KR970705329A - 내부 제동 회로 물품(internally damped circuit articles) - Google Patents

내부 제동 회로 물품(internally damped circuit articles) Download PDF

Info

Publication number
KR970705329A
KR970705329A KR1019970700387A KR19970700387A KR970705329A KR 970705329 A KR970705329 A KR 970705329A KR 1019970700387 A KR1019970700387 A KR 1019970700387A KR 19970700387 A KR19970700387 A KR 19970700387A KR 970705329 A KR970705329 A KR 970705329A
Authority
KR
South Korea
Prior art keywords
circuit
article
vibration
circuit article
braking
Prior art date
Application number
KR1019970700387A
Other languages
English (en)
Inventor
더블유. 맥커쳔 제프리
Original Assignee
테릴 켄트 퀼리
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테릴 켄트 퀼리, 미네소타 마이닝 앤드 매뉴팩츄어링 컴패니 filed Critical 테릴 켄트 퀼리
Publication of KR970705329A publication Critical patent/KR970705329A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/251—Mica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31605—Next to free metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

본 발명은 회로 물품(1)의 진동 제동 특성을 개선시키는 방법에 관한 것이다. 상기 방법은 회로 물품(1)에 처리되는 적층물에 제동 층(들)(2)을 부착하는 것을 포함한다. 제동 재료는 회로 물품의 제동을 효과적으로 증가시키며, 외부 진동 또는 충격에 의해 여기된 회로 물품의 공명 진동수 진폭을 감소시켜 회로 기판에 사용될 수 있으며, 이로써 부가의 제동기를 회로 물품에 부착하지 않고 진동 또는 충격 절연체에 의해 회로 기판을 분리함으로써 진동 및 충격과 관련된 성능 문제에 대해서 회로 물품에 부착하지 않고 진동 또는 충격 절연체에 의해 회로 기판을 분리함으로써 진동 및 충격과 관련된 성능 문제에 대해서 회로 물품의 성능을 잠재적으로 개선시킬 수 있다.

Description

내부 제동 회로 물품(INTERNALLY DAMPED CIRCUIT ARTICLES)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 회로 기판 두께의 중앙 부근에 배치된 진동 제동 재료의 연속 단일 층을 포함하는 회로 기판의 단면을 나타내는 본 발명의 한 구체예의 개략도이다.
제 2 도는 2개의 제동 재료 층을 포함하는 회로 기판의 일부분의 단면을 나타내는 본 발명의 다른 구체예의 개략도이다.
제 3 도는 제동 재료의 단일 비연속성 층을 포함하는 회로 기판의 단면을 나타내는 본 발명의 다른 구체예의 개략도이다.
제 4 도는 서로 다른 두 개의 제동 재료의 이웃하는 영역을 포함하는 제동 재료 단일 연속 층을 포함하는 회로 기판의 단면을 나타내는 본 발명의 다른 구체예의 개략도이다.

Claims (10)

  1. 내부 제동 회로 물품.
  2. 제 1 항에 있어서, 진동 제동 재료로 적어도 부분적으로 코팅되거나 또는 함침된 보강 섬유 재료를 포함하는 하나이상의 진동 제동 층을 포함하는 회로 물품.
  3. 점탄성 재료를 포함하며, 손실률이 약 0.01 이상이며, 저장 모듈러스가 약 6.9*103Pa 이상인 하나이상의 진동제동 재료 층을 포함하는 회로 물품.
  4. 제 1 항에 있어서, 상기 물품이 회로 기판 및 가요성 회로로 구성된 군에서 선택되는 회로 물품.
  5. 제 3 항에 있어서, 상기 진동 제동 재료 층(들)은 각각 두께가 약 0.005 내지 약 0.51mm인 회로 물품.
  6. 제 3 항에 있어서, 상기 진동 제동 재료가 섬유상 재료 및/또는 미립상 재료를 부가로 포함하는 회로 물품.
  7. 제 6 항에 있어서, 상기 미립상 재료는 유리 버블, 유리 비이드, 세라믹 버블, 세라믹 비이드, 열 전도성 버블, 산화 알루미늄 분말, 질소화 알루미늄 분말, 실리카 및 경화된 에폭시 노들로 구성된 군에서 선택되는 회로 물품.
  8. 제 3 항에 있어서, 상기 진동 제동 재료가 단일 방향만으로 전도되는 전기 전도성 입자 재료를 부가로 포함하는 회로 물품.
  9. 제 3 항에 있어서, 상기 물품은 둘 이상의 진동 제동 재료 층을 포함하며, 상기 둘 이상의 층은 여러 가지 제동 재료를 포함하는 회로 물품.
  10. 내부 제동 회로 물품을 제공하는 것을 포함하는 회로 물품의 진동 제동 특성을 개선시키는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970700387A 1994-07-29 1995-07-27 내부 제동 회로 물품(internally damped circuit articles) KR970705329A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/283,096 US5552209A (en) 1994-07-29 1994-07-29 Internally damped circuit articles
US08/283,096 1994-07-29
PCT/US1995/009486 WO1996004772A1 (en) 1994-07-29 1995-07-27 Internally damped circuit articles

Publications (1)

Publication Number Publication Date
KR970705329A true KR970705329A (ko) 1997-09-06

Family

ID=23084498

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970700387A KR970705329A (ko) 1994-07-29 1995-07-27 내부 제동 회로 물품(internally damped circuit articles)

Country Status (8)

Country Link
US (1) US5552209A (ko)
EP (1) EP0772958B1 (ko)
JP (1) JPH10503622A (ko)
KR (1) KR970705329A (ko)
CA (1) CA2194980A1 (ko)
DE (1) DE69523460T2 (ko)
MX (1) MX9700613A (ko)
WO (1) WO1996004772A1 (ko)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX9704789A (es) * 1995-01-13 1997-10-31 Minnesota Mining Ans Mfg Compa Laminados amortiguados con retencion forzada de sujetador, mejorada, un metodo de fabricacion, y nuevas herramientas utiles en la fabricacion.
US5672228A (en) * 1995-09-19 1997-09-30 The United States Of America As Represented By The Secretary Of The Navy Vibration-damping of structural products
US5842686A (en) * 1995-11-01 1998-12-01 Pre Finish Metals Incorporated Patterned noise damping composite
US5777821A (en) * 1995-12-14 1998-07-07 Seagate Technology, Inc. Low sway space chassis for a disc drive having a vibro-acoustic isolator
US5902656A (en) * 1996-06-21 1999-05-11 Minnesota Mining And Manufacturing Company Dampers for internal applications and articles damped therewith
US6202462B1 (en) 1998-05-26 2001-03-20 Material Sciences Corporation Method of forming noise-damping material with ultra-thin viscoelastic layer
US6999909B1 (en) 1999-10-28 2006-02-14 Seagate Technology Llc Process for designing an optimal vibration isolation mount for a disc drive
US6327155B1 (en) 1999-12-16 2001-12-04 Nortel Networks Limited Method and apparatus for preventing flamespread in an equipment assembly
CA2400787A1 (en) * 2000-02-22 2001-08-30 Ppg Industries Ohio, Inc. Electronic supports and methods and apparatus for forming apertures in electronic supports
JP2002076250A (ja) * 2000-08-29 2002-03-15 Nec Corp 半導体装置
US6381196B1 (en) 2000-10-26 2002-04-30 The United States Of America As Represented By The Secretary Of The Navy Sintered viscoelastic particle vibration damping treatment
US7451966B1 (en) * 2001-07-02 2008-11-18 Knowles Gareth J Isolator mount for shock and vibration
US6633489B2 (en) * 2001-07-31 2003-10-14 Hewlett-Packard Development Company, L.P. Dynamic isolating mount for processor packages
KR100438776B1 (ko) * 2001-11-06 2004-07-05 삼성전자주식회사 댐핑부재를 가지는 가요성 인쇄회로를 구비하는하드디스크 드라이브
US7813634B2 (en) 2005-02-28 2010-10-12 Tessera MEMS Technologies, Inc. Autofocus camera
US7312949B2 (en) * 2003-10-22 2007-12-25 Seagate Technology Llc Base deck with overmolded elastomeric and rigid structural components
US20060192858A1 (en) * 2005-02-28 2006-08-31 Calvet Robert J Oil damping for camera optical assembly
US7973106B2 (en) * 2005-04-26 2011-07-05 Shiloh Industries, Inc. Acrylate-based sound damping material and method of preparing same
JP2007109952A (ja) * 2005-10-14 2007-04-26 Bridgestone Corp 接着剤付補強板及びフレキシブルプリント基板
US8703278B2 (en) * 2006-03-28 2014-04-22 Honeywell International Inc. Light weight printed wiring board
CN101683008B (zh) * 2007-05-18 2011-08-17 日本电气株式会社 复合多层配线板
WO2008142918A1 (ja) * 2007-05-18 2008-11-27 Nec Corporation モジュール基板および、これを搭載した電子機器
US8462510B2 (en) * 2011-05-11 2013-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Board-level package with tuned mass damping structure
CN103298238B (zh) * 2012-02-22 2016-03-30 深南电路有限公司 集成声音阻尼器的pcb板及其制造方法
US9546946B2 (en) 2013-03-28 2017-01-17 Kla-Tencor Corporation Metrology target indentification, design and verification
DE102013211699A1 (de) * 2013-06-20 2014-12-24 Siemens Aktiengesellschaft Kondensatoreinrichtung
AU2014287532A1 (en) 2013-07-10 2016-02-04 Boron Nitride Power, Llc Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices
EP3375262B1 (de) * 2015-11-12 2019-12-04 Possehl Electronics Deutschland GmbH Leiterbahnenstruktur mit einem schwingungsgedämpft aufgenommenen bauteil
US9992890B1 (en) 2016-12-07 2018-06-05 Raytheon Company Modules and systems for damping excitations within fluid-filled structures
US10021779B1 (en) * 2017-11-28 2018-07-10 TopLine Coporation Quick response particle damper for printed circuit boards and planar surfaces
CN114854365B (zh) 2017-12-14 2023-10-24 艾利丹尼森公司 具有宽的阻尼温度和频率范围的压敏粘合剂
DE102018205141A1 (de) * 2018-04-05 2019-10-10 Siemens Aktiengesellschaft Schwingungsgedämpfte Schaltungsanordnung, Umrichter und Luftfahrzeug mit einer derartigen Anordnung
US10616999B2 (en) * 2018-05-31 2020-04-07 Microsoft Technology Licensing, Llc Audible signal attenuating printed circuit board

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2819032A (en) * 1953-10-20 1958-01-07 Douglas Aircraft Co Inc Aircraft fuselage having panel damping material
US3007997A (en) * 1958-07-01 1961-11-07 Gen Electric Printed circuit board
US3078969A (en) * 1959-06-15 1963-02-26 Lord Mfg Co Damped beam
US3071217A (en) * 1960-01-15 1963-01-01 Avro Aircraft Ltd Vibration damping in sheet metal structures
US3159249A (en) * 1960-01-27 1964-12-01 Univ Minnesota Damping means
US3083259A (en) * 1960-07-18 1963-03-26 Ryan Aeronautical Co Vibration dampening printed circuit board
US3160549A (en) * 1960-12-29 1964-12-08 Minnesota Mining & Mfg Vibration damping structures
GB940417A (en) * 1961-08-09 1963-10-30 Lord Mfg Co Printed wiring board
US3721746A (en) * 1971-10-01 1973-03-20 Motorola Inc Shielding techniques for r.f. circuitry
US3813582A (en) * 1973-04-03 1974-05-28 Us Army Printed circuit board vibration snubber
US3833836A (en) * 1973-06-18 1974-09-03 Sanders Associates Inc Printed circuit board package with cooling and vibration damping means
US3863881A (en) * 1973-09-10 1975-02-04 Nasa Shock absorbing mount for electrical components
US4053943A (en) * 1976-01-22 1977-10-11 Motorola Inc. Technique for damping electronic module printed wiring board
US4382587A (en) * 1980-03-20 1983-05-10 Kaco Gmbh & Co. Vibration damping element
US4594292A (en) * 1983-01-18 1986-06-10 Sumitomo Metal Industries, Ltd. Metal-resin-metal sandwich laminates suitable for use in press forming
US4566231A (en) * 1983-09-27 1986-01-28 The Boeing Company Vibration damping stiffener
JPS6110446A (ja) * 1984-06-26 1986-01-17 三井化学株式会社 複合積層体
US4752526A (en) * 1986-03-22 1988-06-21 Chisso Corporation Heat resistance-improved metal-polypropylene laminate composite
JPH03142893A (ja) * 1989-10-27 1991-06-18 Nec Corp 電子回路基板
US5108802A (en) * 1990-01-09 1992-04-28 Westinghouse Electric Corp. Internally damped thin-walled, composite longitudinal member having dedicated internal constraining layers
US5307508A (en) * 1991-05-13 1994-04-26 Motorola, Inc. Shock isolation for selective call receivers
US5308887A (en) * 1991-05-23 1994-05-03 Minnesota Mining & Manufacturing Company Pressure-sensitive adhesives
JP2613502B2 (ja) * 1991-05-31 1997-05-28 東洋紡績株式会社 制振材料用粘弾性樹脂組成物
JPH0645774A (ja) * 1991-08-01 1994-02-18 Mitsubishi Heavy Ind Ltd 電子機器用プリント基板
US5262232A (en) * 1992-01-22 1993-11-16 Minnesota Mining And Manufacturing Company Vibration damping constructions using acrylate-containing damping materials
GB2272107A (en) * 1992-10-31 1994-05-04 Marconi Gec Ltd Printed circuit board assembly
EP0603739B1 (de) * 1992-12-23 1995-10-25 Rheinmetall Industrie Aktiengesellschaft Spannungsfeste Elektronik-Baugruppe

Also Published As

Publication number Publication date
MX9700613A (es) 1997-12-31
EP0772958A1 (en) 1997-05-14
DE69523460T2 (de) 2002-06-27
CA2194980A1 (en) 1996-02-15
EP0772958B1 (en) 2001-10-24
WO1996004772A1 (en) 1996-02-15
JPH10503622A (ja) 1998-03-31
DE69523460D1 (de) 2001-11-29
US5552209A (en) 1996-09-03

Similar Documents

Publication Publication Date Title
KR970705329A (ko) 내부 제동 회로 물품(internally damped circuit articles)
US5627425A (en) Vibrating unit
US5358210A (en) Device for filtering vibration, and a fixing system comprising a plurality of such devices for fixing a load on a support
US6621658B1 (en) Vibration damping laminate with vibration isolating cut therein
JP2648991B2 (ja) 遮音及び消音複合部材並びに該複合部材の遮音層
US5143790A (en) Integrally-damped steel composite laminated structure and method of attaching same
US4846039A (en) Neck for stringed musical instruments
US5092618A (en) Ski comprising damping layers
KR970705135A (ko) 내부 댐핑된 회전가능한 정보 기억 장치(internally-damped rotatable information-storage article)
US6572178B2 (en) Dashboard support with vibration-damping feature
US3298457A (en) Acoustical barrier treatment
US5338599A (en) Vibration-damping structural component
US5916954A (en) Fiber reinforced viscoelastic material composites for passive damping
US5934692A (en) Roller skate or ice skate fitted with damping means
CN110184861A (zh) 一种复合耗能减振降噪装置
Renninger Understanding damping techniques for noise and vibration control
JPS5934903B2 (ja) シンドウカンシヨウキ
BR9508453A (pt) Processo de aperfeiçoamento das características de amortecimento de vibração de um artigo que contém um material estrutural e artigo amortecido
US4765436A (en) Dry friction damper with damping force perpendicular to principal direction of a vibration
JP3950364B2 (ja) ドア構造
KR100371702B1 (ko) 자동차의 엔진 커버 체결용 볼트
US5672228A (en) Vibration-damping of structural products
JPH0228992B2 (ko)
Terashl et al. Damping analysis of body panels for vehicle interior noise reduction
US20040072938A1 (en) Passive damping with platelet reinforced viscoelastic materials

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid