WO2008146538A1 - 複合多層配線板 - Google Patents

複合多層配線板 Download PDF

Info

Publication number
WO2008146538A1
WO2008146538A1 PCT/JP2008/056582 JP2008056582W WO2008146538A1 WO 2008146538 A1 WO2008146538 A1 WO 2008146538A1 JP 2008056582 W JP2008056582 W JP 2008056582W WO 2008146538 A1 WO2008146538 A1 WO 2008146538A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
multilayer wiring
composite multilayer
electronic device
intermediate layers
Prior art date
Application number
PCT/JP2008/056582
Other languages
English (en)
French (fr)
Inventor
Junya Sato
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to CN2008800165721A priority Critical patent/CN101683008B/zh
Priority to US12/600,677 priority patent/US8404979B2/en
Priority to JP2009516213A priority patent/JP5353696B2/ja
Publication of WO2008146538A1 publication Critical patent/WO2008146538A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　プリント配線基板上の電子部品を落下衝撃力から保護し、電子機器の電気的機械的信頼性を大きく向上させ、且つ、小型化、軽量化、高機能化および多機能化を可能にする。 　本発明の複合多層配線板は、複数の前記プリント配線基板間にそれぞれ挟み込まれた複数の中間層とを有し、前記複数の中間層の少なくとも一つが、ダイラタンシー特性を有している樹脂材料からなる。
PCT/JP2008/056582 2007-05-18 2008-04-02 複合多層配線板 WO2008146538A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800165721A CN101683008B (zh) 2007-05-18 2008-04-02 复合多层配线板
US12/600,677 US8404979B2 (en) 2007-05-18 2008-04-02 Composite multilayer wiring board
JP2009516213A JP5353696B2 (ja) 2007-05-18 2008-04-02 複合多層配線板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-132710 2007-05-18
JP2007132710 2007-05-18

Publications (1)

Publication Number Publication Date
WO2008146538A1 true WO2008146538A1 (ja) 2008-12-04

Family

ID=40316822

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056582 WO2008146538A1 (ja) 2007-05-18 2008-04-02 複合多層配線板

Country Status (4)

Country Link
US (1) US8404979B2 (ja)
JP (1) JP5353696B2 (ja)
CN (1) CN101683008B (ja)
WO (1) WO2008146538A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013183597A1 (ja) 2012-06-05 2013-12-12 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 電子機器の表示部および当該表示部を有する携帯端末機器
WO2014069389A1 (ja) * 2012-10-30 2014-05-08 株式会社フジクラ プリント配線板
JPWO2016067434A1 (ja) * 2014-10-30 2017-08-10 株式会社 アコースティックイノベーションズ 振動抑制タイヤ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11643577B2 (en) * 2017-08-08 2023-05-09 Sony Corporation Adhesive, electronic apparatus, and optical apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10503622A (ja) * 1994-07-29 1998-03-31 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー 内部振動吸収回路物品
JP2006186058A (ja) * 2004-12-27 2006-07-13 Matsushita Electric Ind Co Ltd 部品内蔵モジュールとその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3007997A (en) * 1958-07-01 1961-11-07 Gen Electric Printed circuit board
US3083259A (en) * 1960-07-18 1963-03-26 Ryan Aeronautical Co Vibration dampening printed circuit board
US3160549A (en) * 1960-12-29 1964-12-08 Minnesota Mining & Mfg Vibration damping structures
US3813582A (en) * 1973-04-03 1974-05-28 Us Army Printed circuit board vibration snubber
US4053943A (en) * 1976-01-22 1977-10-11 Motorola Inc. Technique for damping electronic module printed wiring board
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
JP2002151866A (ja) 2000-11-14 2002-05-24 Nec Corp 携帯機器の強度アップ実装構造
ES2346743T3 (es) 2001-09-13 2010-10-20 Daniel James Plant Material flexible absorbente de energia y procedimientos de fabricacion del mismo.
JP3698091B2 (ja) 2001-11-09 2005-09-21 カシオ計算機株式会社 基板保持構造
GB0130834D0 (en) 2001-12-22 2002-02-06 Design Blue Ltd Energy absorbing material
JP2003304081A (ja) 2002-04-08 2003-10-24 Nec Corp 基板取付治具および基板取付方法
JP2005514222A (ja) 2002-09-13 2005-05-19 プラント，ダニエル，ジェームス 可撓性エネルギー吸収材およびその製造方法
JP2004332868A (ja) * 2003-05-09 2004-11-25 Sony Corp 緩衝機構及び携帯型電子機器
JP4172433B2 (ja) * 2004-07-28 2008-10-29 松下電器産業株式会社 基板接続部材とそれを用いた三次元接続構造体並びに三次元接続構造体の製造方法
JP4312148B2 (ja) 2004-12-13 2009-08-12 パナソニック株式会社 中継基板と立体配線構造体
US7896019B2 (en) * 2005-11-12 2011-03-01 Massachusetts Institute For Technology Active controlled energy absorber using responsive fluids
CA2633622C (en) * 2005-12-29 2014-07-15 Joel L. Sereboff Energy absorbing composition and impact and sound absorbing applications thereof
JP5283944B2 (ja) * 2008-03-25 2013-09-04 株式会社東芝 表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10503622A (ja) * 1994-07-29 1998-03-31 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー 内部振動吸収回路物品
JP2006186058A (ja) * 2004-12-27 2006-07-13 Matsushita Electric Ind Co Ltd 部品内蔵モジュールとその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013183597A1 (ja) 2012-06-05 2013-12-12 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 電子機器の表示部および当該表示部を有する携帯端末機器
WO2014069389A1 (ja) * 2012-10-30 2014-05-08 株式会社フジクラ プリント配線板
US9585238B2 (en) 2012-10-30 2017-02-28 Fujikura Ltd. Printed circuit board
JPWO2016067434A1 (ja) * 2014-10-30 2017-08-10 株式会社 アコースティックイノベーションズ 振動抑制タイヤ

Also Published As

Publication number Publication date
JP5353696B2 (ja) 2013-11-27
US20100147566A1 (en) 2010-06-17
CN101683008B (zh) 2011-08-17
CN101683008A (zh) 2010-03-24
US8404979B2 (en) 2013-03-26
JPWO2008146538A1 (ja) 2010-08-19

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