KR970015313U - 반도체 웨이퍼의 균열검사장치 - Google Patents

반도체 웨이퍼의 균열검사장치

Info

Publication number
KR970015313U
KR970015313U KR2019950024571U KR19950024571U KR970015313U KR 970015313 U KR970015313 U KR 970015313U KR 2019950024571 U KR2019950024571 U KR 2019950024571U KR 19950024571 U KR19950024571 U KR 19950024571U KR 970015313 U KR970015313 U KR 970015313U
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
inspection device
crack inspection
wafer crack
semiconductor
Prior art date
Application number
KR2019950024571U
Other languages
English (en)
Other versions
KR0127232Y1 (ko
Inventor
장해도
최웅기
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950024571U priority Critical patent/KR0127232Y1/ko
Publication of KR970015313U publication Critical patent/KR970015313U/ko
Application granted granted Critical
Publication of KR0127232Y1 publication Critical patent/KR0127232Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR2019950024571U 1995-09-13 1995-09-13 반도체 웨이퍼의 균열검사장치 KR0127232Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950024571U KR0127232Y1 (ko) 1995-09-13 1995-09-13 반도체 웨이퍼의 균열검사장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950024571U KR0127232Y1 (ko) 1995-09-13 1995-09-13 반도체 웨이퍼의 균열검사장치

Publications (2)

Publication Number Publication Date
KR970015313U true KR970015313U (ko) 1997-04-28
KR0127232Y1 KR0127232Y1 (ko) 1998-12-01

Family

ID=19423166

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950024571U KR0127232Y1 (ko) 1995-09-13 1995-09-13 반도체 웨이퍼의 균열검사장치

Country Status (1)

Country Link
KR (1) KR0127232Y1 (ko)

Also Published As

Publication number Publication date
KR0127232Y1 (ko) 1998-12-01

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