MD2912G2 - Procedeu de aplicare a acoperirii ce contine bor - Google Patents
Procedeu de aplicare a acoperirii ce contine bor Download PDFInfo
- Publication number
- MD2912G2 MD2912G2 MDA20040213A MD20040213A MD2912G2 MD 2912 G2 MD2912 G2 MD 2912G2 MD A20040213 A MDA20040213 A MD A20040213A MD 20040213 A MD20040213 A MD 20040213A MD 2912 G2 MD2912 G2 MD 2912G2
- Authority
- MD
- Moldova
- Prior art keywords
- application
- boron
- thermal treatment
- plating
- subsequent thermal
- Prior art date
Links
- 238000007747 plating Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052796 boron Inorganic materials 0.000 title abstract 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 238000007669 thermal treatment Methods 0.000 abstract 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 1
- 239000000908 ammonium hydroxide Substances 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 abstract 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 abstract 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Invenţia se referă la procedeele de aplicare fără curent a acoperirilor metalice funcţionale şi poate fi utilizată în industria radiotehnică şi electronică.Procedeul de aplicare a acoperirii ce conţine bor include depunerea acoperirii la temperaturi ridicate din soluţie ce conţine sulfat de nichel, dimetilaminoboran, pirofosfat de caliu şi hidroxid de amoniu şi prelucrarea termică ulterioară, totodată soluţia conţine suplimentar sulfat de cupru, acid malonic şi clorură de plumb în următorul raport al componentelor, g/l:depunerea se efectuează la temperatura de 70…75°C, iar prelucrarea termică ulterioară la 180…250°C timp de 40…80 minute.Rezultatul invenţiei constă în majorarea electroconductibilităţii şi a capacităţii de lipire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MDA20040213A MD2912G2 (ro) | 2004-09-08 | 2004-09-08 | Procedeu de aplicare a acoperirii ce contine bor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MDA20040213A MD2912G2 (ro) | 2004-09-08 | 2004-09-08 | Procedeu de aplicare a acoperirii ce contine bor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MD2912F1 MD2912F1 (ro) | 2005-11-30 |
| MD2912G2 true MD2912G2 (ro) | 2006-06-30 |
Family
ID=35450577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MDA20040213A MD2912G2 (ro) | 2004-09-08 | 2004-09-08 | Procedeu de aplicare a acoperirii ce contine bor |
Country Status (1)
| Country | Link |
|---|---|
| MD (1) | MD2912G2 (ro) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MD4087C1 (ro) * | 2010-02-10 | 2011-08-31 | Государственный Университет Молд0 | Procedeu chimico-catalitic de depunere a acoperirilor metalice |
-
2004
- 2004-09-08 MD MDA20040213A patent/MD2912G2/ro not_active IP Right Cessation
Non-Patent Citations (3)
| Title |
|---|
| Справочник Гальванотехника, Москва, Металлургия, 1987, с. 382-394 * |
| Справочник Гальванотехника. Москва, Металлургия, 1987, с. 382-394 * |
| Шалкаус М., Вашкялис А. Химическая металлизация пластмасс. Ленинград, Химия, 1972, с. 119-123 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MD4087C1 (ro) * | 2010-02-10 | 2011-08-31 | Государственный Университет Молд0 | Procedeu chimico-catalitic de depunere a acoperirilor metalice |
Also Published As
| Publication number | Publication date |
|---|---|
| MD2912F1 (ro) | 2005-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI457462B (zh) | 無電式鍍金浴，無電式鍍金方法及電子零件 | |
| MX2013001838A (es) | Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos | |
| CN102560571B (zh) | 无氰镀银稳定电镀液、制备方法及其镀银的方法 | |
| KR20160140609A (ko) | 비전도성 플라스틱 표면들을 금속화하기 위한 조성 및 프로세스 | |
| CN104120470B (zh) | 钢铁件或锌合金压铸件无氰一价铜预浸铜方法 | |
| TWI567234B (zh) | A reduction type electroless gold plating solution and an electroless gold plating method using the gold plating solution | |
| CA2875323C (en) | Process for metallizing nonconductive plastic surfaces | |
| CN102115885B (zh) | 一种对铝合金零件进行无油自润滑镀层处理的工艺 | |
| NO20072917L (no) | Autokatalytisk fremgangsmate | |
| JPS62124280A (ja) | 無電解パラジウムメツキ液 | |
| US4474838A (en) | Electroless direct deposition of gold on metallized ceramics | |
| MD2912G2 (ro) | Procedeu de aplicare a acoperirii ce contine bor | |
| EP2928984A1 (en) | Process for metallizing nonconductive plastic surfaces | |
| CN101555611A (zh) | 一种镁合金表面电镀镍方法 | |
| JPH0734254A (ja) | アルミニウム系材料への無電解めっき方法 | |
| CN102560451B (zh) | 化学镀纳米银液、制备方法及其用于铜件的镀银的方法 | |
| CN102925878A (zh) | 一种常温化学锡镀液 | |
| CN114150318A (zh) | 一种铜镍硅合金的镀前处理方法及铜镍硅合金表面电镀银方法 | |
| CN105455321B (zh) | 一种锌合金拉链链齿 | |
| JP5360527B2 (ja) | 磁性材料への無電解めっきの前処理方法 | |
| CN101831641A (zh) | 镁锂合金酸性浸锌溶液及浸锌方法 | |
| CN104152952A (zh) | 一种高性能无氰镀银预镀液 | |
| KR100358011B1 (ko) | 경사기능 전기도금 방법 | |
| CN105097306B (zh) | 耐大电流的开关触点及其制备方法 | |
| JP4406313B2 (ja) | 無電解金めっき方法及びこの方法により金めっきされたシリコン材料。 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG4A | Patent for invention issued | ||
| KA4A | Patent for invention lapsed due to non-payment of fees (with right of restoration) | ||
| MM4A | Patent for invention definitely lapsed due to non-payment of fees |