KR970067735A - 반도체 디바이스 및 그 제조 방법 - Google Patents
반도체 디바이스 및 그 제조 방법 Download PDFInfo
- Publication number
- KR970067735A KR970067735A KR1019970008144A KR19970008144A KR970067735A KR 970067735 A KR970067735 A KR 970067735A KR 1019970008144 A KR1019970008144 A KR 1019970008144A KR 19970008144 A KR19970008144 A KR 19970008144A KR 970067735 A KR970067735 A KR 970067735A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- film circuit
- film
- plate
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract 4
- 230000003014 reinforcing effect Effects 0.000 claims abstract 12
- 230000002787 reinforcement Effects 0.000 claims abstract 11
- 238000005530 etching Methods 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8054478A JP2937111B2 (ja) | 1996-03-12 | 1996-03-12 | 半導体装置とその製造方法 |
| JP96-054478 | 1996-03-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970067735A true KR970067735A (ko) | 1997-10-13 |
Family
ID=12971784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970008144A KR970067735A (ko) | 1996-03-12 | 1997-03-11 | 반도체 디바이스 및 그 제조 방법 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2937111B2 (zh) |
| KR (1) | KR970067735A (zh) |
| TW (1) | TW334606B (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3321357B2 (ja) * | 1996-05-30 | 2002-09-03 | 株式会社東芝 | 半導体装置とその組み立て方法 |
| JP3173459B2 (ja) | 1998-04-21 | 2001-06-04 | 日本電気株式会社 | 半導体装置の製造方法 |
| KR20000015580A (ko) * | 1998-08-31 | 2000-03-15 | 김규현 | 반도체 패키지용 써킷테이프 |
| US6300168B1 (en) | 1999-01-07 | 2001-10-09 | Sony Corp | Method of manufacturing a semiconductor device |
| KR20010057046A (ko) * | 1999-12-17 | 2001-07-04 | 이형도 | 캐비티를 갖는 패키지 기판 |
| CN111788516A (zh) * | 2018-03-16 | 2020-10-16 | 深圳市柔宇科技股份有限公司 | Cof载带及其加工方法、cof载带加工设备 |
-
1996
- 1996-03-12 JP JP8054478A patent/JP2937111B2/ja not_active Expired - Fee Related
-
1997
- 1997-03-08 TW TW086102845A patent/TW334606B/zh active
- 1997-03-11 KR KR1019970008144A patent/KR970067735A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| TW334606B (en) | 1998-06-21 |
| JPH09246315A (ja) | 1997-09-19 |
| JP2937111B2 (ja) | 1999-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |