KR970706612A - 다중 파장으로 광을 발생시키기 위한 발광 다이오드의 모놀리식 어레이 및 이를 사용한 멀티 컬러 디스플레이(monolithic array of light emitting diodes for the generation of light at multiple wavelengths and its use for multicolor display applications) - Google Patents

다중 파장으로 광을 발생시키기 위한 발광 다이오드의 모놀리식 어레이 및 이를 사용한 멀티 컬러 디스플레이(monolithic array of light emitting diodes for the generation of light at multiple wavelengths and its use for multicolor display applications)

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KR970706612A
KR970706612A KR1019970702368A KR19970702368A KR970706612A KR 970706612 A KR970706612 A KR 970706612A KR 1019970702368 A KR1019970702368 A KR 1019970702368A KR 19970702368 A KR19970702368 A KR 19970702368A KR 970706612 A KR970706612 A KR 970706612A
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led
array
leds
light
emitting diodes
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사무엘 클라게트 스트라이트
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제프리 엘. 포맨
인터내셔널 비지네스 머신즈 코포레이션
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H01L33/325Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen characterised by the doping materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004Devices characterised by their operation
    • H01L33/0033Devices characterised by their operation having Schottky barriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004Devices characterised by their operation
    • H01L33/0037Devices characterised by their operation having a MIS barrier layer

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

발광 다이오드의 모놀리식 멀티 컬러 어레이와 이를 멀티 컬러 디스플레이 응용에 사용하는 것이 개시 되어있다. 멀티 컬러 LED는 도전성 기판(35), 도전성 반도체층(36), 도전성 반도체층(36)의 상부의 보상된 반도체층, 및 개개의 LED를 바이어스하기 위한 접촉들(37; 38,X,X=1,2...)을 구비하고 있다. 보상된 반도체층은 광을 발생하기 위한 LED의 활성층의 역할을 한다. 활성층의 멀티 컬러 능력은 불순물 관련 전자 천이를 발광성 재결합 과정으로서 사용하고, 활성층의 도핑 조건의 측방 변동을 도입함으로써 달성되는데, 이 천이의 에너지는 도핑 조건에 따라 다르다. 이 측방 변동(서로 다른 도핑 조건은 서로 다른 심볼 Dii=1,2....)은 활성층에서 발생된 광의 색상의 측방 변동이 활성층으로 캐리어 주입으로 인해 일어나도록 조정된다. 활성층에 (Ga1-XAlX)l-yInN 등의 대역갭이 넓은 반도체를 사용함으로써 근적외선과 자외성 사이의 전 스펙트럼에 걸쳐 있는 서로 다른 방출선을 발생할 수 있는 모놀리식 멀티 컬러 LED 어레이를 제조할 수 있게 된다.

Description

다중 파장으로 광을 발생시키기 위한 발광 다이오드의 모놀리식 어레이 및 이를 사용한 멀티 컬러 디스플레이(MONOLITHIC ARRAY OF LIGHT EMITTING DIODES FOR THE GENERATION OF LIGHT AT MULTIPLE WAVELENGTHS AND ITS USE FOR MULTICOLCR DISPLAY APPLICATIONS)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 멀티 컬러 LED어레이의 측방 도핑 프로필 및 접촉 영역을 정의하기 위한 마스크에 대응하는 다수의 픽셀의 일례를 나타낸 도면, 제5도는 공통 전극으로서 사용되는 도전성 기판상의 고밀도 2차원 x-y어드레싱 가능한 LED어레이의 일부를 도시한 도면으로, 전자 방출층 및 전자 수집층은 수직으로 배열되어 있다. 제6도는 전자 방출기와 전자 수집기가 측방으로 배열된 멀티 컬러 MIS-LED의 어레이의 일부를 도시한 도면으로, 이 어레이는 x-y어드레싱에 적합하다.

Claims (23)

  1. 다중 파장으로 광을 발생시키는 발광 다이오드(LED)의 어레이에 있어서, 상기 LED는 하나의 기판(10,15,30,35,41,47,50,70,80)상에 서장된 반도체 막들(11,12,16,-18,31,34,36,39,42-44,51,52,71)의 적층 구조로 실현되고, 상기 어레이는 상기 LED에 바이어스를 인가하기 위한 접촉 영역(contactarea)(32,x,33,x,37,38,x,45,x,46,x,48,55,59,72-75,81-84)을 구비하며, 상기 LED 중 적어도 2개의 특정 LED는 서로 다른 전기 발광 스팩트럼을 얻게 되는데, ㆍ 상기 특정 LED 중 제1의 것만이 그의 활성 영역(active region)을 형성하는 물질에서의 불순물 상태(impurity state)에 의해 결정되는 전기 발광 스팩트럼(electroluminescence spectrum)을 가지며, 상기 불순물 상태는 상기 활성 영역의 대역갭 에너지(bandgap energy)이하의 에너지를 갖는 광 천이(optical transition)를 일으키며, ㆍ상기 특정 LED 모두는 각각의 활성 영역을 형성하는 물질에서 적어도 하나의 불순물 상태를 가지며, 상기 불순물 상태는 국부적인 도핑 조건(local doping condition)이 서로 다름으로 인하여 상기 LED 모두에 제각기 대해 서로 다르며, 상기 불순물 상태 각각은 상기 활성 영역의 대역 갭 에너지 이하의 에너지를 갖는 광천이를 일으키고 상기 광 천이가 상기 특정 LED의 상기 전기 발광 스팩트럼에 기여하고, ㆍ 상기 특정 LED모두의 상기 전기 발광 스팩트럼은 서로 다른 방출 파장(emission wavelength)을 갖는 적어도 2개의 방출선(emission line)을 포함하는데, 상기 방출선 모두는 상기 LED의 활성 영역을 형성하는 물질에서의 불순물 상태에 관련되어 있고 상기 활성 영역의 대역갭 이하의 광자 에너지(photon energy)를 가지는 광 천이로 인한 것(attributed to potical transitions)으로서, 상기 2개의 방출선은상기 특정 LED에 대해 동일한 광자 에너지를 가지지만 상대 세기 (relative intensity)는 서로 다른 것을 특징으로 하는 발광 다이오드의 어레이.
  2. 제1항에 있어서, 상기 2개의 특정 LED중 적어도 하나의 전기 발광 스펙트럼은 한 특정 파장의 방출선을 단지 하나만 포함하는 것을 특징으로 하는 발광 다이오드이 어레이.
  3. 제1항에 있어서, 상기 2개의 LED중 적어도 하나의 LED의 전기 발광 스펙트럼은 서로 다른 2개의 방출 파장(emission wavelength)의 방출선을 적어도 2개 포함하며, 상기 LED에 인가되는 바이어슬 변화시킴으로써 상기 LED의 상기 방출 파장에서의 상기 전기 발광의 상대 세기가 변화되는 것을 특징으로 하는 발광 다이오드의 어레이.
  4. 제1항 내지 3항중 어느 한 항에 있어서, 서로 다른 국부적 도핑 조건은 도펀트를 서로 다르게 선택하거나 도펀트의 국부적 농도를 서로 달리 하거나 또는 서로 다른 도핑 공정을 선택함으로써 달성되는 것을 특징으로 하는 발광 다이도드의 어레이.
  5. 제1항 내지 4항중 어느 한항에 있어서, 상기 LED의 공은 그 일부가 상기 기판 상부의 빈공간(halfspace) 또는 기판 하부의 빈공간 중 적어도 하나의 반공간내로 방사(radiate)되는 것을 특징으로 하는 발광 다이오드의 어레이.
  6. 제1항 내지 제5항중 어느 한 항에 있어서, 상기 기판은 상기 발생된 광에 대해 투명(transparent)하며, 상기 발생된 광의 일부는 상기 기판을 통해 방사되는 것을 특징으로 하는 발광 다이오드의 어레이.
  7. 제1항 내지 제6항 중 어느 한 항에 있어서, 특정 LED는 반도체 물질의 절연성 부분(12,34,39,52,Di,i=1,2…)와 직접 접촉하고 있는 금속 접촉점(33.x,38.x,55,72-75,81-84)을 구비하는 금속-절연체-반도체(MIS) 구조에 근거하고 있으며, 상기 절연성 부분은 반도체 물질의 도전성 부분(11,31,36,51,71,85-88)에 짖겁 접촉하고 있으며, 상기 방출 파장에 관여하는 도펀트(Di,i=1,2…)는 상기 절연성 부분에 포함되어 있는 것을 특징으로 하는 발광 다이오드의 어레이.
  8. 제7항에 있어서, 상기 금속 접촉점(33.x,38.x,55).상기 반도체 물질의 절연성 부분(34,39,52,Di,i=1,2…)및 상기 반도체 물질의 도전성 부분(31,36,51)에 대해 수직으로 배열되어 있는 것을 특징으로 하는 발광 다이오드의 어레이.
  9. 제7항에 있어서, LED의 상기 절연성 부분(Di,i=1,2…)과 상기 도전성 부분(71,85-88)은 상기 적충 구조의 상부층이 되는 단일 반도체층(single semiconductor layar)에 실현되고, 상기 절연성 부분이나 상기 도전성 부분은 상기 상부층의 표면에서 최상부영역의 도핑 조건의 축방 변동에 의해 실현되는 것을 특징으로 하는 발광 다이오드의 어레이.
  10. 제9항에 있어서, LED의 상기 절연성 부분(Di,i=1,2…)은 그의 도전성 부분(71)에 매몰되어 있고, LED의 상기 도전성 부분(85-88)으 그의 절연성 부분(Di,i=1,2…)에 매몰되어 있는 것을 특징으로 하는 발광 다이오드의 어레이.
  11. 제1항 내지 제6항 중 어느 한 항에 있어서, 특정 LED는 p-n접합(42,44) 기반 소자(p-n-junction based device)이고, 상기 방출 파장에 관여하는 도펀트(Di,i=1,2…)는 상기 접합의 활성 영역(43)에 포함되어 있는 것을 특징으로 하는 발광 다이오드이 어레이.
  12. 제7항 내지 제11항중 어느 한 항에 있어서, 상기 반도체 막들의 적충 구조는 물질계(marerial system) (Ga1-xAlx)1-yInyN에 근거하는 것을 특징으로 하는 발광 다이오드의 어레이
  13. 제1항 내지 제12항 중 어느 한 항에 있어서, 특정 LED에 바이어스를 인가하기 위한 접촉 영역(32.x,33.x,45.x,72-75,81-84)은 상기 기판(30,41,70,80)의 동일 특면상에 있는 것을 특징으로 하는 발광 다이오드의 어레이.
  14. 제1항 내지 제12항 중 어느 한 항에 있어서, 상기 기판은 전도성 (35,47,50)이고 적어도 2개의 LED의 공통 전극으로서 역활하는 것을 특징으로 하는 발광 다이오드의 어레이.
  15. 선행항 중 어느 한 항에 있어서, n(n≥2)개의 서로 다른 파장이 발생되고, nxm LED가 (m(m≥1)개의 등가픽셀(equivalent pixel)에 기하학적으로 배열되어 있으며, 각 픽셀은 n개의 인접한 서브픽셀(subpixel)을 포함하고, n개의 서브픽셀 각각은 n개의 서로 다른 파장 중 하나를 발생하기 위한 하나의 LED로 식별되는 것을 특징으로 하는 발광 다이오드의 어레이.
  16. 제15항에 있어서, 반도체막의 물질 조성(marerial composition)은 기본 흡수단(fundamental absorption edge)이 청색 또는 자외선 스펙트럼 범위내에 있도록 선택되고, LED의 활성 영역에서의 국부적인 도핑 조건은 적어도 하나의 서브픽셀이 자외선과 청록색(bluegreen)사이의 스펙트럼 범위내의 광을 발생하는데 기여하고, 적어도 하나의 서브픽셀이 청록색과 황색(yellow) 사이의 스펙트럼 범위내의 광을 발생하는데 기여하며, 적어도 하나의 서브픽셀이 황색과 적외선 사이의 스펙트럼 범위내의 광을 발생하는데 기여하도록 선택되는 것을 특징으로 하는 발광 다이오드의 어레이.
  17. 제16항에 있어서, 각각의 픽셀은 3개의 서브픽셀(1,2,3)을 포함하고, 상기 픽셀들은 2차원 어레이로 배열되어 있는 것을 특징으로 하는 발광 다이오드의 어레이.
  18. 제1항 내지 제17항 중 어느 한 항에 따른 어레이와, 개개의 LED를 어드레싱하고 그의 접촉 영역에 바이어스를 인가하는 수단; 및 상기 LED로부터 나온 개개의 광원들(imdividual light sources attuibuted to the LED)을 볼 수 있도록 상기 어레이를 지지하는 기계적 마운트(mechanical the LED)을 볼 수 있도록 상기 어레이드를 지지하는 기계적 마운트(mechanicalmount)룰 구비하는 멀티 컬러 디스플레이(multicolor display).
  19. 제18항에 있어서, 상기 LED의 바이어스, 즉 LED의 광 세기를 제어하는 제어 회로(controlelectronics)를 더 구비하며, 상기 제어 회로는 표시할 영상 데이타를 수신하기 위한 인터페이스를 더 구비하는 것을 특징으로 하는 멀티 컬러 디스플레이.
  20. 제19항에 있어서, 상기 제어 회로는 시간 종속적인 영상 데이타를 처리하기 위한 그레이 스케일 처리기와, LED를 펄스 모드로 바이어스하기 위한 펄스 발생기를 더 구비하는 것을 특징으로 하는 멀티 컬러 디스플레이.
  21. 제18항 내지 제20항 중 어느 한 항에 따른 멀티 컬러 디스플레이와, 상기 멀티 컬러 디스플레이의광원들을 투영(projection)시키기 위한 광학 촬상 시스템(optical imaging system)을 구비하는 멀티 컬러 프로젝션 디스플레이(multicolor projection display).
  22. 제21항에 있어서, 스트린상에 투영시키기 위한 것임을 특징으로 하는 멀티 컬러 프로젝션 디스플레이.
  23. 제18내지 제22항 중 어느 한 항에 따른 멀티컬러 디스플레이를 구비하는 컴퓨터.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970702368A 1994-10-11 1994-10-11 다중 파장으로 광을 발생시키기 위한 발광 다이오드의 모놀리식 어레이 및 이를 사용한 멀티 컬러 디스플레이 KR100268567B1 (ko)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100696445B1 (ko) * 2005-06-13 2007-03-19 주식회사 비첼 발광다이오드 디스플레이소자 및 그 제조 방법

Families Citing this family (321)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6996150B1 (en) 1994-09-14 2006-02-07 Rohm Co., Ltd. Semiconductor light emitting device and manufacturing method therefor
US6608453B2 (en) 1997-08-26 2003-08-19 Color Kinetics Incorporated Methods and apparatus for controlling devices in a networked lighting system
US6781329B2 (en) 1997-08-26 2004-08-24 Color Kinetics Incorporated Methods and apparatus for illumination of liquids
US7038398B1 (en) * 1997-08-26 2006-05-02 Color Kinetics, Incorporated Kinetic illumination system and methods
US7764026B2 (en) 1997-12-17 2010-07-27 Philips Solid-State Lighting Solutions, Inc. Systems and methods for digital entertainment
US20040052076A1 (en) 1997-08-26 2004-03-18 Mueller George G. Controlled lighting methods and apparatus
US6624597B2 (en) 1997-08-26 2003-09-23 Color Kinetics, Inc. Systems and methods for providing illumination in machine vision systems
US6774584B2 (en) 1997-08-26 2004-08-10 Color Kinetics, Incorporated Methods and apparatus for sensor responsive illumination of liquids
US6548967B1 (en) 1997-08-26 2003-04-15 Color Kinetics, Inc. Universal lighting network methods and systems
US6717376B2 (en) 1997-08-26 2004-04-06 Color Kinetics, Incorporated Automotive information systems
US20030133292A1 (en) 1999-11-18 2003-07-17 Mueller George G. Methods and apparatus for generating and modulating white light illumination conditions
US6777891B2 (en) 1997-08-26 2004-08-17 Color Kinetics, Incorporated Methods and apparatus for controlling devices in a networked lighting system
US6806659B1 (en) * 1997-08-26 2004-10-19 Color Kinetics, Incorporated Multicolored LED lighting method and apparatus
US6195135B1 (en) * 1997-11-13 2001-02-27 Peter J. Wilk Thin video display with superluminescent or laser diodes
US7132804B2 (en) 1997-12-17 2006-11-07 Color Kinetics Incorporated Data delivery track
US6335548B1 (en) 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
KR100605249B1 (ko) * 1998-09-23 2006-10-04 삼성전자주식회사 엘시디 모듈
EP0996173B1 (en) * 1998-10-23 2015-12-30 Xerox Corporation Semiconductor structures including polycrystalline GaN layers and method of manufacturing
WO2000036582A1 (fr) 1998-12-15 2000-06-22 Citizen Watch Co., Ltd. Dispositif électronique
US6521916B2 (en) 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
JP2001102626A (ja) * 1999-07-28 2001-04-13 Canon Inc Ledチップ、ledアレイチップ、ledアレイヘッド及び画像形成装置
DE19943405B4 (de) * 1999-09-10 2007-12-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines lateral monolithisch integrierten Lichtemissions-Halbleiterbauelements und Lichtemissions-Halbleiterbauelement
JP2001111109A (ja) * 1999-10-07 2001-04-20 Sharp Corp 窒化ガリウム系化合物半導体発光素子
WO2001033643A1 (en) * 1999-10-29 2001-05-10 Ohio University BAND GAP ENGINEERING OF AMORPHOUS Al-Ga-N ALLOYS
US7637737B2 (en) 1999-12-21 2009-12-29 S.C. Johnson & Son, Inc. Candle assembly with light emitting system
US7699603B2 (en) 1999-12-21 2010-04-20 S.C. Johnson & Son, Inc. Multisensory candle assembly
US7049761B2 (en) 2000-02-11 2006-05-23 Altair Engineering, Inc. Light tube and power supply circuit
TW497277B (en) * 2000-03-10 2002-08-01 Toshiba Corp Semiconductor light emitting device and method for manufacturing the same
US7892974B2 (en) * 2000-04-11 2011-02-22 Cree, Inc. Method of forming vias in silicon carbide and resulting devices and circuits
PT1422975E (pt) 2000-04-24 2010-07-09 Philips Solid State Lighting Produto ‚ base de leds
US6689630B2 (en) 2000-05-23 2004-02-10 Ohio University Method of forming an amorphous aluminum nitride emitter including a rare earth or transition metal element
US6410940B1 (en) * 2000-06-15 2002-06-25 Kansas State University Research Foundation Micro-size LED and detector arrays for minidisplay, hyper-bright light emitting diodes, lighting, and UV detector and imaging sensor applications
US7303300B2 (en) 2000-09-27 2007-12-04 Color Kinetics Incorporated Methods and systems for illuminating household products
JP2002198560A (ja) * 2000-12-26 2002-07-12 Sharp Corp 半導体発光素子およびその製造方法
US7075112B2 (en) * 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US6639360B2 (en) 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US6570548B2 (en) * 2001-02-06 2003-05-27 Ronald E. Smith Display device for providing graphical display having a variable number of vertical and horizontal lines of resolution
US6801003B2 (en) 2001-03-13 2004-10-05 Color Kinetics, Incorporated Systems and methods for synchronizing lighting effects
JP2002344011A (ja) * 2001-05-15 2002-11-29 Sony Corp 表示素子及びこれを用いた表示装置
US7358929B2 (en) 2001-09-17 2008-04-15 Philips Solid-State Lighting Solutions, Inc. Tile lighting methods and systems
US6669520B2 (en) * 2001-09-19 2003-12-30 United Microelectronics Corp. Method of fabricating an LC panel
US6847045B2 (en) * 2001-10-12 2005-01-25 Hewlett-Packard Development Company, L.P. High-current avalanche-tunneling and injection-tunneling semiconductor-dielectric-metal stable cold emitter, which emulates the negative electron affinity mechanism of emission
WO2003040803A2 (en) 2001-11-06 2003-05-15 Keyotee Apparatus for image projection
DE10158395B4 (de) * 2001-11-28 2011-07-07 OSRAM Opto Semiconductors GmbH, 93055 LED-Beleuchtungssystem
US7050835B2 (en) * 2001-12-12 2006-05-23 Universal Display Corporation Intelligent multi-media display communication system
TW516248B (en) * 2001-12-21 2003-01-01 Epitech Technology Corp Nitride light emitting diode with spiral-shaped metal electrode
US6635503B2 (en) * 2002-01-28 2003-10-21 Cree, Inc. Cluster packaging of light emitting diodes
JP2003282939A (ja) * 2002-03-26 2003-10-03 Oki Degital Imaging:Kk 半導体発光装置及びその製造方法
KR100459782B1 (ko) * 2002-07-26 2004-12-03 주식회사 이츠웰 발광 다이오드를 포함하는 마이크로 칩 어레이 및 이를 포함하는 풀 칼라 표시 모듈
US20050141800A1 (en) * 2002-09-17 2005-06-30 Mitsubishi Denki Kabushiki Kaisha Waveguide semiconductor optical device and process of fabricating the device
US6957899B2 (en) * 2002-10-24 2005-10-25 Hongxing Jiang Light emitting diodes for high AC voltage operation and general lighting
US7213942B2 (en) * 2002-10-24 2007-05-08 Ac Led Lighting, L.L.C. Light emitting diodes for high AC voltage operation and general lighting
TW569475B (en) * 2002-11-08 2004-01-01 United Epitaxy Co Ltd Light emitting diode and method of making the same
WO2004100624A2 (en) 2003-05-05 2004-11-18 Color Kinetics, Inc. Lighting methods and systems
DE102004001823B3 (de) * 2004-01-08 2005-09-01 Humboldt-Universität Zu Berlin Licht emittierende Halbleitervorrichtungen mit veränderbarer Emissionswellenlänge
US7001824B2 (en) * 2004-02-20 2006-02-21 Supernova Optoelectronics Corporation Gallium nitride vertical light emitting diode structure and method of separating a substrate and a thin film in the structure
US7045375B1 (en) * 2005-01-14 2006-05-16 Au Optronics Corporation White light emitting device and method of making same
US7221044B2 (en) 2005-01-21 2007-05-22 Ac Led Lighting, L.L.C. Heterogeneous integrated high voltage DC/AC light emitter
US7525248B1 (en) 2005-01-26 2009-04-28 Ac Led Lighting, L.L.C. Light emitting diode lamp
US7535028B2 (en) * 2005-02-03 2009-05-19 Ac Led Lighting, L.Lc. Micro-LED based high voltage AC/DC indicator lamp
US8070329B1 (en) 2005-02-11 2011-12-06 Gentex Corporation Light emitting optical systems and assemblies and systems incorporating the same
WO2006104935A2 (en) * 2005-03-28 2006-10-05 Goldeneye,Inc. Light emitting diodes and methods of fabrication
DE102005055997A1 (de) * 2005-05-02 2006-11-09 Hieke, Bernhard Homogene Lichtquelle
US8272757B1 (en) 2005-06-03 2012-09-25 Ac Led Lighting, L.L.C. Light emitting diode lamp capable of high AC/DC voltage operation
US7714348B2 (en) * 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism
US8138583B2 (en) 2007-02-16 2012-03-20 Cree, Inc. Diode having reduced on-resistance and associated method of manufacture
GB2451884A (en) * 2007-08-16 2009-02-18 Sharp Kk A Semiconductor Device and a Method of Manufacture Thereof
WO2009033266A1 (en) * 2007-09-10 2009-03-19 The Governors Of The University Of Alberta Light emitting semiconductor diode
US8783887B2 (en) 2007-10-01 2014-07-22 Intematix Corporation Color tunable light emitting device
US10321528B2 (en) 2007-10-26 2019-06-11 Philips Lighting Holding B.V. Targeted content delivery using outdoor lighting networks (OLNs)
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
US7712918B2 (en) 2007-12-21 2010-05-11 Altair Engineering , Inc. Light distribution using a light emitting diode assembly
DE102008005497A1 (de) * 2008-01-22 2009-07-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements und eines Wafers
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US7976196B2 (en) 2008-07-09 2011-07-12 Altair Engineering, Inc. Method of forming LED-based light and resulting LED-based light
JP2011529584A (ja) * 2008-07-28 2011-12-08 ピクセル チー コーポレイション 3モード液晶ディスプレイ
US7946729B2 (en) 2008-07-31 2011-05-24 Altair Engineering, Inc. Fluorescent tube replacement having longitudinally oriented LEDs
US8674626B2 (en) 2008-09-02 2014-03-18 Ilumisys, Inc. LED lamp failure alerting system
WO2010028146A2 (en) * 2008-09-08 2010-03-11 3M Innovative Properties Company Electrically pixelated luminescent device
US8256924B2 (en) 2008-09-15 2012-09-04 Ilumisys, Inc. LED-based light having rapidly oscillating LEDs
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US8444292B2 (en) 2008-10-24 2013-05-21 Ilumisys, Inc. End cap substitute for LED-based tube replacement light
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US8513685B2 (en) 2008-11-13 2013-08-20 3M Innovative Properties Company Electrically pixelated luminescent device incorporating optical elements
US8556452B2 (en) 2009-01-15 2013-10-15 Ilumisys, Inc. LED lens
US8362710B2 (en) 2009-01-21 2013-01-29 Ilumisys, Inc. Direct AC-to-DC converter for passive component minimization and universal operation of LED arrays
US8664880B2 (en) 2009-01-21 2014-03-04 Ilumisys, Inc. Ballast/line detection circuit for fluorescent replacement lamps
US8670004B2 (en) * 2009-03-16 2014-03-11 Pixel Qi Corporation Driving liquid crystal displays
US8362482B2 (en) 2009-04-14 2013-01-29 Monolithic 3D Inc. Semiconductor device and structure
US8754533B2 (en) 2009-04-14 2014-06-17 Monolithic 3D Inc. Monolithic three-dimensional semiconductor device and structure
US8395191B2 (en) 2009-10-12 2013-03-12 Monolithic 3D Inc. Semiconductor device and structure
US8405420B2 (en) 2009-04-14 2013-03-26 Monolithic 3D Inc. System comprising a semiconductor device and structure
US9509313B2 (en) 2009-04-14 2016-11-29 Monolithic 3D Inc. 3D semiconductor device
US7986042B2 (en) 2009-04-14 2011-07-26 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US8258810B2 (en) 2010-09-30 2012-09-04 Monolithic 3D Inc. 3D semiconductor device
US8362800B2 (en) 2010-10-13 2013-01-29 Monolithic 3D Inc. 3D semiconductor device including field repairable logics
US9577642B2 (en) 2009-04-14 2017-02-21 Monolithic 3D Inc. Method to form a 3D semiconductor device
US8378715B2 (en) 2009-04-14 2013-02-19 Monolithic 3D Inc. Method to construct systems
US8058137B1 (en) 2009-04-14 2011-11-15 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US8669778B1 (en) 2009-04-14 2014-03-11 Monolithic 3D Inc. Method for design and manufacturing of a 3D semiconductor device
US8384426B2 (en) 2009-04-14 2013-02-26 Monolithic 3D Inc. Semiconductor device and structure
US8373439B2 (en) 2009-04-14 2013-02-12 Monolithic 3D Inc. 3D semiconductor device
US9711407B2 (en) 2009-04-14 2017-07-18 Monolithic 3D Inc. Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer
US8427200B2 (en) 2009-04-14 2013-04-23 Monolithic 3D Inc. 3D semiconductor device
US8330381B2 (en) 2009-05-14 2012-12-11 Ilumisys, Inc. Electronic circuit for DC conversion of fluorescent lighting ballast
US8299695B2 (en) 2009-06-02 2012-10-30 Ilumisys, Inc. Screw-in LED bulb comprising a base having outwardly projecting nodes
WO2011005579A2 (en) 2009-06-23 2011-01-13 Altair Engineering, Inc. Illumination device including leds and a switching power control system
US10366970B2 (en) 2009-10-12 2019-07-30 Monolithic 3D Inc. 3D semiconductor device and structure
US9099424B1 (en) 2012-08-10 2015-08-04 Monolithic 3D Inc. Semiconductor system, device and structure with heat removal
US10910364B2 (en) 2009-10-12 2021-02-02 Monolitaic 3D Inc. 3D semiconductor device
US8581349B1 (en) 2011-05-02 2013-11-12 Monolithic 3D Inc. 3D memory semiconductor device and structure
US11374118B2 (en) 2009-10-12 2022-06-28 Monolithic 3D Inc. Method to form a 3D integrated circuit
US8536023B2 (en) 2010-11-22 2013-09-17 Monolithic 3D Inc. Method of manufacturing a semiconductor device and structure
US8476145B2 (en) 2010-10-13 2013-07-02 Monolithic 3D Inc. Method of fabricating a semiconductor device and structure
US10043781B2 (en) 2009-10-12 2018-08-07 Monolithic 3D Inc. 3D semiconductor device and structure
US8742476B1 (en) 2012-11-27 2014-06-03 Monolithic 3D Inc. Semiconductor device and structure
US10388863B2 (en) 2009-10-12 2019-08-20 Monolithic 3D Inc. 3D memory device and structure
US11984445B2 (en) 2009-10-12 2024-05-14 Monolithic 3D Inc. 3D semiconductor devices and structures with metal layers
US11018133B2 (en) 2009-10-12 2021-05-25 Monolithic 3D Inc. 3D integrated circuit
US10157909B2 (en) 2009-10-12 2018-12-18 Monolithic 3D Inc. 3D semiconductor device and structure
US10354995B2 (en) 2009-10-12 2019-07-16 Monolithic 3D Inc. Semiconductor memory device and structure
US8450804B2 (en) 2011-03-06 2013-05-28 Monolithic 3D Inc. Semiconductor device and structure for heat removal
US8148728B2 (en) 2009-10-12 2012-04-03 Monolithic 3D, Inc. Method for fabrication of a semiconductor device and structure
US8298875B1 (en) 2011-03-06 2012-10-30 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US8492886B2 (en) 2010-02-16 2013-07-23 Monolithic 3D Inc 3D integrated circuit with logic
US8541819B1 (en) 2010-12-09 2013-09-24 Monolithic 3D Inc. Semiconductor device and structure
US8461035B1 (en) 2010-09-30 2013-06-11 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US8026521B1 (en) 2010-10-11 2011-09-27 Monolithic 3D Inc. Semiconductor device and structure
US8373230B1 (en) 2010-10-13 2013-02-12 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US9099526B2 (en) 2010-02-16 2015-08-04 Monolithic 3D Inc. Integrated circuit device and structure
US8541958B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED light with thermoelectric generator
CA2794512A1 (en) 2010-03-26 2011-09-29 David L. Simon Led light tube with dual sided light distribution
US8540401B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED bulb with internal heat dissipating structures
US8454193B2 (en) 2010-07-08 2013-06-04 Ilumisys, Inc. Independent modules for LED fluorescent light tube replacement
US8596813B2 (en) 2010-07-12 2013-12-03 Ilumisys, Inc. Circuit board mount for LED light tube
US8901613B2 (en) 2011-03-06 2014-12-02 Monolithic 3D Inc. Semiconductor device and structure for heat removal
US9219005B2 (en) 2011-06-28 2015-12-22 Monolithic 3D Inc. Semiconductor system and device
US10217667B2 (en) 2011-06-28 2019-02-26 Monolithic 3D Inc. 3D semiconductor device, fabrication method and system
US8642416B2 (en) 2010-07-30 2014-02-04 Monolithic 3D Inc. Method of forming three dimensional integrated circuit devices using layer transfer technique
US9953925B2 (en) 2011-06-28 2018-04-24 Monolithic 3D Inc. Semiconductor system and device
US8163581B1 (en) 2010-10-13 2012-04-24 Monolith IC 3D Semiconductor and optoelectronic devices
US11482440B2 (en) 2010-12-16 2022-10-25 Monolithic 3D Inc. 3D semiconductor device and structure with a built-in test circuit for repairing faulty circuits
US8273610B2 (en) 2010-11-18 2012-09-25 Monolithic 3D Inc. Method of constructing a semiconductor device and structure
US10497713B2 (en) 2010-11-18 2019-12-03 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11158674B2 (en) 2010-10-11 2021-10-26 Monolithic 3D Inc. Method to produce a 3D semiconductor device and structure
US10896931B1 (en) 2010-10-11 2021-01-19 Monolithic 3D Inc. 3D semiconductor device and structure
US11257867B1 (en) 2010-10-11 2022-02-22 Monolithic 3D Inc. 3D semiconductor device and structure with oxide bonds
US11469271B2 (en) 2010-10-11 2022-10-11 Monolithic 3D Inc. Method to produce 3D semiconductor devices and structures with memory
US10290682B2 (en) 2010-10-11 2019-05-14 Monolithic 3D Inc. 3D IC semiconductor device and structure with stacked memory
US11018191B1 (en) 2010-10-11 2021-05-25 Monolithic 3D Inc. 3D semiconductor device and structure
US11600667B1 (en) 2010-10-11 2023-03-07 Monolithic 3D Inc. Method to produce 3D semiconductor devices and structures with memory
US11024673B1 (en) 2010-10-11 2021-06-01 Monolithic 3D Inc. 3D semiconductor device and structure
US11315980B1 (en) 2010-10-11 2022-04-26 Monolithic 3D Inc. 3D semiconductor device and structure with transistors
US11227897B2 (en) 2010-10-11 2022-01-18 Monolithic 3D Inc. Method for producing a 3D semiconductor memory device and structure
US8114757B1 (en) 2010-10-11 2012-02-14 Monolithic 3D Inc. Semiconductor device and structure
US11855114B2 (en) 2010-10-13 2023-12-26 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US11437368B2 (en) 2010-10-13 2022-09-06 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US10679977B2 (en) 2010-10-13 2020-06-09 Monolithic 3D Inc. 3D microdisplay device and structure
US9197804B1 (en) 2011-10-14 2015-11-24 Monolithic 3D Inc. Semiconductor and optoelectronic devices
US10833108B2 (en) 2010-10-13 2020-11-10 Monolithic 3D Inc. 3D microdisplay device and structure
US10943934B2 (en) 2010-10-13 2021-03-09 Monolithic 3D Inc. Multilevel semiconductor device and structure
US10998374B1 (en) 2010-10-13 2021-05-04 Monolithic 3D Inc. Multilevel semiconductor device and structure
US20120091474A1 (en) * 2010-10-13 2012-04-19 NuPGA Corporation Novel semiconductor and optoelectronic devices
US11929372B2 (en) 2010-10-13 2024-03-12 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US11063071B1 (en) 2010-10-13 2021-07-13 Monolithic 3D Inc. Multilevel semiconductor device and structure with waveguides
US11043523B1 (en) 2010-10-13 2021-06-22 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US11984438B2 (en) 2010-10-13 2024-05-14 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US10978501B1 (en) 2010-10-13 2021-04-13 Monolithic 3D Inc. Multilevel semiconductor device and structure with waveguides
US11133344B2 (en) 2010-10-13 2021-09-28 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US11327227B2 (en) 2010-10-13 2022-05-10 Monolithic 3D Inc. Multilevel semiconductor device and structure with electromagnetic modulators
US8379458B1 (en) 2010-10-13 2013-02-19 Monolithic 3D Inc. Semiconductor device and structure
US11164898B2 (en) 2010-10-13 2021-11-02 Monolithic 3D Inc. Multilevel semiconductor device and structure
US8283215B2 (en) 2010-10-13 2012-10-09 Monolithic 3D Inc. Semiconductor and optoelectronic devices
US11869915B2 (en) 2010-10-13 2024-01-09 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US11855100B2 (en) 2010-10-13 2023-12-26 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
US11404466B2 (en) 2010-10-13 2022-08-02 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors
US11163112B2 (en) 2010-10-13 2021-11-02 Monolithic 3D Inc. Multilevel semiconductor device and structure with electromagnetic modulators
US11605663B2 (en) 2010-10-13 2023-03-14 Monolithic 3D Inc. Multilevel semiconductor device and structure with image sensors and wafer bonding
US11694922B2 (en) 2010-10-13 2023-07-04 Monolithic 3D Inc. Multilevel semiconductor device and structure with oxide bonding
WO2012058556A2 (en) 2010-10-29 2012-05-03 Altair Engineering, Inc. Mechanisms for reducing risk of shock during installation of light tube
US11784082B2 (en) 2010-11-18 2023-10-10 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US11094576B1 (en) 2010-11-18 2021-08-17 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11211279B2 (en) 2010-11-18 2021-12-28 Monolithic 3D Inc. Method for processing a 3D integrated circuit and structure
US11923230B1 (en) 2010-11-18 2024-03-05 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US11610802B2 (en) 2010-11-18 2023-03-21 Monolithic 3D Inc. Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes
US11862503B2 (en) 2010-11-18 2024-01-02 Monolithic 3D Inc. Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11443971B2 (en) 2010-11-18 2022-09-13 Monolithic 3D Inc. 3D semiconductor device and structure with memory
US11901210B2 (en) 2010-11-18 2024-02-13 Monolithic 3D Inc. 3D semiconductor device and structure with memory
US11482439B2 (en) 2010-11-18 2022-10-25 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors
US11854857B1 (en) 2010-11-18 2023-12-26 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11508605B2 (en) 2010-11-18 2022-11-22 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11804396B2 (en) 2010-11-18 2023-10-31 Monolithic 3D Inc. Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
US11004719B1 (en) 2010-11-18 2021-05-11 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11355380B2 (en) 2010-11-18 2022-06-07 Monolithic 3D Inc. Methods for producing 3D semiconductor memory device and structure utilizing alignment marks
US11735462B2 (en) 2010-11-18 2023-08-22 Monolithic 3D Inc. 3D semiconductor device and structure with single-crystal layers
US11164770B1 (en) 2010-11-18 2021-11-02 Monolithic 3D Inc. Method for producing a 3D semiconductor memory device and structure
US11107721B2 (en) 2010-11-18 2021-08-31 Monolithic 3D Inc. 3D semiconductor device and structure with NAND logic
US11615977B2 (en) 2010-11-18 2023-03-28 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11569117B2 (en) 2010-11-18 2023-01-31 Monolithic 3D Inc. 3D semiconductor device and structure with single-crystal layers
US11482438B2 (en) 2010-11-18 2022-10-25 Monolithic 3D Inc. Methods for producing a 3D semiconductor memory device and structure
US11495484B2 (en) 2010-11-18 2022-11-08 Monolithic 3D Inc. 3D semiconductor devices and structures with at least two single-crystal layers
US11521888B2 (en) 2010-11-18 2022-12-06 Monolithic 3D Inc. 3D semiconductor device and structure with high-k metal gate transistors
US11121021B2 (en) 2010-11-18 2021-09-14 Monolithic 3D Inc. 3D semiconductor device and structure
US11018042B1 (en) 2010-11-18 2021-05-25 Monolithic 3D Inc. 3D semiconductor memory device and structure
US11031275B2 (en) 2010-11-18 2021-06-08 Monolithic 3D Inc. 3D semiconductor device and structure with memory
US11355381B2 (en) 2010-11-18 2022-06-07 Monolithic 3D Inc. 3D semiconductor memory device and structure
US8870415B2 (en) 2010-12-09 2014-10-28 Ilumisys, Inc. LED fluorescent tube replacement light with reduced shock hazard
US8975670B2 (en) 2011-03-06 2015-03-10 Monolithic 3D Inc. Semiconductor device and structure for heat removal
US10388568B2 (en) 2011-06-28 2019-08-20 Monolithic 3D Inc. 3D semiconductor device and system
US9072171B2 (en) 2011-08-24 2015-06-30 Ilumisys, Inc. Circuit board mount for LED light
US8687399B2 (en) 2011-10-02 2014-04-01 Monolithic 3D Inc. Semiconductor device and structure
US9029173B2 (en) 2011-10-18 2015-05-12 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
WO2013131002A1 (en) 2012-03-02 2013-09-06 Ilumisys, Inc. Electrical connector header for an led-based light
US9000557B2 (en) 2012-03-17 2015-04-07 Zvi Or-Bach Semiconductor device and structure
US11164811B2 (en) 2012-04-09 2021-11-02 Monolithic 3D Inc. 3D semiconductor device with isolation layers and oxide-to-oxide bonding
US11881443B2 (en) 2012-04-09 2024-01-23 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11476181B1 (en) 2012-04-09 2022-10-18 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11735501B1 (en) 2012-04-09 2023-08-22 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11594473B2 (en) 2012-04-09 2023-02-28 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US11694944B1 (en) 2012-04-09 2023-07-04 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
US8557632B1 (en) 2012-04-09 2013-10-15 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US11410912B2 (en) 2012-04-09 2022-08-09 Monolithic 3D Inc. 3D semiconductor device with vias and isolation layers
US10600888B2 (en) 2012-04-09 2020-03-24 Monolithic 3D Inc. 3D semiconductor device
US11088050B2 (en) 2012-04-09 2021-08-10 Monolithic 3D Inc. 3D semiconductor device with isolation layers
US11616004B1 (en) 2012-04-09 2023-03-28 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and a connective path
WO2014008463A1 (en) 2012-07-06 2014-01-09 Ilumisys, Inc. Power supply assembly for led-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US8574929B1 (en) 2012-11-16 2013-11-05 Monolithic 3D Inc. Method to form a 3D semiconductor device and structure
US8686428B1 (en) 2012-11-16 2014-04-01 Monolithic 3D Inc. Semiconductor device and structure
US11916045B2 (en) 2012-12-22 2024-02-27 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US8674470B1 (en) 2012-12-22 2014-03-18 Monolithic 3D Inc. Semiconductor device and structure
US11961827B1 (en) 2012-12-22 2024-04-16 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11967583B2 (en) 2012-12-22 2024-04-23 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11217565B2 (en) 2012-12-22 2022-01-04 Monolithic 3D Inc. Method to form a 3D semiconductor device and structure
US11063024B1 (en) 2012-12-22 2021-07-13 Monlithic 3D Inc. Method to form a 3D semiconductor device and structure
US11309292B2 (en) 2012-12-22 2022-04-19 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11784169B2 (en) 2012-12-22 2023-10-10 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US11018116B2 (en) 2012-12-22 2021-05-25 Monolithic 3D Inc. Method to form a 3D semiconductor device and structure
US10651054B2 (en) 2012-12-29 2020-05-12 Monolithic 3D Inc. 3D semiconductor device and structure
US9871034B1 (en) 2012-12-29 2018-01-16 Monolithic 3D Inc. Semiconductor device and structure
US11430668B2 (en) 2012-12-29 2022-08-30 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US9385058B1 (en) 2012-12-29 2016-07-05 Monolithic 3D Inc. Semiconductor device and structure
US10600657B2 (en) 2012-12-29 2020-03-24 Monolithic 3D Inc 3D semiconductor device and structure
US10115663B2 (en) 2012-12-29 2018-10-30 Monolithic 3D Inc. 3D semiconductor device and structure
US10903089B1 (en) 2012-12-29 2021-01-26 Monolithic 3D Inc. 3D semiconductor device and structure
US11177140B2 (en) 2012-12-29 2021-11-16 Monolithic 3D Inc. 3D semiconductor device and structure
US10892169B2 (en) 2012-12-29 2021-01-12 Monolithic 3D Inc. 3D semiconductor device and structure
US11087995B1 (en) 2012-12-29 2021-08-10 Monolithic 3D Inc. 3D semiconductor device and structure
US11004694B1 (en) 2012-12-29 2021-05-11 Monolithic 3D Inc. 3D semiconductor device and structure
US11430667B2 (en) 2012-12-29 2022-08-30 Monolithic 3D Inc. 3D semiconductor device and structure with bonding
US11869965B2 (en) 2013-03-11 2024-01-09 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US11935949B1 (en) 2013-03-11 2024-03-19 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers and memory cells
US8902663B1 (en) 2013-03-11 2014-12-02 Monolithic 3D Inc. Method of maintaining a memory state
US10325651B2 (en) 2013-03-11 2019-06-18 Monolithic 3D Inc. 3D semiconductor device with stacked memory
US10840239B2 (en) 2014-08-26 2020-11-17 Monolithic 3D Inc. 3D semiconductor device and structure
US11088130B2 (en) 2014-01-28 2021-08-10 Monolithic 3D Inc. 3D semiconductor device and structure
US8994404B1 (en) 2013-03-12 2015-03-31 Monolithic 3D Inc. Semiconductor device and structure
US11398569B2 (en) 2013-03-12 2022-07-26 Monolithic 3D Inc. 3D semiconductor device and structure
US11923374B2 (en) 2013-03-12 2024-03-05 Monolithic 3D Inc. 3D semiconductor device and structure with metal layers
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US9117749B1 (en) 2013-03-15 2015-08-25 Monolithic 3D Inc. Semiconductor device and structure
US10224279B2 (en) 2013-03-15 2019-03-05 Monolithic 3D Inc. Semiconductor device and structure
US11270055B1 (en) 2013-04-15 2022-03-08 Monolithic 3D Inc. Automation for monolithic 3D devices
US11030371B2 (en) 2013-04-15 2021-06-08 Monolithic 3D Inc. Automation for monolithic 3D devices
US11487928B2 (en) 2013-04-15 2022-11-01 Monolithic 3D Inc. Automation for monolithic 3D devices
US9021414B1 (en) 2013-04-15 2015-04-28 Monolithic 3D Inc. Automation for monolithic 3D devices
US11574109B1 (en) 2013-04-15 2023-02-07 Monolithic 3D Inc Automation methods for 3D integrated circuits and devices
US11720736B2 (en) 2013-04-15 2023-08-08 Monolithic 3D Inc. Automation methods for 3D integrated circuits and devices
US11341309B1 (en) 2013-04-15 2022-05-24 Monolithic 3D Inc. Automation for monolithic 3D devices
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
EP3097748A1 (en) 2014-01-22 2016-11-30 iLumisys, Inc. Led-based light with addressed leds
US11107808B1 (en) 2014-01-28 2021-08-31 Monolithic 3D Inc. 3D semiconductor device and structure
US11031394B1 (en) 2014-01-28 2021-06-08 Monolithic 3D Inc. 3D semiconductor device and structure
US10297586B2 (en) 2015-03-09 2019-05-21 Monolithic 3D Inc. Methods for processing a 3D semiconductor device
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
KR102294724B1 (ko) 2014-12-02 2021-08-31 삼성디스플레이 주식회사 유기 발광 트랜지스터 및 이를 포함하는 표시 장치
US11011507B1 (en) 2015-04-19 2021-05-18 Monolithic 3D Inc. 3D semiconductor device and structure
US11056468B1 (en) 2015-04-19 2021-07-06 Monolithic 3D Inc. 3D semiconductor device and structure
US10825779B2 (en) 2015-04-19 2020-11-03 Monolithic 3D Inc. 3D semiconductor device and structure
US10381328B2 (en) 2015-04-19 2019-08-13 Monolithic 3D Inc. Semiconductor device and structure
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
US11956952B2 (en) 2015-08-23 2024-04-09 Monolithic 3D Inc. Semiconductor memory device and structure
US11978731B2 (en) 2015-09-21 2024-05-07 Monolithic 3D Inc. Method to produce a multi-level semiconductor memory device and structure
US10515981B2 (en) 2015-09-21 2019-12-24 Monolithic 3D Inc. Multilevel semiconductor device and structure with memory
US10522225B1 (en) 2015-10-02 2019-12-31 Monolithic 3D Inc. Semiconductor device with non-volatile memory
US10847540B2 (en) 2015-10-24 2020-11-24 Monolithic 3D Inc. 3D semiconductor memory device and structure
US10418369B2 (en) 2015-10-24 2019-09-17 Monolithic 3D Inc. Multi-level semiconductor memory device and structure
US11114464B2 (en) 2015-10-24 2021-09-07 Monolithic 3D Inc. 3D semiconductor device and structure
US11296115B1 (en) 2015-10-24 2022-04-05 Monolithic 3D Inc. 3D semiconductor device and structure
US11991884B1 (en) 2015-10-24 2024-05-21 Monolithic 3D Inc. 3D semiconductor device and structure with logic and memory
US10199461B2 (en) * 2015-10-27 2019-02-05 Texas Instruments Incorporated Isolation of circuit elements using front side deep trench etch
US11114427B2 (en) 2015-11-07 2021-09-07 Monolithic 3D Inc. 3D semiconductor processor and memory device and structure
US11937422B2 (en) 2015-11-07 2024-03-19 Monolithic 3D Inc. Semiconductor memory device and structure
DE112016006010T5 (de) * 2015-12-24 2019-01-24 Vuereal Inc. Vertikale Festkörpervorrichtungen
US11251149B2 (en) 2016-10-10 2022-02-15 Monolithic 3D Inc. 3D memory device and structure
US11711928B2 (en) 2016-10-10 2023-07-25 Monolithic 3D Inc. 3D memory devices and structures with control circuits
US11329059B1 (en) 2016-10-10 2022-05-10 Monolithic 3D Inc. 3D memory devices and structures with thinned single crystal substrates
US11930648B1 (en) 2016-10-10 2024-03-12 Monolithic 3D Inc. 3D memory devices and structures with metal layers
US11869591B2 (en) 2016-10-10 2024-01-09 Monolithic 3D Inc. 3D memory devices and structures with control circuits
US11812620B2 (en) 2016-10-10 2023-11-07 Monolithic 3D Inc. 3D DRAM memory devices and structures with control circuits
KR102621843B1 (ko) * 2016-12-23 2024-01-05 엘지이노텍 주식회사 반도체 소자 및 이를 포함하는 광 모듈
US10565917B2 (en) * 2016-12-23 2020-02-18 Intel Corporation Monolithic micro LED display
FR3079071B1 (fr) 2018-03-13 2020-02-28 Soitec Procede de fabrication d'une pluralite d'ilots semi-conducteurs cristallins prensentant une variete de parametres de maille
JP7053055B2 (ja) * 2017-03-17 2022-04-12 ソイテック 光電子デバイスを形成するための成長基板、そのような基板を作製するための方法、及び特にマイクロディスプレイスクリーンの分野における基板の使用
FR3079070B1 (fr) 2018-03-13 2020-02-28 Soitec Procede de fabrication d'une pluralite d'ilots semi-conducteurs cristallins presentant une variete de parametres de maille
FR3064108B1 (fr) 2017-03-17 2022-12-30 Soitec Silicon On Insulator Substrat de croissance pour la formation de dispositifs optoelectroniques, procede de fabrication d'un tel susbstrat, et utilisation du susbtrat notamment dans le domaine des micro-ecrans d'affichage
US11600743B2 (en) 2017-03-30 2023-03-07 Vuereal Inc. High efficient microdevices
US20180287027A1 (en) 2017-03-30 2018-10-04 Vuereal Inc. Vertical solid-state devices
US11721784B2 (en) 2017-03-30 2023-08-08 Vuereal Inc. High efficient micro devices
FR3065116B1 (fr) * 2017-04-05 2021-08-27 Commissariat Energie Atomique Dispositif d'affichage d'images emissif a led
US11296106B2 (en) 2019-04-08 2022-04-05 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11763864B2 (en) 2019-04-08 2023-09-19 Monolithic 3D Inc. 3D memory semiconductor devices and structures with bit-line pillars
US11158652B1 (en) 2019-04-08 2021-10-26 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US11018156B2 (en) 2019-04-08 2021-05-25 Monolithic 3D Inc. 3D memory semiconductor devices and structures
US10892016B1 (en) 2019-04-08 2021-01-12 Monolithic 3D Inc. 3D memory semiconductor devices and structures
KR102193591B1 (ko) 2019-05-15 2020-12-21 주식회사 올릭스 광대역 발광 장치
US11467676B2 (en) * 2020-02-06 2022-10-11 Key Ovation, Llc Computer keyboard with electronically changeable keycaps
GB2609474A (en) * 2021-08-04 2023-02-08 Iqe Plc Multi-wavelength light-emitting semiconductor devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2325195A1 (fr) * 1975-09-18 1977-04-15 Radiotechnique Compelec Ensemble monolithique semiconducteur electroluminescent
JP2708183B2 (ja) * 1988-07-21 1998-02-04 シャープ株式会社 化合物半導体発光素子
US5281830A (en) * 1990-10-27 1994-01-25 Toyoda Gosei Co., Ltd. Light-emitting semiconductor device using gallium nitride group compound
US5273933A (en) * 1991-07-23 1993-12-28 Kabushiki Kaisha Toshiba Vapor phase growth method of forming film in process of manufacturing semiconductor device
KR940004306B1 (ko) * 1991-12-30 1994-05-19 삼성전관 주식회사 투사형 lcd의 다색시스템
US5359345A (en) * 1992-08-05 1994-10-25 Cree Research, Inc. Shuttered and cycled light emitting diode display and method of producing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100696445B1 (ko) * 2005-06-13 2007-03-19 주식회사 비첼 발광다이오드 디스플레이소자 및 그 제조 방법

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