MX171814B - Montaje para la disipacion de energia termica contenida en un circuito electrico - Google Patents

Montaje para la disipacion de energia termica contenida en un circuito electrico

Info

Publication number
MX171814B
MX171814B MX025533A MX2553391A MX171814B MX 171814 B MX171814 B MX 171814B MX 025533 A MX025533 A MX 025533A MX 2553391 A MX2553391 A MX 2553391A MX 171814 B MX171814 B MX 171814B
Authority
MX
Mexico
Prior art keywords
electrical circuit
housing
support
assembly
thermal energy
Prior art date
Application number
MX025533A
Other languages
English (en)
Inventor
Michael G Galich
Dale G Johnson
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of MX171814B publication Critical patent/MX171814B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La presente invención se refiere a un montaje para disipar la energía térmica contenida en un circuito eléctrico colocado sobre un tablero de circuito eléctrico, y que tiene al menos un elemento de circuito, el montaje está caracterizado porque comprende: medios para formar un alojamiento que tienen al menos una cara superficial, convectiva, para disipar el calor transportado por conducción y convección al mismo; medios separables del alojamiento, formados por los medios para disipar el calor, para colocar el alojamiento en una posición próxima al elemento de circuito, del circuito eléctrico, los medios para el posicionamiento tienen al menos un miembro de apoyo formado integralmente con los mismos, para fijar los medios para el posicionamiento al tablero del circuito eléctrico por medio de esto, y los medios para el posicionamiento tienen además medios para ejercer una fuerza elástica de retención, formando al menos un elemento elástico, en donde el al menos un elemento de resorte sobresale desde una superficie de los medios para posicionamiento y se acopla con el alojamiento reteniendo por medio de este al alojamiento, en la posición próxima al elemento de circuito; y medios que forman una pieza de fijación que tiene una cara superficial de la misma colocada en una relación enfrentada con una cara superficial correspondiente del elemento de circuito, para soportar el elemento de circuito, del circuito eléctrico, contra la misma, los medios para el soporte tienen al menos un elemento de apoyo formado integralmente con los mismos, para fijar los medios para el soporte al tablero de circuito eléctrico por medio de este.
MX025533A 1990-04-30 1991-04-26 Montaje para la disipacion de energia termica contenida en un circuito electrico MX171814B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51684390A 1990-04-30 1990-04-30

Publications (1)

Publication Number Publication Date
MX171814B true MX171814B (es) 1993-11-16

Family

ID=24057315

Family Applications (1)

Application Number Title Priority Date Filing Date
MX025533A MX171814B (es) 1990-04-30 1991-04-26 Montaje para la disipacion de energia termica contenida en un circuito electrico

Country Status (5)

Country Link
US (1) US5122480A (es)
AR (1) AR244465A1 (es)
CA (1) CA2062803C (es)
MX (1) MX171814B (es)
WO (1) WO1991017567A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920984A (en) * 1993-12-10 1999-07-13 Ericsson Ge Mobile Communications Inc. Method for the suppression of electromagnetic interference in an electronic system
US5731955A (en) * 1996-02-05 1998-03-24 Ford Motor Company Spring clip for electronics assembly
US6266244B1 (en) * 1999-10-25 2001-07-24 Harman International Industries Incorporated Mounting method and apparatus for electrical components
US6997748B1 (en) * 2005-03-07 2006-02-14 Cheng Uei Precision Industry Co., Ltd. Shielded shell for electronic connector
US20090161318A1 (en) * 2007-12-19 2009-06-25 Dialogic Corporation Thermal management systems and methods
CN101819455A (zh) * 2009-02-27 2010-09-01 鸿富锦精密工业（深圳）有限公司 主板散热器
TWI661755B (zh) * 2017-10-13 2019-06-01 和碩聯合科技股份有限公司 設於電路板上的固定裝置及電路板與被固定物的固定方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1534883A (en) * 1976-10-25 1978-12-06 Redpoint Ltd Socket and heat sink for an electronic component
US4481525A (en) * 1982-08-12 1984-11-06 Anthony D. Calabro Heat dissipator for integrated circuit chips
US4521828A (en) * 1982-12-23 1985-06-04 At&T Technologies, Inc. Component module for piggyback mounting on a circuit package having dual-in-line leads
US4599680A (en) * 1983-09-26 1986-07-08 Southwest Research Institute Packaging arrangement for spacecraft computer
US4537246A (en) * 1983-12-09 1985-08-27 Conver Corporation Vertical heat sink
US4605058A (en) * 1985-04-01 1986-08-12 The Staver Company, Inc. Heat dissipating retainer for electronic package
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US4710852A (en) * 1986-09-26 1987-12-01 General Motors Corporation Spring retainer for encapsulated semiconductor device
US4922601A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Method of making a heat sink for electrical components
US5019942A (en) * 1987-11-30 1991-05-28 Thermalloy Incorporated Insulating apparatus for electronic device assemblies
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors

Also Published As

Publication number Publication date
CA2062803A1 (en) 1991-10-31
AR244465A1 (es) 1993-10-29
WO1991017567A1 (en) 1991-11-14
US5122480A (en) 1992-06-16
CA2062803C (en) 1996-06-18

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