KR970008465A - 리드프레임의 흡착유지장치 - Google Patents

리드프레임의 흡착유지장치 Download PDF

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Publication number
KR970008465A
KR970008465A KR1019960006990A KR19960006990A KR970008465A KR 970008465 A KR970008465 A KR 970008465A KR 1019960006990 A KR1019960006990 A KR 1019960006990A KR 19960006990 A KR19960006990 A KR 19960006990A KR 970008465 A KR970008465 A KR 970008465A
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KR
South Korea
Prior art keywords
lead frame
lead
holding device
suction
suction nozzles
Prior art date
Application number
KR1019960006990A
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English (en)
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KR100238568B1 (ko
Inventor
에이지 기쿠치
고헤이 스즈키
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
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Application filed by 후지야마 겐지, 가부시키가이샤 신가와 filed Critical 후지야마 겐지
Publication of KR970008465A publication Critical patent/KR970008465A/ko
Application granted granted Critical
Publication of KR100238568B1 publication Critical patent/KR100238568B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/10—Associated with forming or dispersing groups of intersupporting articles, e.g. stacking patterns
    • Y10S414/114—Adjust to handle articles or groups of different sizes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • De-Stacking Of Articles (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Manipulator (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

리드프레임의 리드표면을 손상시키는 일 없이 또 리드프레임을 안정하게 흡착유지할 수 있음과 동시에 신속히 리드프레임의 공급이 가능하다.
상하방향으로 이동 및 가이드레일의 반송방향인 X방향과 직각이고 수평인Y방향으로 이동케되는 흡착유지체(72)에 장치된 X방향가이드판(84A,85A,84B,85B)에는 리드프레임의 길이방향의 양측단부측을 흡착유지하도록 복수개의 리드프레임용 흡착노즐(120)을 2열 설치하고, 이 2열의 리드프레임용 흡착노즐(120)의 중간부에 종이용 흡착노즐(110) 및 리드프레임인지 종이인지를 검출하는 검출단자(100)을 설치한다.

Description

리드프레임의 흡착유지장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 리드프레임의 흡착유지장치를 사용한 리드프레임의 공급·배출장치의 일실시예를 도시하는 일부단면측면도이다.

Claims (3)

  1. 매거진에 수납된 리드프레임을 흡착유지하여 가이드레일상에 얹어 놓은 리드프레임의 흡착유지장치에 있어서, 상하방향 및 가이드레일의 반송방향인 X방향과 직각이고 수평인 Y방향으로 이동하게 되는 흡착유지체에는, 리드프레임의 길이방향의 양측단부측을 흡착 유지하도록 복수개의 리드프레임을 흡착노즐을 2열설치하고, 이 2열의 리드프레임용 흡착노즐의 중간부에 종이용 흡착노즐 및 리드프레임인지 종이인지를 검출하는 검출단자를 설치한 것을 특징으로 하는 리드프레임의 흡착유지장치.
  2. 제1항에 있어서, 상기 2열의 복수개의 리드프레임용 흡착노즐은 각 열마다 리드프레임의 폭방향으로 이동시켜 폭방향위치 조정가능하게, 또한 각 열의 복수개의 리드프레임용 흡착노즐은 리드프레임의 길이방향으로 이동시켜 길이방향위치 조정가능하게 설치한 것을 특징으로 하는 리드프레임의 흡착유지장치.
  3. 흡착유지체의 X방향의 양측에는 각각 Y방향으로 뻗은 Y축의 중앙부가 고정되고, 이 2개의 Y축의 양단측에는 각각 슬라이더가 슬라이딩 가능하고 동시에 고정가능하게 설치되고, 상기 4개의 슬라이더의 X방향으로 대향하는 쌍의 슬라이더에는 각각 X방향으로 뻗은 X방향 가이드판이 고정되고, 이 X방향 가이드판에는 복수개의 리드프레임용 흡착노즐이 슬라이딩 가능하고 동시에 상기 X방향 가이드판에 고정가능하게 설치하고, 상기 흡착유지체에 종이용 흡착노즐 및 리드프레임인지 종이인지를 검출하는 검출단자를 설치한 것을 특징으로 하는 리드프레임의 흡착유지장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960006990A 1995-07-27 1996-03-15 리드프레임의 흡착유지장치 KR100238568B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-210958 1995-07-27
JP21095895A JP3225340B2 (ja) 1995-07-27 1995-07-27 リードフレームの吸着保持装置

Publications (2)

Publication Number Publication Date
KR970008465A true KR970008465A (ko) 1997-02-24
KR100238568B1 KR100238568B1 (ko) 2000-01-15

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Family Applications (1)

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Country Status (4)

Country Link
US (1) US5685589A (ko)
JP (1) JP3225340B2 (ko)
KR (1) KR100238568B1 (ko)
TW (1) TW369693B (ko)

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KR100270137B1 (ko) * 1994-09-22 2000-11-01 오우라 히로시 Ic 수납용 트레이수용장치 및 이 트레이수용장치의 장착대
JP3225336B2 (ja) * 1995-07-13 2001-11-05 株式会社新川 リードフレームの吸着保持装置
KR100190926B1 (ko) * 1995-12-14 1999-06-01 윤종용 슬라이딩 블록을 갖는 리드프레임 언로딩 장치
US5937993A (en) * 1997-01-14 1999-08-17 Tamarac Scientific Co., Inc. Apparatus and method for automatically handling and holding panels near and at the exact plane of exposure
JPH11163000A (ja) * 1997-12-02 1999-06-18 Mitsubishi Electric Corp リードフレーム移送装置
US6729837B1 (en) * 1999-09-17 2004-05-04 Fuji Photo Film Co., Ltd. Sheet feeder and sheet feeding method
US20030070584A1 (en) 2001-05-15 2003-04-17 Cynthia Gulian Dip coating compositions containing cellulose ethers
US8309118B2 (en) 2001-09-28 2012-11-13 Mcneil-Ppc, Inc. Film forming compositions containing sucralose
US7429619B2 (en) 2002-08-02 2008-09-30 Mcneil Consumer Healthcare Polyacrylic film forming compositions
US6979032B2 (en) * 2002-11-15 2005-12-27 Fmc Technologies, Inc. Vacuum pick-up head with vacuum supply valve
WO2007007642A1 (ja) * 2005-07-08 2007-01-18 Asahi Glass Company, Limited 基板の搬送装置及び搬送方法
JP4935488B2 (ja) * 2007-04-25 2012-05-23 村田機械株式会社 板材搬送装置
EP2194973A1 (en) * 2007-09-17 2010-06-16 McNeil-PPC, Inc. Dip coated compositions containing copolymer of polyvinyl alcohol and polyethylene glycol and a gum
JP2010076929A (ja) * 2008-09-29 2010-04-08 Ushio Inc 基板搬送アーム
CN102152978B (zh) * 2010-12-31 2013-01-02 东莞市金格机械有限公司 一种纸品四面包边机转弯送料装置
KR20150097535A (ko) * 2012-12-19 2015-08-26 이스메카 세미컨덕터 홀딩 에스.아. 힘을 제한하는 장치 및 방법
CN108573780A (zh) * 2018-06-19 2018-09-25 杭州良淋电子科技股份有限公司 柔性扁平线缆理线机
JP7282467B2 (ja) * 2019-08-14 2023-05-29 株式会社ディスコ 加工装置
CN110544657A (zh) * 2019-10-09 2019-12-06 青岛航天半导体研究所有限公司 用于自动金丝键合机上的工装、系统

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SE362231B (ko) * 1972-01-18 1973-12-03 Asea Ab
SU1238834A1 (ru) * 1984-12-18 1986-06-23 Специальное Конструкторско-Технологическое Бюро Аналитического Приборостроения Устройство дл подачи плоских заготовок в рабочую зону пресса
JPS62175324A (ja) * 1986-01-29 1987-08-01 Toshiba Seiki Kk リ−ドフレ−ムの供給・排出装置
US4685714A (en) * 1986-12-18 1987-08-11 Hoke Thomas A Lifting assembly
JPH04145641A (ja) * 1990-10-08 1992-05-19 Hitachi Electron Eng Co Ltd Ｉｃデバイスのロード機構

Also Published As

Publication number Publication date
JPH0945709A (ja) 1997-02-14
US5685589A (en) 1997-11-11
JP3225340B2 (ja) 2001-11-05
KR100238568B1 (ko) 2000-01-15
TW369693B (en) 1999-09-11

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