KR960706190A - Ic 수납용 트레이수용장치 및 이 트레이수용장치의 장착대 - Google Patents

Ic 수납용 트레이수용장치 및 이 트레이수용장치의 장착대

Info

Publication number
KR960706190A
KR960706190A KR1019960702708A KR19960702708A KR960706190A KR 960706190 A KR960706190 A KR 960706190A KR 1019960702708 A KR1019960702708 A KR 1019960702708A KR 19960702708 A KR19960702708 A KR 19960702708A KR 960706190 A KR960706190 A KR 960706190A
Authority
KR
South Korea
Prior art keywords
tray
test
substrate
unit
receiving device
Prior art date
Application number
KR1019960702708A
Other languages
English (en)
Other versions
KR100270137B1 (ko
Inventor
요시토 고바야시
히로토 나카무라
Original Assignee
오오우라 히로시
가부시키가이샤 아드반테스트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25436294A external-priority patent/JP3497251B2/ja
Priority claimed from JP7082395A external-priority patent/JPH08241921A/ja
Application filed by 오오우라 히로시, 가부시키가이샤 아드반테스트 filed Critical 오오우라 히로시
Publication of KR960706190A publication Critical patent/KR960706190A/ko
Application granted granted Critical
Publication of KR100270137B1 publication Critical patent/KR100270137B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

시험종료후 언로더부에서 카테고리마다 분류되어 대응하는 트레이에 수납된 시험필 IC의 카테고리를 간단하고 또한 확실히 식별할 수 있는 IC 수납용 트레이수용장치를 제공한다. 트레이수용체(31)에, 대략 직사각형의 기판(75)과 그 기판으로부터 독립상태로 직립하는 복수의 외벽(76)을 구비하는 케이싱(80)을 부착하고, 이 케이싱의 적어도 1개의 외벽에, 수납된 IC의 카테고리를 표시하는 카테고리 식별표시기(72)를 부착한다. 또한, 케이싱의 기판에는 상하이동기구가 자유롭게 이동할 수 있는 개구부(71)를 형성한다. 이 카테고리 식별표시기에 의해서 트레이수용장치를 IC핸들러로부터 꺼낸후라도 수납된 시험필 IC의 카테고리를 용이하게 확인할 수 있다.

Description

IC 수납용 트레이수용장치 및 이 트레이수용장치의 장착대
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제17도는 이 발명에 의한 트레이 카세트의 제2의 실시예를 트레이와 같이 나타내는 개략 사시도이다.

Claims (8)

  1. 반도체디바이스를 테스트하기 위해서 로더부에서 테스트부로 반송하고, 또한 테스트필의 반도체디바이스를 테스트부에서 언로더부로 반송하여 테스트결과에 따라서 분류하는 반도체디바이스 반송처리장치에 사용되는 IC 수납용 트레이수용장치에 있어서, 상하구동수단이 이동가능한 개구를 갖는 대략 직사각형의 기판 및 이 기판의 각 각부로부터 직립하는 지주를 구비하고, 이들 지주내에 IC 수납용 트레이를 수용하기 위한 트레이 수용체와 상기 트레이수용체의 지주와 각각 걸어맞춤하는 걸어맞춤부를 각 각부에 구비하고, 또한 상하구동수단이 이동가능한 개구를 갖는 대략 직사각형의 기판 및 이 기판으로부터 독깁상태로 직립하는 복수의 외벽을 구비하고, 상부로부터 IC 수납용 트레이의 삽입 및 꺼냄을 할 수 있는 케이싱과, 상기 케이싱의 적어도 1개의 외벽에 부착된, IC 수납용 트레이에 수납된 시험필 반도체 디바이스의 카테고리를 표시하는 카테고리 식별표시기를 구비하는 것을 특징으로 하는 IC 수납용트레이수용장치.
  2. 반도체디바이스를 테스트하기 위해서 로더부에서 테스트부로 반송하고, 또한 테스트필의 반도체디바이스를 테스트부에서 언로더부로 반송하여 테스트결과에 따라서 분류하는 반도체디바이스 반송처리장치에 사용되는 IC 수납용 트레이수용장치에 있어서, 상하구동수단이 이동가능한 개구를 갖고, 또한 반도체디바이스 반송처리장치의 트레이수용장치 장착대에 정확히 위치 결정하기 위한 위치결정용 걸림수단을 구비한 대략 직사각형상의 기판과 상기 기판의 적어도 장변측을 포함하는 주변 가장자리로부터 독립한 상태로 대략 직립하는 2개의 외벽과, 이들 외벽의 장변측의 대략 중앙부에 각각 형성된 손잡이 수납부와 이들 손잡이 수납부에 꺼냄가능하게 수납된 손잡이를 구비하는 것을 특징으로 하는 IC 수납용트레이수용장치.
  3. 제2항에 있어서, 상기 기판의 개구는 트레이가 출입을 할 수 있는 크기로 형성되고, 이 개구에 선단부가 돌출하는 여러개의 훅이 외측으로 인출 가능하게 부착되어 있는 것을 특징으로 하는 IC 수납용트레이수용장치.
  4. 제2항 또는 제3항에 있어서, 광학센서의 빛이 투과하는 구멍을 제일 밑으로 수용되는 트레이의 측면에 해당하는 위치에 형성하고, 제일 밑의 트레이의 유무를 감지하도록 한 것을 특징으로 하는 IC 수납용트레이수용장치.
  5. 제2항 내지 제4항 중 어느 한 항에 있어서, 트레이에 수납된 반도체디바이스의 카테고리등의 정보를 기록하는 메모리를 구비하고 있는 것을 특징으로 하는 IC 수납용트레이수용장치.
  6. 반도체디바이스를 테스트하기 위해서 로더부에서 테스트부로 반송하고, 또한 테스트필의 반도체디바이스를 테스트부에서 언로더부로 반송하여 테스트결과에 따라서 분류하는 반도체디바이스 반송처리장치에 사용되는 트레이수용장치의 장착대에 있어서 트레이수용장치를 얹어 놓기 위한, 이 트레이수용장치의 저면보다 약간 큰 직사각형상의 프레임구조의 대와, 트레이수용장치를 소정의 위치에 위치결정하기 위한, 이 트레이수용장치의 위치 결정용 걸림수단과 걸어맞춤하는 위치 결정용 걸림수단과, 트레이수용장치내에 수용된 트레이를 윗쪽으로 밀어 올리리위한 상하구동수단과, 상기 장착대내의 트레이수용장치의 상부에 설치되고, 트레이수용장치의 최상부의 트레이가 비어져 있을 때에 이 빈 트레이를 잡아서 전송하기 위한 트레이전송장치를 구비하는 것을 특징으로 하는 트레이수용장치의 장착대.
  7. 제6항에 있어서, 트레이수용장치가 소정의 위치에 위치 결정된 때에 이 트레이수용장치의 광투과구멍과 대면하는 위치에 설치된 광학센서를 더 포함하는 것을 특징으로 하는 트레이수용장치의 장착대.
  8. 제6항 또는 제7항에 있어서, 트레이수용장치의 메모리와 대면하는 위치에 설치된 메모리 정보판독장치를 더 포함하는 것을 특징으로 하는 트레이수용장치의 장착대.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960702708A 1994-09-22 1995-09-20 Ic 수납용 트레이수용장치 및 이 트레이수용장치의 장착대 KR100270137B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP94-254362 1994-09-22
JP25436294A JP3497251B2 (ja) 1994-09-22 1994-09-22 Ｉｃ収納用トレイカセット構造
JP95-70823 1995-03-03
JP7082395A JPH08241921A (ja) 1995-03-03 1995-03-03 Ｉｃ搬送装置用トレイカセット並びにトレイカセット装着台
PCT/JP1995/001868 WO1996009644A1 (fr) 1994-09-22 1995-09-20 Conteneur pour plateaux a circuits integres et sa plaque de base de montage

Publications (2)

Publication Number Publication Date
KR960706190A true KR960706190A (ko) 1996-11-08
KR100270137B1 KR100270137B1 (ko) 2000-11-01

Family

ID=26411954

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960702708A KR100270137B1 (ko) 1994-09-22 1995-09-20 Ic 수납용 트레이수용장치 및 이 트레이수용장치의 장착대

Country Status (5)

Country Link
US (2) US6070731A (ko)
KR (1) KR100270137B1 (ko)
DE (1) DE19581661C2 (ko)
MY (1) MY114198A (ko)
WO (1) WO1996009644A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100809697B1 (ko) * 2006-08-08 2008-03-06 삼성전자주식회사 트레이 클램핑 장치

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5937270A (en) 1996-01-24 1999-08-10 Micron Electronics, Inc. Method of efficiently laser marking singulated semiconductor devices
DE19612713B4 (de) * 1996-03-29 2005-08-18 Infineon Technologies Ag Einrichtung in einer Halbleiterfertigungsanlage, insbeosndere für integrierte Schaltungen
JP3689215B2 (ja) * 1997-02-20 2005-08-31 株式会社ルネサステクノロジ 半導体デバイスのテスト用搬送装置
EP0914968B1 (en) * 1997-11-10 2003-06-11 William H. Gunther Method of sorting printed documents and feeding them to a finishing machine
US5928493A (en) * 1997-11-24 1999-07-27 Kaspar Electroplating Corporation Process and apparatus for electrocoagulative treatment of industrial waste water
JP3809008B2 (ja) * 1998-03-27 2006-08-16 株式会社アドバンテスト カストマトレイストッカ
JPH11297791A (ja) * 1998-04-14 1999-10-29 Advantest Corp トレイ移送アーム及びこれを用いたトレイの移載装置、ｉｃ試験装置並びにトレイの取り廻し方法
US6417484B1 (en) 1998-12-21 2002-07-09 Micron Electronics, Inc. Laser marking system for dice carried in trays and method of operation
US6287068B1 (en) * 1998-12-21 2001-09-11 Micron Technology, Inc. Self-aligning tray carrier apparatus with tilt feature
US6262388B1 (en) 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
TW490564B (en) * 1999-02-01 2002-06-11 Mirae Corp A carrier handling apparatus for module IC handler, and method thereof
US6305500B1 (en) 1999-08-25 2001-10-23 Maxtor Corporation Material delivery system for clean room-like environments
US6990387B1 (en) * 2000-05-18 2006-01-24 Intel Corporation Test system for identification and sorting of integrated circuit devices
US6528760B1 (en) 2000-07-14 2003-03-04 Micron Technology, Inc. Apparatus and method using rotational indexing for laser marking IC packages carried in trays
US6334574B1 (en) * 2000-10-04 2002-01-01 Teung-Lin Huang Identification device for IC loading tray
KR20020091902A (ko) * 2001-06-01 2002-12-11 삼성전자 주식회사 물품보관용기
US7169685B2 (en) 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
JP2004059116A (ja) * 2002-07-31 2004-02-26 Sharp Corp ディスプレイ用基板収納用トレイ及びディスプレイ用基板の取り出し機構並びにディスプレイ用基板の取り出し方法
GB0326770D0 (en) * 2003-11-17 2003-12-24 Norville Group The Ltd Lens storage device
US7562923B2 (en) * 2004-02-09 2009-07-21 Mirae Corporation Tray transferring apparatus with gripper mechanism
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
CN100592123C (zh) * 2006-06-28 2010-02-24 鸿富锦精密工业（深圳）有限公司 托盘料架和托盘料架装置
KR101042655B1 (ko) * 2006-07-27 2011-06-20 가부시키가이샤 아드반테스트 전자부품 이송방법 및 전자부품 핸들링 장치
US7435099B2 (en) * 2006-12-21 2008-10-14 Cinch Connectors, Inc. Electrical connector and packaging assembly
ITUD20070202A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Contenitore per lo stoccaggio di piastre per circuiti elettronici e relativo procedimento
US20090153993A1 (en) * 2007-12-18 2009-06-18 Teradyne, Inc. Disk Drive Testing
US7996174B2 (en) * 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US8102173B2 (en) * 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US20090262455A1 (en) * 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US7945424B2 (en) * 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8238099B2 (en) * 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US8160739B2 (en) * 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US20110123301A1 (en) * 2008-04-17 2011-05-26 Scott Noble Bulk feeding storage devices to storage device testing systems
US8095234B2 (en) * 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
MY149779A (en) * 2008-06-03 2013-10-14 Teradyne Inc Processing storage devices
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US8547123B2 (en) * 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
US20120273389A1 (en) * 2011-04-27 2012-11-01 Freescale Semiconductor, Inc. Semiconductor tray carrier
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US10161962B2 (en) * 2014-06-06 2018-12-25 Advantest Corporation Universal test cell
US20150118011A1 (en) * 2013-10-30 2015-04-30 Data I/O Corporation Tray stacker system and method of operation thereof
US9638748B2 (en) * 2014-04-10 2017-05-02 Texas Instruments Incorporated Tray loading system for electronic components
US9618574B2 (en) * 2014-06-06 2017-04-11 Advantest Corporation Controlling automated testing of devices
US9678148B2 (en) 2014-06-06 2017-06-13 Advantest Corporation Customizable tester having testing modules for automated testing of devices
US9638749B2 (en) * 2014-06-06 2017-05-02 Advantest Corporation Supporting automated testing of devices in a test floor system
US9618570B2 (en) 2014-06-06 2017-04-11 Advantest Corporation Multi-configurable testing module for automated testing of a device
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
CN111942841B (zh) * 2020-08-19 2021-11-30 宁波三韩合金材料有限公司 一种料盘自动上料系统及使用方法
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701079A (en) * 1970-07-10 1972-10-24 James E Bowden Interconnecting carrier bodies for semiconductor devices
US4248346A (en) * 1979-01-29 1981-02-03 Fluoroware, Inc. Shipping container for semiconductor substrate wafers
US4715501A (en) * 1984-06-29 1987-12-29 Takeda Riken Co., Ltd. IC test equipment
US4767003A (en) * 1985-10-18 1988-08-30 Hughes Aircraft Company Transparent, electrostatic protective container with readily accessible identification means
JPS62215444A (ja) * 1986-03-14 1987-09-22 Hitachi Ltd Ｆｉｃ充▲てん▼用トレイの供給装置
GB8611792D0 (en) * 1986-05-14 1986-06-25 Xerox Corp Sheet feed apparatus & cartridge
US4832612A (en) * 1986-10-31 1989-05-23 Amp Incorporated Protective carrier and securing means therefor
US4926118A (en) * 1988-02-22 1990-05-15 Sym-Tek Systems, Inc. Test station
US5203666A (en) * 1988-05-18 1993-04-20 Fleetwood Systems, Inc. Automatic tray loading, unloading and storage system
IT1235835B (it) * 1989-08-08 1992-11-03 Sgs Thomson Microelectronics Movimentazione automatica di contenitori diversi con punti di prelievo e di codificazione standarizzati
JPH03134982A (ja) * 1989-10-19 1991-06-07 Seikosha Co Ltd Ｉｃホルダ
US5073079A (en) * 1990-05-17 1991-12-17 Intelmatec Corporation Modular loading-unloading system for integrated circuits or the like
JP2921937B2 (ja) * 1990-07-18 1999-07-19 東京エレクトロン株式会社 Ｉｃ検査装置
US5746319A (en) * 1990-09-25 1998-05-05 R.H. Murphy Co., Inc. Tray for integrated circuits
DE9109790U1 (de) * 1991-08-07 1991-10-17 N.V. Philips' Gloeilampenfabrieken, Eindhoven Kassette mit einem Magnetband
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling
JP3067005B2 (ja) * 1994-06-30 2000-07-17 株式会社アドバンテスト テストトレイ用位置決めストッパ
TW287235B (ko) * 1994-06-30 1996-10-01 Zenshin Test Co
US5588797A (en) * 1994-07-18 1996-12-31 Advantek, Inc. IC tray handling apparatus and method
US5480280A (en) * 1994-10-21 1996-01-02 Conveying Industries, Inc. Method and apparatus for dispensing pallets
DE19510277A1 (de) * 1995-03-21 1996-09-26 Siemens Ag Verfahren zur Handhabung von elektronischen Bauelementen in der Endmontage
JP2709283B2 (ja) * 1995-04-07 1998-02-04 山一電機株式会社 Ｉｃキャリア
US5674047A (en) * 1995-07-13 1997-10-07 Chiron Diagnostics Corporation Loading mechanism for probe tip tray
JP3225340B2 (ja) * 1995-07-27 2001-11-05 株式会社新川 リードフレームの吸着保持装置
JP3063602B2 (ja) * 1995-12-22 2000-07-12 日立電子エンジニアリング株式会社 Ｉｃデバイスの移載装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100809697B1 (ko) * 2006-08-08 2008-03-06 삼성전자주식회사 트레이 클램핑 장치

Also Published As

Publication number Publication date
DE19581661C2 (de) 1998-11-26
KR100270137B1 (ko) 2000-11-01
DE19581661T1 (de) 1997-07-17
US6354792B1 (en) 2002-03-12
US6070731A (en) 2000-06-06
MY114198A (en) 2002-08-30
WO1996009644A1 (fr) 1996-03-28

Similar Documents

Publication Publication Date Title
KR960706190A (ko) Ic 수납용 트레이수용장치 및 이 트레이수용장치의 장착대
US9696330B2 (en) Sample conveyor apparatus and specimen testing automation system
US7948676B2 (en) Automated cassette and slide handling system for an automatic microscope
KR100747078B1 (ko) 반송장치 및 전자부품 핸들링 장치
ATE93412T1 (de) Probenhalterung fuer probengefaesse.
KR960013939A (ko) 약제 포장장치
KR980005983A (ko) 반도체 디바이스 시험장치
JPH08500899A (ja) 流体試料保持トレー移送アセンブリを備えた自動化分析器械
CN100523818C (zh) 自动分析装置
JP6882352B2 (ja) 容器ラック、検体分析装置及び検体分析方法
EP1357526A2 (en) Commodity carrying-out apparatus of automatic vending machine
US20040059463A1 (en) Active control center for use with an automatic dispensing system for prescriptions and the like
CN107614398A (zh) 智能库存存储系统
WO2015138044A1 (en) Combined chemiluminescence and elisa automated sample reader
KR100679225B1 (ko) 테스트 스트립 수용 용기와 이의 공급 장치 및 이를 이용한시료액 분석 시스템
JP2006248711A (ja) 物品仕分け設備
JP5591674B2 (ja) 自動分析装置および試薬容器保管装置
US12089339B2 (en) Intelligent surface mount technology reel storage system
CN216117481U (zh) 一种农药残留检测仪
CN214242810U (zh) 一种上杯装置及医疗设备
JP4439062B2 (ja) 物品収納装置
JP3497251B2 (ja) Ｉｃ収納用トレイカセット構造
JP2016161296A (ja) 電子部品搬送装置および電子部品検査装置
JP3312971B2 (ja) ピッキング用装置及びピッキング用台車
JPH08241921A (ja) Ｉｃ搬送装置用トレイカセット並びにトレイカセット装着台

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee