KR970032331A - 중합 접착제를 금속에 접착시키기 위한 접착력 촉진층을 이용하는 히트싱크 어셈블리 및 그 제조방법 - Google Patents
중합 접착제를 금속에 접착시키기 위한 접착력 촉진층을 이용하는 히트싱크 어셈블리 및 그 제조방법 Download PDFInfo
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- KR970032331A KR970032331A KR1019960043269A KR19960043269A KR970032331A KR 970032331 A KR970032331 A KR 970032331A KR 1019960043269 A KR1019960043269 A KR 1019960043269A KR 19960043269 A KR19960043269 A KR 19960043269A KR 970032331 A KR970032331 A KR 970032331A
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Abstract
패키지 성능과 신뢰성 요구를 충족시키는 소정의 캡(cap)과 중합 접착제 사이에 계면 접착을 제공하는 접착력-촉진 금속 박막층에 의해 멀티-칩 모듈 캡을 중합체의 히트싱크 접착체에 부착시키는 방법이 개시되어 있다. 또한, 접착력-촉진 금속 박막층 및 이들의 생산물을 사용하여 실리콘-함유 중합 접착제와 금속 표면사이에서 접착력을 촉진시키는 방법이 개시되어 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 1은 디바이스의 대표적인 우측 단면을 도시한 본 발명에 따른 히트싱크 어셈블리의 단면도이다.
Claims (33)
- 히트싱크 어셈블리에 있어서, 기판과 상기 기판의 제1표면상에 실장된 적어도 하나의 집적회로 칩을 구비한 멀티-칩 모듈과; 상부 외측 표면을 가지며, 상기 적어도 하나의 집적회로 칩을 에워싸는 캡(cap)과; 상기 적어도 하나의 집적회로 칩과 상기 캡 사이에서 열 전달을 하기 위한 수단과; 중합 접착제층과; 상기 캡 표면과, 금속성 재료 및 상기 캡 표면을 상기 중합 접착제층에 접착시키는데 효과적인 두께를 포함하는 상기 중합 접착제층 사이에 개재된 접착성 금속박막과; 상기 중합 접착제층에 접착된 히트싱크를 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 캡 표면은 150 파운드/인치2이하의 실리콘 엘라스토머 재료에 대한 전단응력을 갖는 금속을 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 캡 표면은 금속을 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 3 항에 있어서, 상기 금속은 니켈을 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 접착성 금속 박막은 Ti, Zr, Hf, V, Nb, Ta, Cr, Mo 및 W, 그리고 이들의 합금으로 이루어지는 그룹에서 선택된 어느 한 금속인 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 접착성 금속 박막은 크롬 및 크롬의 합금으로 이루어지는 그룹에서 선택된 어느 한 금속인 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 접착성 금속 박막은 50Å 내지 10,000Å의 두께를 갖는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 5 항에 있어서, 상기 접착성 금속 박막은 50Å 내지 10,000Å의 두께를 갖는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 접착성 금속 박막은 약 450Å 내지 550Å의 두께를 갖는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 5 항에 있어서, 상기 접착성 금속 박막은 약 450Å 내지 550Å의 두께를 갖는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 6 항에 있어서, 상기 접착성 금속 박막은 약 450Å 내지 550Å의 두께를 갖는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 적어도 하나의 집적회로 칩은 하부로 향하는 회로면과 회로부 없이 상부로 향하는 반대면을 가지며, 상기 회로면은 솔더 범프들을 통해 상기 기판에 부착되는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 적어도 하나의 집적회로 칩과 상기 캡사이에서 열 전달을 행하는 상기 수단은 상기 캡의 내부면과 상기 적어도 하나의 집적회로 칩사이에 개재된 열 페이스트를 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 13 항에 있어서, 상기 열 페이스트는, (a) 폴리알파 올레핀 오일, 탄화수소 미네랄 오일, 실리콘 오일로 이루어진 그룹에서 선택된 어느 하나의 오일과, (b) 알루미늄 파우더, 알루미나 파우더 및 이들의 혼합물로 이루어지는 그룹에서 선택된 어느 하나의 미립자 충전재를 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 중합 접착제는 실리콘 엘라스토머 재료를 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 15 항에 있어서, 상기 실리콘 엘라스토머 재료는 실내온도에서 경화처리된 실리콘 중합 접착제를 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 캡은 구리 텅스텐, 알루미늄 실리콘 탄화물, 알루미늄, 알루미늄 질화물, 탄소, 붕소 질화물 및 다이아몬드에서 선택된 어느 한 재료를 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 캡은 구리를 포함하는 것을 특징으로 하는 히트싱크 어셈블러.
- 제 1 항에 있어서, 상기 캡은 구리 텅스텐 합성물을 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 캡은 구리를 포함하는 기판 캡 구조와 니켈을 함유하는 금속 표면층을 포함하며, 상기 니켈 표면층은 상기 상부 외측 표면을 형성하는 것을 특징으로 하는 히트싱크 어셈블리.
- 제 1 항에 있어서, 상기 적어도 하나의 집적회로 칩은 다수의 집적회로 칩들을 포함하는 것을 특징으로 하는 히트싱크 어셈블리.
- 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법에 있어서, (a) 경화되지 않은 실리콘-함유 중합 접착제와 상기 중합 접착제에 대해 미약한 접착력을 갖는 금속을 포함하는 표면을 갖는 기판을 준비하는 단계와; (b) 상기 기판 표면상에 접착성 금속박막을 증착하는 단계와; (c) 상기 중합 접착제를 상기 접착성 금속박막에 접촉시키는 단계와; (d)상기 중합 접착제를 응고시키는 단계를 포함하며, 상기 접착성 금속박막은 금속 재료와 상기 기판 표면을 상기 중합 접착제에 접착시키는데 효과적인 두께를 포함하는 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항에 있어서, 상기 기판 표면은 150 파운드/인치2이하의 실리콘 엘라스토머 재료에 대한 전단응력을 갖는 금속을 포함하는 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항에 있어서, 상기 기판 표면은 니켈을 포함하는 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항에 있어서, 상기 접착성 금속 박막은 Ti, Zr, Hf, V, Nb, Ta, Cr, Mo 및 W, 그리고 이들의 합금으로 이루어지는 그룹에서 선택된 어느 한 금속인 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항에 있어서, 상기 접착성 금속 박막은 크롬 및 크롬의 합금으로 이루어지는 그룹에서 선택된 어느 한 금속인 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항에 있어서, 상기 접착성 금속 박막을 도포하는 상기 단계는 스퍼터링을 포함하는 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항에 있어서, 상기 접착성 금속 박막은 50Å 내지 10,000Å의 두께로 증착되는 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항에 있어서, 상기 기판 표면은 니켈을 포함하며, 천연 니켈 산화물을 제거하기에 적합하도록 단계(b)전에 스퍼터 에칭되는 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항에 있어서, 상기 중합 접착제는 실리콘 엘라스토머 불질을 포함하는 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 30 항에 있어서, 상기 실리콘 엘라스토머 재료는 단계(d)에서 실내온도로 경화된 실리콘 중합 접착제를 포함하는 것을 특징으로 하는 실리콘-함유 중합 접착제를 중합 접착제에 대해 미약한 직접 접착력을 갖는 금속에 접착시키는 방법.
- 제 22 항의 방법에 의한 생산물.
- 제 26 항의 방법에 의한 생산물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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-
1996
- 1996-09-30 KR KR1019960043269A patent/KR100245971B1/ko not_active IP Right Cessation
- 1996-10-24 US US08/735,925 patent/US6451155B1/en not_active Expired - Fee Related
- 1996-11-18 CN CN96114497A patent/CN1127140C/zh not_active Expired - Fee Related
-
1997
- 1997-07-30 US US08/910,547 patent/US5931222A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100354462B1 (ko) * | 1998-11-04 | 2002-09-30 | 가부시끼가이샤 도시바 | 모듈형 반도체 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN1153401A (zh) | 1997-07-02 |
KR100245971B1 (ko) | 2000-03-02 |
US6451155B1 (en) | 2002-09-17 |
US5931222A (en) | 1999-08-03 |
CN1127140C (zh) | 2003-11-05 |
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