18 | 中国科学院合肥物质科学研究院 | 一种生物多孔镁表面生长锌合金镀层的制备方法 |
CN111934645B (zh) * | 2020-08-13 | 2023-03-24 | 厦门市三安集成电路有限公司 | 铝铜合金膜层的制备方法、声表面波滤波器以及双工器 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3020177A (en) * | 1959-05-13 | 1962-02-06 | Continental Can Co | Art of vaporizing materials |
US3329524A (en) * | 1963-06-12 | 1967-07-04 | Temescal Metallurgical Corp | Centrifugal-type vapor source |
JPS60221566A (ja) * | 1984-04-18 | 1985-11-06 | Agency Of Ind Science & Technol | 薄膜形成装置 |
JPH0740148B2 (ja) | 1984-12-20 | 1995-05-01 | キヤノン株式会社 | 静電荷像現像用正荷電性非磁性トナー |
JPS61147260U (es) * | 1985-02-28 | 1986-09-11 | ||
JPS61263008A (ja) | 1985-05-16 | 1986-11-21 | 大阪特殊合金株式会社 | 透明導電膜の製造方法及びその装置 |
JPS62238358A (ja) * | 1986-04-10 | 1987-10-19 | Nippon Kokan Kk <Nkk> | メツキ槽内へのインゴツト供給方法 |
JPS6350472A (ja) * | 1986-08-19 | 1988-03-03 | Hitachi Maxell Ltd | 真空蒸着装置 |
JPS6473074A (en) * | 1987-09-16 | 1989-03-17 | Matsushita Electric Ind Co Ltd | Sputtering device |
US5230923A (en) * | 1987-12-17 | 1993-07-27 | Toyo Ink Manufacturing Co., Ltd. | Process and apparatus for the substantially continuous manufacture of a silicon oxide deposition film on a flexible plastic film |
US5135817A (en) * | 1988-07-06 | 1992-08-04 | Kabushiki Kaisha Kobe Seiko Sho | Zn-Mg alloy vapor deposition plated metals of high corrosion resistance, as well as method of producing them |
JPH05179424A (ja) | 1991-12-26 | 1993-07-20 | Nisshin Steel Co Ltd | 表裏異種めっき鋼板 |
JP3060710B2 (ja) | 1992-03-11 | 2000-07-10 | 住友電装株式会社 | 電気接点用材料の製造方法および製造装置 |
US5962923A (en) * | 1995-08-07 | 1999-10-05 | Applied Materials, Inc. | Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches |
BE1009838A3 (fr) | 1995-12-20 | 1997-10-07 | Cockerill Rech & Dev | Procede et dispositif pour la formation d'un revetement sur un substrat. |
EP0794266B1 (de) * | 1996-03-06 | 2000-12-06 | Alusuisse Technology & Management AG | Vorrichtung zum Beschichten einer Substratfläche |
CN1074689C (zh) | 1996-04-04 | 2001-11-14 | E·O·帕通电子焊接研究院电子束工艺国际中心 | 基体上制备有跨厚度化学组成和结构梯度并陶瓷外层方法 |
US5983976A (en) * | 1998-03-31 | 1999-11-16 | Takata Corporation | Method and apparatus for manufacturing metallic parts by fine die casting |
JP2001207255A (ja) | 2000-01-27 | 2001-07-31 | Akihisa Inoue | マグネシウム合金及びその製造装置ならびにその製造方法 |
US7062348B1 (en) * | 2000-07-13 | 2006-06-13 | The Extreme Ultaviolet Lithography Llc | Dynamic mask for producing uniform or graded-thickness thin films |
CN1226447C (zh) | 2003-08-26 | 2005-11-09 | 孙伟成 | 一种泡沫铝卷毯的生产装置及其制备方法 |
US6923868B2 (en) * | 2003-09-23 | 2005-08-02 | Gba S.A. | Installation for electron-ray coatication of coatings |
EP1518941A1 (en) | 2003-09-24 | 2005-03-30 | Sidmar N.V. | A method and apparatus for the production of metal coated steel products |
JP4475968B2 (ja) | 2004-01-29 | 2010-06-09 | 三菱重工業株式会社 | 真空蒸着機 |
US20050244580A1 (en) * | 2004-04-30 | 2005-11-03 | Eastman Kodak Company | Deposition apparatus for temperature sensitive materials |
UA17473U (en) * | 2006-04-25 | 2006-09-15 | Andrii Volodymyrovych Pantus | Method for stereotopometric assessment of face proportionality |
-
2007
- 2007-01-16 EP EP07290054A patent/EP1947210A1/fr not_active Withdrawn
-
2008
- 2008-01-16 HU HUE08761766A patent/HUE043907T2/hu unknown
- 2008-01-16 UA UAA200908469A patent/UA101607C2/ru unknown
- 2008-01-16 ES ES08761766T patent/ES2730837T3/es active Active
- 2008-01-16 WO PCT/FR2008/000046 patent/WO2008107538A2/fr active Application Filing
- 2008-01-16 US US12/523,211 patent/US9051642B2/en active Active
- 2008-01-16 RU RU2009131034/02A patent/RU2458180C2/ru active
- 2008-01-16 MX MX2009007512A patent/MX2009007512A/es active IP Right Grant
- 2008-01-16 JP JP2009545971A patent/JP5276013B2/ja active Active
- 2008-01-16 PL PL08761766T patent/PL2111477T3/pl unknown
- 2008-01-16 CA CA2675271A patent/CA2675271C/fr active Active
- 2008-01-16 KR KR1020097014753A patent/KR101472605B1/ko active IP Right Grant
- 2008-01-16 EP EP08761766.8A patent/EP2111477B1/fr active Active
- 2008-01-16 BR BRPI0806610A patent/BRPI0806610B8/pt active IP Right Grant
- 2008-01-16 TR TR2019/08607T patent/TR201908607T4/tr unknown
- 2008-01-16 CN CN200880005583XA patent/CN101622371B/zh active Active
-
2009
- 2009-07-08 ZA ZA200904774A patent/ZA200904774B/xx unknown
- 2009-07-15 MA MA32092A patent/MA31095B1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
UA101607C2 (ru) | 2013-04-25 |
PL2111477T3 (pl) | 2019-09-30 |
BRPI0806610B1 (pt) | 2023-09-26 |
CN101622371B (zh) | 2011-09-07 |
EP2111477A2 (fr) | 2009-10-28 |
CN101622371A (zh) | 2010-01-06 |
BRPI0806610B8 (pt) | 2024-01-09 |
EP2111477B1 (fr) | 2019-03-13 |
ZA200904774B (en) | 2010-04-28 |
CA2675271A1 (fr) | 2008-09-12 |
HUE043907T2 (hu) | 2019-09-30 |
RU2458180C2 (ru) | 2012-08-10 |
WO2008107538A3 (fr) | 2008-10-30 |
KR20090101461A (ko) | 2009-09-28 |
TR201908607T4 (tr) | 2019-07-22 |
US20100068412A1 (en) | 2010-03-18 |
EP1947210A1 (fr) | 2008-07-23 |
MA31095B1 (fr) | 2010-01-04 |
KR101472605B1 (ko) | 2014-12-15 |
RU2009131034A (ru) | 2011-02-27 |
ES2730837T3 (es) | 2019-11-12 |
JP2010515830A (ja) | 2010-05-13 |
CA2675271C (fr) | 2012-04-10 |
US9051642B2 (en) | 2015-06-09 |
BRPI0806610A2 (pt) | 2011-09-20 |
WO2008107538A2 (fr) | 2008-09-12 |
JP5276013B2 (ja) | 2013-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |