MD2912F1 - Procedeu de aplicare a acoperirii ce contine bor - Google Patents
Procedeu de aplicare a acoperirii ce contine bor Download PDFInfo
- Publication number
- MD2912F1 MD2912F1 MDA20040213A MD20040213A MD2912F1 MD 2912 F1 MD2912 F1 MD 2912F1 MD A20040213 A MDA20040213 A MD A20040213A MD 20040213 A MD20040213 A MD 20040213A MD 2912 F1 MD2912 F1 MD 2912F1
- Authority
- MD
- Moldova
- Prior art keywords
- sulphate
- application
- solution
- boron
- thermal treatment
- Prior art date
Links
- 238000007747 plating Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052796 boron Inorganic materials 0.000 title abstract 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 abstract 2
- 238000007669 thermal treatment Methods 0.000 abstract 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 239000000908 ammonium hydroxide Substances 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 abstract 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 abstract 1
- 235000011180 diphosphates Nutrition 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Inventia se refera la procedeele de aplicare fara curent a acoperirilor metalice functionale si poate fi utilizata in industria radiotehnica si electronica.Procedeul de aplicare a acoperirii ce contine bor include depunerea acoperirii la temperaturi ridicate din solutie ce contine sulfat de nichel, dimetilaminoboran, pirofosfat de caliu si hidroxid de amoniu si prelucrarea termica ulterioara, totodata solutia contine suplimentar sulfat de cupru, acid malonic si clorura de plumb in urmatorul raport al componentelor, g/l:sulfat de nichel 20,0...25,0sulfat de cupru 5,0...10,0pirofosfat de caliu 40,0...45,0acid malonic 30,0...40,0dimetilaminoboran 1,5...2,5clorura de plumb 0,005...0,010hidroxid de amoniu (25%) pana la pH 10,3...10,5,depunerea se efectueaza la temperatura de 70...75°C, iar prelucrarea termica ulterioara la 180...250°C timp de 40...80 minute.Rezultatul inventiei consta in majorarea electroconductibilitatii si a capacitatii de lipire
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MDA20040213A MD2912G2 (ro) | 2004-09-08 | 2004-09-08 | Procedeu de aplicare a acoperirii ce contine bor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MDA20040213A MD2912G2 (ro) | 2004-09-08 | 2004-09-08 | Procedeu de aplicare a acoperirii ce contine bor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MD2912F1 true MD2912F1 (ro) | 2005-11-30 |
| MD2912G2 MD2912G2 (ro) | 2006-06-30 |
Family
ID=35450577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MDA20040213A MD2912G2 (ro) | 2004-09-08 | 2004-09-08 | Procedeu de aplicare a acoperirii ce contine bor |
Country Status (1)
| Country | Link |
|---|---|
| MD (1) | MD2912G2 (ro) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MD4087C1 (ro) * | 2010-02-10 | 2011-08-31 | Государственный Университет Молд0 | Procedeu chimico-catalitic de depunere a acoperirilor metalice |
-
2004
- 2004-09-08 MD MDA20040213A patent/MD2912G2/ro not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| MD2912G2 (ro) | 2006-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI457462B (zh) | 無電式鍍金浴，無電式鍍金方法及電子零件 | |
| TWI572742B (zh) | Reduction Electroless Silver Plating Solution and Reduced Electroless Silver Plating Method | |
| KR20160140609A (ko) | 비전도성 플라스틱 표면들을 금속화하기 위한 조성 및 프로세스 | |
| CN105350035A (zh) | 有机胺体系无氰电镀金镀液及方法 | |
| JP2005336614A (ja) | プラスチック表面をめっきするための方法 | |
| CA2875323C (en) | Process for metallizing nonconductive plastic surfaces | |
| CN110607540B (zh) | 锌-镍-微纳米陶瓷复合膜层及其低电流密度下制备方法 | |
| CN104120470A (zh) | 钢铁件及锌合金压铸件无氰一价铜预浸铜方法 | |
| JPS62124280A (ja) | 無電解パラジウムメツキ液 | |
| CA2893664C (en) | Process for metallizing nonconductive plastic surfaces | |
| CN102115885B (zh) | 一种对铝合金零件进行无油自润滑镀层处理的工艺 | |
| US4474838A (en) | Electroless direct deposition of gold on metallized ceramics | |
| NO20072917L (no) | Autokatalytisk fremgangsmate | |
| MD2912F1 (ro) | Procedeu de aplicare a acoperirii ce contine bor | |
| CN113493907B (zh) | 钯镀液及镀覆方法 | |
| JP2018529847A (ja) | 金メッキ溶液 | |
| JPH0734254A (ja) | アルミニウム系材料への無電解めっき方法 | |
| ATE355399T1 (de) | Verfahren zur stromlosen metallabscheidung und vorrichtung zur stromlosen metallabscheidung | |
| CN113816517A (zh) | 一种自催化还原化学镀镍废液的资源化回收方法 | |
| JP5550086B1 (ja) | 金めっき用ノンシアン金塩の製造方法 | |
| JP3677617B2 (ja) | 無電解金めっき液 | |
| CN1876891A (zh) | 使不导电基底直接金属化的方法 | |
| JP2002285377A5 (ro) | ||
| CN105455321B (zh) | 一种锌合金拉链链齿 | |
| TW200632135A (en) | Controlled electroless plating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG4A | Patent for invention issued | ||
| KA4A | Patent for invention lapsed due to non-payment of fees (with right of restoration) | ||
| MM4A | Patent for invention definitely lapsed due to non-payment of fees |