KR970707219A - 표면에 금속층을 형성한 열가소성수지성형품(thermoplastic resin molding having metal layer formed on surface thereof) - Google Patents

표면에 금속층을 형성한 열가소성수지성형품(thermoplastic resin molding having metal layer formed on surface thereof)

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Publication number
KR970707219A
KR970707219A KR1019970703210A KR19970703210A KR970707219A KR 970707219 A KR970707219 A KR 970707219A KR 1019970703210 A KR1019970703210 A KR 1019970703210A KR 19970703210 A KR19970703210 A KR 19970703210A KR 970707219 A KR970707219 A KR 970707219A
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KR
South Korea
Prior art keywords
resin
molded article
resin molded
metal layer
weight
Prior art date
Application number
KR1019970703210A
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English (en)
Inventor
도모유키 아케타
Original Assignee
가스가 다쿠조오
폴리플라스틱스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가스가 다쿠조오, 폴리플라스틱스 가부시키가이샤 filed Critical 가스가 다쿠조오
Publication of KR970707219A publication Critical patent/KR970707219A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)

Abstract

박층이라도 충분히 성형가능한 유동성과 높은 강성을 함께 갖추어 내구성이 있는 도금 밀착력이 있는 표면에 금속층을 형성한 수지성형품을 제공한다.
(a) 이방성용융상을 형성하지 않는 열가소성수지 99 내지 50중량%와 (b) 이방성용융상을 형성할 수 있는 액정성폴리에스테르 1 내지 50중량%의 복합재료를 성형하여 되는 수지성형품에 유기용제로 프리에칭 후, 습식 도급법에 의해 표면에 금속층을 형성한다.

Description

표면에 금속층을 형성한 열가소성수지성형품(THERMOPLASTIC RESIN MOLDING HAVING METAL LAYER FORMED ON SURFACE THEREOF)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. (a) 이방성용융상을 형성하지 않는 열가소성수지 99 내지 50중량%와 (b) 이방성용융상을 형성할 수 있는 액정성폴리에스테르 1 내지 50중량%의 복합재료를 성형하여 이루어지는 수지성형품에 유기용제로 프리에칭 후, 습식 도급법에 의해 표면에 금속층을 형성한 것을 특징으로 하는 수지성형품.
  2. 제1항에 있어서, 실란화합물을 (a) 열가소성수지와 (b) 액정성폴리에스테르의 합계 100중량부에 대해 0.01 내지 3.0중량부 배합하여 이루어지는 복합재료를 성형하여 되는 수지성형품에 유기용제로 프리에칭 후, 습식 도급법에 의해 표면에 금속층을 형성한 것을 특징으로 하는 수지성형품.
  3. 제1항 또는 제2항에 있어서 (a) 액정성폴리에스테르가 메트릭스이며 (a) 이방성용융상을 형성하지 않는 열가소성수지 중에서 종횡비 6 이상의 섬유의 형태로 존재하고 있는 것을 특징으로 하는, 표면의 금속층을 형성한 수지성형품.
  4. 제1항 내지 제3항 중의 어느 한항에 있어서, (a) 열가소성수지가 폴리에스테르수지인 것을 특징으로 하는, 표면에 금속층을 형성한 수지성형품.
  5. 제4에 있어서, (a) 열가소성수지가 폴리에스테르수지인 것을 특징으로 하는, 표면에 금속층을 형성한 수지성형품.
  6. 제5항에 있어서, 인화합물을 (a) 폴리카보네이트수지와 (b) 액정성폴리에스테르의 합계 100중량부에 대해 0.01 내지 0.5중량부 배합하여 이루어지는 복합재료를 성형하여 되는 수지성형품에 유기용제로 프리에칭 후, 습식 도급법에 의해 표면에 금속층을 형성한 것을 특징으로 하는 수지성형품.
  7. 제1항 내지 제6항 중의 어느 한 항에 있어서, 무기충전제를 (a) 열가소성수지와 (b) 액정성폴리에스테르의 합계 100중량부에 대해 1 내지 200중량부 배합하여 이루어지는 복합재료를 성형하여 되는 수지성형품에 유기용제로 프리에칭 후, 습식 도급법에 의해 표면에 금속층을 형성한 것을 특징으로 하는 수지성형품.
  8. 제7항에 있어서, 무기충전제가 주기율표 2족 또는 12족 원소의 산화물, 황산염, 인산염, 규산염, 또는 알루미늄, 규소, 주석, 납, 안티몬, 비스무스의 원소 및 그 산화물로 구성되는 군으로부터 선택되는 1종 또는 2종 이상의 미세분말형 무기충전제인 것을 특징으로 하는 표면에 금속층을 형성한 수지성형품.
  9. 제7항에 있어서, 무기충전제가 피로인산칼슘인 것을 특징으로 하는 표면에 금속층을 형성한 수지성형품.
  10. 제1항 내지 제9항 중의 어느 한 항에 있어서, 습식도급법이 수지성형품의 표면을 미리 유기용제로 프리에칭한 후, 산성수용액으로 에칭하고, 그 후 무전해도급 또는 전해도금을 실시하는 것을 특징으로 하는, 표면에 금속층을 형성한 수지성형품.
  11. 제10항에 있어서, 유기용제가 알콜류, 케톤류, 포름아미드류, 알데히드류, 술폭시드류, 아민류로부터 선택된 1종 또는 2종 이상의 혼합용액 또는 이 용액과 물의 혼합용액인 것을 특징으로 하는 표면에 금속층을 형성한 수지성형품.
  12. 제10항 또는 제11항에 있어서, 산성수용액이 무기산 또는 유기산의 수용액 또는 이 수용액과 알콜류의 혼합용액으로부터 되는 것을 특징으로 하는, 표면에 금속층을 형성한 수지성형품.
  13. 제1항 내지 제12항 중의 어느 한 항에 있어서, 하우징, 커넥터, CD픽업부품 또는 디지털디스크용 기구부품의 구조체인 것을 특징으로 하는, 표면에 금속층을 형성한 수지성형품.
  14. 제1항 내지 제12항의 어떤 것에 있어서, 필름, 시트 또는 섬유인 것을 특징으로 하는, 표면에 금속층을 형성한 수지성형품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970703210A 1995-12-19 1996-12-18 표면에 금속층을 형성한 열가소성수지성형품(thermoplastic resin molding having metal layer formed on surface thereof) KR970707219A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33021695 1995-12-19
JP95-330216 1995-12-19

Publications (1)

Publication Number Publication Date
KR970707219A true KR970707219A (ko) 1997-12-01

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KR1019970703210A KR970707219A (ko) 1995-12-19 1996-12-18 표면에 금속층을 형성한 열가소성수지성형품(thermoplastic resin molding having metal layer formed on surface thereof)

Country Status (5)

Country Link
EP (1) EP0810298A4 (ko)
KR (1) KR970707219A (ko)
CA (1) CA2203130A1 (ko)
TW (1) TW363991B (ko)
WO (1) WO1997022730A1 (ko)

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JP4468295B2 (ja) * 2005-12-15 2010-05-26 ダイセルポリマー株式会社 めっき樹脂成形体
KR102098411B1 (ko) * 2011-11-15 2020-04-07 티코나 엘엘씨 콤팩트 카메라 모듈
US8926862B2 (en) * 2011-11-15 2015-01-06 Ticona Llc Low naphthenic liquid crystalline polymer composition for use in molded parts with a small dimensional tolerance
DE102015201562A1 (de) * 2015-01-29 2016-08-04 Helmholtz-Zentrum Dresden - Rossendorf E.V. Verfahren zur Metallisierung von Kunststoffteilen sowie Lösung
EP3581615A1 (en) * 2018-06-12 2019-12-18 ImerTech New uses of mineral fillers
CN113801416A (zh) * 2020-06-12 2021-12-17 日铁化学材料株式会社 树脂膜、其制造方法、树脂组合物、覆金属层叠板及印刷配线板

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DE3884546T3 (de) * 1987-10-02 2000-03-23 Polyplastics Co Verfahren zur Oberflächenbehandlung von Gegenständen aus flüssigkristallinem Polyesterharz.
JP3269142B2 (ja) * 1992-11-25 2002-03-25 東レ株式会社 樹脂組成物の製造方法および樹脂組成物成形品の製造方法
JP3759180B2 (ja) * 1993-11-11 2006-03-22 ポリプラスチックス株式会社 合成樹脂組成物成形体
JP3365104B2 (ja) * 1993-12-27 2003-01-08 東レ株式会社 チューブ状成形体、その製造方法およびそれからなるペレットを成形してなる成形品
JP3365040B2 (ja) * 1994-04-28 2003-01-08 東レ株式会社 液晶性樹脂成形品およびその製造方法

Also Published As

Publication number Publication date
EP0810298A4 (en) 1998-04-01
TW363991B (en) 1999-07-11
CA2203130A1 (en) 1997-06-19
EP0810298A1 (en) 1997-12-03
WO1997022730A1 (fr) 1997-06-26

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