KR980005697A - 균일성을 향상시킨 커플링 플랙스 - Google Patents
균일성을 향상시킨 커플링 플랙스 Download PDFInfo
- Publication number
- KR980005697A KR980005697A KR1019960023288A KR19960023288A KR980005697A KR 980005697 A KR980005697 A KR 980005697A KR 1019960023288 A KR1019960023288 A KR 1019960023288A KR 19960023288 A KR19960023288 A KR 19960023288A KR 980005697 A KR980005697 A KR 980005697A
- Authority
- KR
- South Korea
- Prior art keywords
- clamp
- coupling
- wafer
- flex
- coupling flex
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 커플링 플렉스에 형성되어 있는 완충 슬레이트를 적어도 2개이상 형성하여 커플링 플렉스에 균일성을 향상시켜 커플링 플렉스를 장시간 사용하여도 클램프 링 핀이 한쪽으로 기울어지는 것을 방지하여 클램프가 웨이퍼를 클램핑시 웨이퍼를 균일하게 눌러주어 에칭 공정시 웨이퍼 표면이 균일하게 에칭되게 하고, 클램프 백업시 클램프가 한쪽으로 기울어지는 것을 방지하여 백업 시간을 감소시켜 설비의 가동률을 증가시킬 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2a도는 본 발명에 의한 에칭설비에 에칭할 웨이퍼를 올려 놓기 위해서 벨로우즈 리프트를 상승시킨 상태를 나타낸 상태도.
제2b도는 본 발명에 의한 에칭 설비에 놓여진 웨이퍼를 가압하기 위해서 벨로우즈 리프트를 하강시킨 상태를 나타낸 상태도.
제2c도는 본 발명에 의한 에칭 설비에서 웨이퍼를 분리시켜 후속 공정으로 이동시키기 위해 벨로우즈 리프트를 상승시킨 상태를 나타낸 상태도.
Claims (1)
- 웨이퍼가 놓여진 패드스탈과, 상기 패드스탈에 놓여진 상기 웨이퍼를 가압해 주는 클램프와, 상기 클램프와 수직으로 연결된 클램프 링 핀과, 상기 클램프 링 핀 하부에 연결되는 커플링 플렉스와, 상기 커플링 플렉스 상부에 형성되어 있는 완충 슬레이트와, 상기 커플링 플렉스와 연결되어 클램프를 상하로 이동시켜 주는 벨로우즈 리프트를 포함하는 에칭 설비에 있어서, 상기 완충 슬레이트는 적어도 2개 이상 형성된 것을 특징으로 하는 균일성을 향상시킨 커플링 플렉스.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960023288A KR100196899B1 (ko) | 1996-06-24 | 1996-06-24 | 균일성을 향상시킨 커플링 플랙스 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960023288A KR100196899B1 (ko) | 1996-06-24 | 1996-06-24 | 균일성을 향상시킨 커플링 플랙스 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR980005697A true KR980005697A (ko) | 1998-03-30 |
KR100196899B1 KR100196899B1 (ko) | 1999-06-15 |
Family
ID=19463096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960023288A KR100196899B1 (ko) | 1996-06-24 | 1996-06-24 | 균일성을 향상시킨 커플링 플랙스 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100196899B1 (ko) |
-
1996
- 1996-06-24 KR KR1019960023288A patent/KR100196899B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100196899B1 (ko) | 1999-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU3592895A (en) | Compliant interface for a semiconductor chip | |
EP1068928A3 (en) | Chemical mechanical polishing processes and components | |
SG99365A1 (en) | Reliable metal bumps on top of i/o pads with test probe marks | |
JPS6367742A (ja) | 集積回路試験ステーション用圧力制御装置 | |
AU2913595A (en) | Microelectronic mounting with multiple lead deformation | |
HK1070940A1 (en) | Micro-bridge structure | |
ID17230A (id) | Metode memproses lapisan bawah | |
KR900019208A (ko) | 반도체 웨이퍼의 냉각방법 및 장치 | |
JPH0442944A (ja) | 半導体装置 | |
MY108895A (en) | Method for extending wafer-supporting sheet | |
KR980005697A (ko) | 균일성을 향상시킨 커플링 플랙스 | |
GB2363680A (en) | Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers | |
JPS5434751A (en) | Washing method for silicon wafer | |
TW356565B (en) | Method and device for removing a semiconductor wafer from a flat substrate | |
DE3671812D1 (de) | Verfahren zum einebnen der oberflaeche einer halbleitervorrichtung, die siliziumnitrid als isolierendes material verwendet. | |
EP0385573A3 (en) | Mesa fabrication in semiconductor structures | |
TW374203B (en) | A method for forming a fine contact hole in a semiconductor device | |
DE69939458D1 (de) | Halbleiterbearbeitungsvorrichtung | |
SE9403722L (sv) | Halvledaranordning | |
KR19980033658U (ko) | 에칭챔버의 웨이퍼 클램핑장치 | |
KR970053316A (ko) | 반도체 장비의 웨이퍼 홀더 | |
SE9102042D0 (sv) | Gto-tyristor jaemte foerfarande foer framstaellning av en gto-tyristor | |
MY140644A (en) | Method and apparatus for drying a substrate. | |
JPS5399877A (en) | Manufacture of mesa transistor | |
JPH09260295A (ja) | 縦型半導体製造装置のウエハ支持具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20080201 Year of fee payment: 10 |
|
LAPS | Lapse due to unpaid annual fee |