MX167979B - Estructura semiconductora que tiene pelicula resistente a particulas alfa y metodo para elaborar la misma - Google Patents

Estructura semiconductora que tiene pelicula resistente a particulas alfa y metodo para elaborar la misma

Info

Publication number
MX167979B
MX167979B MX203741A MX20374184A MX167979B MX 167979 B MX167979 B MX 167979B MX 203741 A MX203741 A MX 203741A MX 20374184 A MX20374184 A MX 20374184A MX 167979 B MX167979 B MX 167979B
Authority
MX
Mexico
Prior art keywords
prepare
same
resistant film
alpha particle
semiconductive structure
Prior art date
Application number
MX203741A
Other languages
English (en)
Inventor
Michael Brueggeman
James Clark
William Phy
Original Assignee
Fairchild Camera Instr Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera Instr Co filed Critical Fairchild Camera Instr Co
Publication of MX167979B publication Critical patent/MX167979B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

La presente invención se refiere a un método para elaborar una estructura semiconductora, que comprende los pasos de: proporcionar una oblea semiconductora que incluye una pluralidad de circuitos integrados en la misma, la oblea teniendo un par de superficies principales opuestas, una de las superficies incluyendo una pluralidad de regiones de dispositivo que se someten a degradación mediante partículas alfa y caracterizado por el paso de: aplicar una película resistente a partículas alfa, preformada a las predeterminadas de las regiones de dispositivo.
MX203741A 1984-02-09 1984-12-14 Estructura semiconductora que tiene pelicula resistente a particulas alfa y metodo para elaborar la misma MX167979B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57840884A 1984-02-09 1984-02-09

Publications (1)

Publication Number Publication Date
MX167979B true MX167979B (es) 1993-04-26

Family

ID=24312754

Family Applications (1)

Application Number Title Priority Date Filing Date
MX203741A MX167979B (es) 1984-02-09 1984-12-14 Estructura semiconductora que tiene pelicula resistente a particulas alfa y metodo para elaborar la misma

Country Status (7)

Country Link
EP (1) EP0152334B1 (es)
JP (1) JPS60183750A (es)
KR (1) KR920001026B1 (es)
CA (1) CA1229932A (es)
DE (1) DE3572258D1 (es)
MX (1) MX167979B (es)
PH (1) PH22133A (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2562163B2 (ja) * 1986-09-26 1996-12-11 ゼネラル・エレクトリック・カンパニイ 少なくとも１つの半導体チップ装置の表面に重合体フィルムを結合する方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
EP0028490B1 (en) * 1979-11-02 1983-12-21 BURROUGHS CORPORATION (a Michigan corporation) Integrated circuit with alpha radiation shielding means
JPS577144A (en) * 1980-06-17 1982-01-14 Fujitsu Ltd Semiconductor device
JPS5748251A (en) * 1980-09-04 1982-03-19 Mitsubishi Electric Corp Semiconductor device
JPS57120355A (en) * 1981-01-20 1982-07-27 Toshiba Corp Manufacture of semiconductor element
US4388132A (en) * 1981-06-01 1983-06-14 Burroughs Corporation Method of attaching a protective film to an integrated circuit

Also Published As

Publication number Publication date
PH22133A (en) 1988-06-01
EP0152334A3 (en) 1986-02-05
KR850006253A (ko) 1985-10-02
EP0152334A2 (en) 1985-08-21
CA1229932A (en) 1987-12-01
JPS60183750A (ja) 1985-09-19
EP0152334B1 (en) 1989-08-09
KR920001026B1 (ko) 1992-02-01
DE3572258D1 (en) 1989-09-14

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