KR970006434B1 - 표면 실장형 칩 콘덴서 - Google Patents
표면 실장형 칩 콘덴서 Download PDFInfo
- Publication number
- KR970006434B1 KR970006434B1 KR1019940006245A KR19940006245A KR970006434B1 KR 970006434 B1 KR970006434 B1 KR 970006434B1 KR 1019940006245 A KR1019940006245 A KR 1019940006245A KR 19940006245 A KR19940006245 A KR 19940006245A KR 970006434 B1 KR970006434 B1 KR 970006434B1
- Authority
- KR
- South Korea
- Prior art keywords
- cover
- capacitor
- condenser
- lead
- holder
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 claims description 71
- 230000002265 prevention Effects 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 17
- 239000000758 substrate Substances 0.000 description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 238000005452 bending Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 241001061260 Emmelichthys struhsakeri Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR930005317 | 1993-03-31 | ||
KR93-5317 | 1993-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940022607A KR940022607A (ko) | 1994-10-21 |
KR970006434B1 true KR970006434B1 (ko) | 1997-04-28 |
Family
ID=19353228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940006245A KR970006434B1 (ko) | 1993-03-31 | 1994-03-28 | 표면 실장형 칩 콘덴서 |
Country Status (5)
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5865413A (en) * | 1995-08-07 | 1999-02-02 | Motorola Inc. | Surface mountable component holder |
US6244544B1 (en) | 1999-02-19 | 2001-06-12 | Magnetek, Inc. | Method and apparatus for holding a capacitor without separable fasteners |
JP2001085281A (ja) * | 1999-09-09 | 2001-03-30 | Honda Motor Co Ltd | 電気二重層コンデンサの配線構造 |
DE60144181D1 (de) * | 2000-02-03 | 2011-04-21 | Panasonic Corp | Chipkondensator mit Hülle |
JP4889037B2 (ja) * | 2006-11-29 | 2012-02-29 | Necトーキン株式会社 | 表面実装型電解コンデンサおよびその製造方法 |
US7532484B1 (en) * | 2008-02-11 | 2009-05-12 | Delphi Technologies, Inc. | Electronic component assembly |
US20120081835A1 (en) * | 2010-09-30 | 2012-04-05 | Omron Corporation | Surface mounting socket for electrolytic capacitors and method for surface mounting of electrolytic capacitors |
US9071211B1 (en) * | 2011-12-15 | 2015-06-30 | Anadigics, Inc. | Compact doherty combiner |
KR20130112284A (ko) * | 2012-04-03 | 2013-10-14 | 현대모비스 주식회사 | 커패시터 캐리어 |
CN102655731A (zh) * | 2012-05-10 | 2012-09-05 | 武汉正维电子技术有限公司 | 一种功率放大器的散热金属基板结构 |
JP6052011B2 (ja) * | 2013-03-28 | 2016-12-27 | アイシン精機株式会社 | 部品支持構造 |
US20160379760A1 (en) * | 2015-06-24 | 2016-12-29 | Kemet Electronics Corporation | Capacitor PCB Spacer |
USD910562S1 (en) * | 2020-01-31 | 2021-02-16 | Associated Universites, Inc. | Snap-on protective cover |
JPWO2023032831A1 (US20020125480A1-20020912-P00900.png) * | 2021-08-31 | 2023-03-09 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS614421U (ja) * | 1984-06-12 | 1986-01-11 | マルコン電子株式会社 | チツプ型アルミ電解コンデンサ |
JPS619832U (ja) * | 1984-06-23 | 1986-01-21 | エルナ−株式会社 | チツプ形電解コンデンサ |
JPS6433914A (en) * | 1987-07-29 | 1989-02-03 | Sony Corp | Electronic part |
EP0332411B1 (en) * | 1988-03-07 | 1994-05-25 | Nippon Chemi-Con Corporation | Chip type capacitor and manufacturing thereof |
JPH0389510A (ja) * | 1989-08-31 | 1991-04-15 | Matsushita Electric Ind Co Ltd | アルミ電解コンデンサ |
JP2546613Y2 (ja) * | 1990-12-28 | 1997-09-03 | 日本ケミコン株式会社 | チップ形コンデンサ |
JPH04287306A (ja) * | 1991-03-15 | 1992-10-12 | Elna Co Ltd | チップ化用台座および同台座を有する電子部品 |
-
1994
- 1994-03-25 US US08/218,087 patent/US5420748A/en not_active Expired - Lifetime
- 1994-03-28 KR KR1019940006245A patent/KR970006434B1/ko not_active IP Right Cessation
- 1994-03-29 JP JP6059061A patent/JP2768897B2/ja not_active Expired - Lifetime
- 1994-03-30 TW TW083102785A patent/TW266300B/zh not_active IP Right Cessation
- 1994-03-31 CN CN94103780A patent/CN1032723C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2768897B2 (ja) | 1998-06-25 |
TW266300B (US20020125480A1-20020912-P00900.png) | 1995-12-21 |
KR940022607A (ko) | 1994-10-21 |
CN1032723C (zh) | 1996-09-04 |
US5420748A (en) | 1995-05-30 |
CN1093196A (zh) | 1994-10-05 |
JPH0774053A (ja) | 1995-03-17 |
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Date | Code | Title | Description |
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A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20020626 Year of fee payment: 6 |
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LAPS | Lapse due to unpaid annual fee |