WO2008142918A1 - モジュール基板および、これを搭載した電子機器 - Google Patents

モジュール基板および、これを搭載した電子機器 Download PDF

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Publication number
WO2008142918A1
WO2008142918A1 PCT/JP2008/056785 JP2008056785W WO2008142918A1 WO 2008142918 A1 WO2008142918 A1 WO 2008142918A1 JP 2008056785 W JP2008056785 W JP 2008056785W WO 2008142918 A1 WO2008142918 A1 WO 2008142918A1
Authority
WO
WIPO (PCT)
Prior art keywords
module substrate
electronic device
printed wiring
intermediate layers
wiring boards
Prior art date
Application number
PCT/JP2008/056785
Other languages
English (en)
French (fr)
Inventor
Junya Sato
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009515114A priority Critical patent/JP5353695B2/ja
Publication of WO2008142918A1 publication Critical patent/WO2008142918A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

　プリント配線基板上の電子部品を落下衝撃力から保護し、電子機器の電気的機械的信頼性を大きく向上させ、且つ、小型化、軽量化、高機能化および多機能化を可能にする。 　本発明のモジュール基板は、夫々に電子部品が実装された複数のプリント配線基板と、複数の前記プリント配線基板間にそれぞれ挟み込まれた複数の中間層とを有する。そして、複数の中間層の少なくとも一つが、ダイラタンシー特性を有している樹脂材料からなる。
PCT/JP2008/056785 2007-05-18 2008-04-04 モジュール基板および、これを搭載した電子機器 WO2008142918A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009515114A JP5353695B2 (ja) 2007-05-18 2008-04-04 モジュール基板および、これを搭載した電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007132709 2007-05-18
JP2007-132709 2007-05-18

Publications (1)

Publication Number Publication Date
WO2008142918A1 true WO2008142918A1 (ja) 2008-11-27

Family

ID=40031634

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056785 WO2008142918A1 (ja) 2007-05-18 2008-04-04 モジュール基板および、これを搭載した電子機器

Country Status (2)

Country Link
JP (1) JP5353695B2 (ja)
WO (1) WO2008142918A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013183597A1 (ja) 2012-06-05 2013-12-12 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 電子機器の表示部および当該表示部を有する携帯端末機器
JP2016092176A (ja) * 2014-11-04 2016-05-23 株式会社村田製作所 電子部品内蔵基板およびその製造方法
WO2017080657A1 (de) * 2015-11-12 2017-05-18 Possehl Electronics Deutschland Gmbh Leiterbahnenstruktur mit einem schwingungsgedämpft aufgenommenen bauteil
GB2553428A (en) * 2016-08-18 2018-03-07 Lenovo Singapore Pte Ltd Electronic device with structural layer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10503622A (ja) * 1994-07-29 1998-03-31 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー 内部振動吸収回路物品
JP2003152356A (ja) * 2001-11-09 2003-05-23 Casio Comput Co Ltd 基板保持構造
JP2006186058A (ja) * 2004-12-27 2006-07-13 Matsushita Electric Ind Co Ltd 部品内蔵モジュールとその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4172433B2 (ja) * 2004-07-28 2008-10-29 松下電器産業株式会社 基板接続部材とそれを用いた三次元接続構造体並びに三次元接続構造体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10503622A (ja) * 1994-07-29 1998-03-31 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー 内部振動吸収回路物品
JP2003152356A (ja) * 2001-11-09 2003-05-23 Casio Comput Co Ltd 基板保持構造
JP2006186058A (ja) * 2004-12-27 2006-07-13 Matsushita Electric Ind Co Ltd 部品内蔵モジュールとその製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013183597A1 (ja) 2012-06-05 2013-12-12 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 電子機器の表示部および当該表示部を有する携帯端末機器
JP2016092176A (ja) * 2014-11-04 2016-05-23 株式会社村田製作所 電子部品内蔵基板およびその製造方法
WO2017080657A1 (de) * 2015-11-12 2017-05-18 Possehl Electronics Deutschland Gmbh Leiterbahnenstruktur mit einem schwingungsgedämpft aufgenommenen bauteil
US10582610B2 (en) 2015-11-12 2020-03-03 Possehl Electronics Deutschland Gmbh Conductor path structure having a component received in a vibration-damped manner
US10779399B2 (en) 2015-11-12 2020-09-15 Possehl Electronics Deutschland Gmbh Conductor path structure having a component received in a vibration-damped manner
GB2553428A (en) * 2016-08-18 2018-03-07 Lenovo Singapore Pte Ltd Electronic device with structural layer
GB2553428B (en) * 2016-08-18 2019-09-04 Lenovo Singapore Pte Ltd Electronic device with structural layer
EP3285140B1 (en) * 2016-08-18 2019-10-09 Lenovo (Singapore) Pte. Ltd. Electronic device with structural layer
US10503209B2 (en) 2016-08-18 2019-12-10 Lenovo (Singapore) Pte. Ltd. Electronic device with structural layer

Also Published As

Publication number Publication date
JPWO2008142918A1 (ja) 2010-08-05
JP5353695B2 (ja) 2013-11-27

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