KR970076904A - 의사 꼬임 도선을 구비한 평탄 가요성 케이블 - Google Patents
의사 꼬임 도선을 구비한 평탄 가요성 케이블 Download PDFInfo
- Publication number
- KR970076904A KR970076904A KR1019970020576A KR19970020576A KR970076904A KR 970076904 A KR970076904 A KR 970076904A KR 1019970020576 A KR1019970020576 A KR 1019970020576A KR 19970020576 A KR19970020576 A KR 19970020576A KR 970076904 A KR970076904 A KR 970076904A
- Authority
- KR
- South Korea
- Prior art keywords
- conductors
- flexible
- electrical cable
- lead
- straight portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004020 conductor Substances 0.000 claims abstract 25
- 239000000758 substrate Substances 0.000 claims abstract 9
- 230000007704 transition Effects 0.000 claims abstract 6
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 230000000737 periodic effect Effects 0.000 claims 1
- 230000007423 decrease Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0876—Flat or ribbon cables comprising twisted pairs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8153069A JP2860468B2 (ja) | 1996-05-24 | 1996-05-24 | 擬似ツイストペア平型柔軟ケーブル |
| JP96-153069 | 1996-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970076904A true KR970076904A (ko) | 1997-12-12 |
Family
ID=15554314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970020576A Withdrawn KR970076904A (ko) | 1996-05-24 | 1997-05-24 | 의사 꼬임 도선을 구비한 평탄 가요성 케이블 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5939952A (enExample) |
| EP (1) | EP0809260B1 (enExample) |
| JP (1) | JP2860468B2 (enExample) |
| KR (1) | KR970076904A (enExample) |
| DE (1) | DE69719853T2 (enExample) |
| SG (1) | SG55320A1 (enExample) |
| TW (1) | TW322643B (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3528484B2 (ja) * | 1996-12-27 | 2004-05-17 | モレックス インコーポレーテッド | 擬似ツイストペア平型柔軟ケーブル |
| US6492595B2 (en) | 1997-10-01 | 2002-12-10 | Decorp Americas, Inc. | Flat surface-mounted multi-purpose wire |
| US6300846B1 (en) * | 1999-03-18 | 2001-10-09 | Molex Incorporated | Flat flexible cable with ground conductors |
| US6208219B1 (en) * | 1999-05-12 | 2001-03-27 | Samuel Singer | Broadband RF circuits with microstrips laid out in randomly meandering paths |
| US6646207B1 (en) | 2000-05-12 | 2003-11-11 | Thomson Licensing S. A. | Double helix lead dressing of flat flexible cables |
| US6433272B1 (en) * | 2000-09-19 | 2002-08-13 | Storage Technology Corporation | Crosstalk reduction in constrained wiring assemblies |
| US6573801B1 (en) * | 2000-11-15 | 2003-06-03 | Intel Corporation | Electromagnetic coupler |
| JP2003031288A (ja) * | 2001-07-18 | 2003-01-31 | Yazaki Corp | フラット回路体及びその製造方法 |
| DE10157678C2 (de) * | 2001-11-24 | 2003-10-16 | Daimler Chrysler Ag | Hochfrequenzfestes Folienkabel für Datenleitungen |
| US6959533B2 (en) | 2002-01-10 | 2005-11-01 | International Business Machines Corporation | Apparatus and method for producing twisted pair cables with reduced propagation delay and crosstalk |
| US6774741B2 (en) * | 2002-05-28 | 2004-08-10 | Decorp Americas, Inc. | Non-uniform transmission line and method of fabricating the same |
| US7737359B2 (en) * | 2003-09-05 | 2010-06-15 | Newire Inc. | Electrical wire and method of fabricating the electrical wire |
| US7145073B2 (en) * | 2003-09-05 | 2006-12-05 | Southwire Company | Electrical wire and method of fabricating the electrical wire |
| US7217884B2 (en) | 2004-03-02 | 2007-05-15 | Southwire Company | Electrical wire and method of fabricating the electrical wire |
| US7223919B2 (en) * | 2004-05-11 | 2007-05-29 | Gagne Norman P | Flat flexible cable with integrated stiffener |
| US7601919B2 (en) * | 2005-10-21 | 2009-10-13 | Neophotonics Corporation | Printed circuit boards for high-speed communication |
| JP2007149805A (ja) * | 2005-11-25 | 2007-06-14 | Funai Electric Co Ltd | プリント配線板 |
| TWI345243B (en) * | 2007-08-14 | 2011-07-11 | Ind Tech Res Inst | Inter-helix inductor devices |
| DE102008042845A1 (de) * | 2008-10-15 | 2010-04-22 | Robert Bosch Gmbh | Elektrische Leitungsanordnung |
| US20100307798A1 (en) * | 2009-06-03 | 2010-12-09 | Izadian Jamal S | Unified scalable high speed interconnects technologies |
| CN102055051B (zh) * | 2009-10-30 | 2015-09-30 | 清华大学 | 一种高阻抗传输线 |
| GB2482860A (en) | 2010-07-28 | 2012-02-22 | In2Tec Ltd | Flexible twisted-pair wiring system |
| US9240619B2 (en) * | 2011-04-28 | 2016-01-19 | Texas Instruments Incorporated | Differential transmission line pairs using a coupling orthogonalization approach to reduce cross-talk |
| DE102011113656A1 (de) * | 2011-09-19 | 2013-03-21 | Erni Electronics Gmbh | Mehrlagige elektrische Leiterplatte |
| US9590288B2 (en) * | 2013-04-09 | 2017-03-07 | Taiyo Yuden Co., Ltd. | Multilayer circuit substrate |
| JP5542231B1 (ja) * | 2013-04-09 | 2014-07-09 | 太陽誘電株式会社 | 多層回路基板 |
| US9590339B2 (en) | 2013-05-09 | 2017-03-07 | Commscope, Inc. Of North Carolina | High data rate connectors and cable assemblies that are suitable for harsh environments and related methods and systems |
| US8965159B1 (en) | 2013-11-07 | 2015-02-24 | International Business Machines Corporation | Implementing twisted pair waveguide for electronic substrates |
| CN105097758B (zh) * | 2014-05-05 | 2018-10-26 | 日月光半导体制造股份有限公司 | 衬底、其半导体封装及其制造方法 |
| CN104039076A (zh) * | 2014-06-17 | 2014-09-10 | 浪潮(北京)电子信息产业有限公司 | 一种减小差分电路阻抗不匹配程度的绕线方法和系统 |
| KR20170101961A (ko) | 2014-12-30 | 2017-09-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기 도체 |
| JP2018074027A (ja) * | 2016-10-31 | 2018-05-10 | 株式会社ジャパンディスプレイ | 回路基板及び表示装置 |
| JP6973662B2 (ja) * | 2018-11-14 | 2021-12-01 | 株式会社村田製作所 | フレキシブル基板及び電子機器 |
| DE102020105012A1 (de) | 2020-02-26 | 2021-08-26 | Bayerische Motoren Werke Aktiengesellschaft | Folienleiter sowie Kraftfahrzeug mit einem Folienleiter |
| DE102021201446A1 (de) | 2021-02-16 | 2022-08-18 | Robert Bosch Gesellschaft mit beschränkter Haftung | Leitungsanordnung und Steuergerät mit einer Leitungsanordnung |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3617952A (en) * | 1969-08-27 | 1971-11-02 | Ibm | Stepped-impedance directional coupler |
| US3761842A (en) * | 1972-06-01 | 1973-09-25 | Bell Telephone Labor Inc | Twisted pair flat conductor cable with means to equalize impedance and propagation velocity |
| US3764727A (en) * | 1972-06-12 | 1973-10-09 | Western Electric Co | Electrically conductive flat cable structures |
| US4991665A (en) * | 1988-12-05 | 1991-02-12 | Buss Systems Incorporated | Flexible circuit conductor run |
| JP3047572B2 (ja) * | 1991-10-25 | 2000-05-29 | 住友電装株式会社 | フラット回路体 |
| JPH06111642A (ja) * | 1992-09-25 | 1994-04-22 | Yazaki Corp | 積層ワイヤハーネスにおける電磁妨害低減方法 |
| US5397862A (en) * | 1993-08-31 | 1995-03-14 | Motorola, Inc. | Horizontally twisted-pair planar conductor line structure |
| JP3528484B2 (ja) * | 1996-12-27 | 2004-05-17 | モレックス インコーポレーテッド | 擬似ツイストペア平型柔軟ケーブル |
-
1996
- 1996-05-24 JP JP8153069A patent/JP2860468B2/ja not_active Expired - Fee Related
-
1997
- 1997-05-21 EP EP97108249A patent/EP0809260B1/en not_active Expired - Lifetime
- 1997-05-21 DE DE69719853T patent/DE69719853T2/de not_active Expired - Fee Related
- 1997-05-21 US US08/861,291 patent/US5939952A/en not_active Expired - Fee Related
- 1997-05-22 TW TW086106877A patent/TW322643B/zh not_active IP Right Cessation
- 1997-05-23 SG SG1997001694A patent/SG55320A1/en unknown
- 1997-05-24 KR KR1019970020576A patent/KR970076904A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0809260A2 (en) | 1997-11-26 |
| US5939952A (en) | 1999-08-17 |
| JP2860468B2 (ja) | 1999-02-24 |
| TW322643B (enExample) | 1997-12-11 |
| JPH09320361A (ja) | 1997-12-12 |
| EP0809260A3 (en) | 1998-11-11 |
| SG55320A1 (en) | 1998-12-21 |
| EP0809260B1 (en) | 2003-03-19 |
| DE69719853T2 (de) | 2003-12-24 |
| DE69719853D1 (de) | 2003-04-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19970524 |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19970524 Comment text: Request for Examination of Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19990628 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 19991023 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19990628 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| PC1205 | Withdrawal of application forming a basis of a converted application | ||
| WICV | Withdrawal of application forming a basis of a converted application |