KR970023806A - 화학 기계적 연마 시스템내의 슬러리의 분해 장치 및 방법 - Google Patents

화학 기계적 연마 시스템내의 슬러리의 분해 장치 및 방법 Download PDF

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Publication number
KR970023806A
KR970023806A KR1019960048973A KR19960048973A KR970023806A KR 970023806 A KR970023806 A KR 970023806A KR 1019960048973 A KR1019960048973 A KR 1019960048973A KR 19960048973 A KR19960048973 A KR 19960048973A KR 970023806 A KR970023806 A KR 970023806A
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KR
South Korea
Prior art keywords
polishing table
slurry
flexible member
substrate
polishing
Prior art date
Application number
KR1019960048973A
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English (en)
Inventor
디. 톨리스 로버트
엘. 구쓰리 윌리엄
마크스 제프리
쳉 트성난
스펙터 샘욘
에이. 오카나다 아반
쉔던 놈
Original Assignee
제임스 조셉 드롱
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 제임스 조셉 드롱, 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 제임스 조셉 드롱
Publication of KR970023806A publication Critical patent/KR970023806A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

중심 포트를 통해 슬러리를 펌핑시키거나, 슬러리 공급 관으로부터 연마대의 표면상에 슬러리를 아래로 떨어뜨림으로써 슬러리가 연마대의 표면에 제공된다. 하나 이상의 유연한 부재를 갖는 슬러리 와이퍼는 연마대를 가로질러 얇고 균일하게 슬러리를 일소한다. 제어 시스템은 캐리어 헤드의 운동에 의해 연마대에 있어서의 슬러리의 분배를 조정한다.

Description

화학 기계적 연마 시스템내의 슬러리의 분해 장치 및 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도3은 화학 기계 연마 장치의 개략적인 투시도이다.

Claims (15)

  1. 화학 기계적 연마 장치내에서 기판을 연마하기 위한 방법에 있어서, 기판을 회전시키는 단계와, 연마대를 회전시키는 단계와, 상기 기판을 상기 연마대와 접촉시키는 단계 및, 상기 연마대내에 있는 중심 포트를 통해 슬러리 용액을 분배하는 단계를 포함하는 방법.
  2. 제1항에 있어서, 분배 단계는 상기 기판이 상기 중심 포토 위로 위치되지 않는 경우에, 제1흐름 속도로 상기 슬러리 용액을 분배하는 단계와, 상기 기판이 상기 중심 포트위에 위치되는 경우에, 제2흐름 속도로 상기 슬러리 용액을 분배하는 단계를 포함하고 있는 방법.
  3. 제2항에 있어서, 상기 제2흐름 속도는 상기 제1흐름 속도보다 큰 방법.
  4. 제1항에 있어서, 상기 분배 단계는 상기 중심 포트를 통해 간헐적인 파동으로 슬러리를 펌핑하는 단계를 포함하는 방법.
  5. 제4항에 있어서, 상기 분배 단계는 상기 캐리어 헤드로부터 압력을 극복하기에 충분히 높은 흐름 속도로 상기 슬러리를 간헐적인 파동으로 펌핑하는 단계를 포함하는 방법.
  6. 화학 기계적 연마 장치에 있어서, 회전식 연마대와, 상기 슬러리를 연마대의 표면에 제공하기 위한 디스펜서 및, 상기 연마대위의 슬러리를 제거하도록 상기 연마대의 표면위에 배열되는 유연한 부재를 포함하는 장치.
  7. 제6항에 있어서, 상기 유연한 부재는 상기 연마대의 엣지로부터 상기 연마대의 중심으로 이르기 까지 연장하는 장치.
  8. 제7항에 있어서, 상기 유연한 부재는 선형인 장치.
  9. 제6항에 있어서, 상기 연마대로부터 상기 유연한 부재를 분리하는 간극이 있는 장치.
  10. 제6항에 있어서, 상기 유연한 부재는 상기 연마대의 표면과 접하고 있는 장치.
  11. 제6항에 있어서, 상기 연마대의 표면위에 배열되는 제2유연한 부재를 더 포함하는 장치.
  12. 제6항에 있어서, 상기 유연한 부재는 각을 이루는 엣지를 포함하는 장치.
  13. 제6항에 있어서, 상기 연마대의 엣지로부터 상기 연마대의 중심에 이르기까지 연장하는 경질 아암을 더 포함하며, 상기 유연한 부재는 상기 아암에 연결되어 있는 장치.
  14. 제13항에 있어서, 상기 연마대의 표면위로 상기 아암을 이동시키도록 상기 아암에 연결되어 있는 회전 모터를 더 포함하고 있는 장치.
  15. 제14항에 있어서, 상기 연마대에 기판을 가압시키는 캐리어 헤드 및, 상기 캐리어 헤드와 상기 아암의 충돌을 방지하도록 상기 캐리어 헤드와 아암의 운동을 제어하는 제어 시스템을 더 포함하고 있는 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960048973A 1995-10-27 1996-10-28 화학 기계적 연마 시스템내의 슬러리의 분해 장치 및 방법 KR970023806A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/549,481 US5709593A (en) 1995-10-27 1995-10-27 Apparatus and method for distribution of slurry in a chemical mechanical polishing system
US08/549,481 1995-10-27

Publications (1)

Publication Number Publication Date
KR970023806A true KR970023806A (ko) 1997-05-30

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Country Status (3)

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US (3) US5709593A (ko)
JP (1) JPH09186118A (ko)
KR (1) KR970023806A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190011769A (ko) * 2016-06-24 2019-02-07 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스

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US6280297B1 (en) 2001-08-28
US6051499A (en) 2000-04-18
US5709593A (en) 1998-01-20
JPH09186118A (ja) 1997-07-15

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