KR960021335A - 납땜 결합 방법 및 그 방법에 의해 제조된 제품 - Google Patents

납땜 결합 방법 및 그 방법에 의해 제조된 제품 Download PDF

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Publication number
KR960021335A
KR960021335A KR1019950048063A KR19950048063A KR960021335A KR 960021335 A KR960021335 A KR 960021335A KR 1019950048063 A KR1019950048063 A KR 1019950048063A KR 19950048063 A KR19950048063 A KR 19950048063A KR 960021335 A KR960021335 A KR 960021335A
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South Korea
Prior art keywords
solder
layer
bonding pad
molten
predetermined composition
Prior art date
Application number
KR1019950048063A
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English (en)
Inventor
반아타 게이츠 Ⅱ 존
에드몬드 헤네인 게라르드
쉬물로비치 죠셉
Original Assignee
제이. 엠. 헤르만
에이티 앤드 티 코포레이션
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Application filed by 제이. 엠. 헤르만, 에이티 앤드 티 코포레이션 filed Critical 제이. 엠. 헤르만
Publication of KR960021335A publication Critical patent/KR960021335A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
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    • G—PHYSICS
    • G02—OPTICS
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    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

본 발명은 납땜 결합방법 및 그 방법에 의해 제조된 제품에 관한 것이다.
납땜과 기판 사이의 열팽창 부정합은 특히 잘부서지는 기판, 예를 들면 Si 또는 유리와 같은 기판의 경우 기판 균일을 야기시킬 수 있다. 이러한 문제는 희생층(sacrificial layer)과 상기 희생층 상에 배치되고 이를 통과하는 윈도우를 가진 제한층(confinememt layer)을 포함하는 신규한 결합 패드 구조물을 사용함으로써 거의 없앨 수 있다. 제한층(예를 들면, Ti 또는 Cr)은 납땜온도에서 땜납(예를 들면, AuSn)에 대해 실질적으로 불활성이 되도록 선택되며, 희생층(예를들면, Au)은 납땜 온도에서 땜납과 상호작용 하도록 선택됨으로써 용융 땜납은 희생물질의 적어도 일부를 소모시키며 용융물질 사이의 계면은 상기 제한층의 측방향 아래로 이동한다. 용융물질의 재고화 후, 구조물은 효과적으로 재고화된 물질과 기판 사이에 분포계면(distributed interface)을 가지며, 기판내의 응력은 감소된다. 이러한 신규발명은 폭넓은 용도, 예를 들면, Si칩 캐리어에 Si 칩을 납땜하거나 Si/SiO2기판에 광섬유를 납땜하는 등의 광범위한 용도를 갖는다.

Description

납땜 결합 방법 및 그 방법에 의해 제조된 제품
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 종래의 납땜 결합체를 개략적으로 도시한 도면,
제2도는 결합전의 본 발명에 따른 예시적인 결합영역을 개략적으로 도시한 도면,
제3도는 본 발명에 따른 완성된 납땜 결합체를 개략적으로 도시한 도면.

Claims (7)

  1. (a) 표면상에 결합 패드(22)가 배치되어 있는 제1본체(21), 및 (b) 소정의 조성을 가진 땜납(24)에 의해 상기 결합 패드에서 상기 제1본체에 연결된 제2본체(30)을 포함하고; (c) 이를 통하여 소정의 조성을 가진 땜납의 일부를 수용하기 위한 윈도우를 갖고 상기 결합 패드상에 배치되며, 납땜 온도에서 상기 소정의 조성을 가진 용융 땜납에 대해 실질적으로 불활성인 제한층(confinement layer)(23)을 더 포함하고, (d) 상기 결합패드가, 납땜 온도에서 상기 소정의 조성을 가진 용융 땜납과 상호작용하여 상기 땜납이 그의 융점이하로 냉각된 후 재고화된 용융 물질(24′)이 상기 윈도우를 넘어 상기 제한층(23)아래로 연장하도록 선택된 희생 물질의 제1층(26)을 포함하는 것을 특징으로 하는 제품.
  2. 제1항에 있어서, 상기 땜납이 MSn계 땜납이고, 상기 희생물질이 M(여기서, M은 Ag 및 Au로 이루어진 군중에서 선택된다)인 제품.
  3. 제2항에 있어서, 상기 제한층이 Ti 및 Cr로 이루어진 군중에서 선택된 물질의 층인 제품.
  4. 제3항에 있어서, 상기 제1본체가 SiO2층을 포함하며, 상기 결합 패드가 순차적으로 (i) Ti층, Pt층 및 Au 희생층을 포함하거나, 또는 (ii) Ti층, 질화티타늄층, Pt층 및 Au 희생층을 포함하는 제품.
  5. 제1항에 있어서, 상기 땜납을 납땜온도로 가열하는데 적당한 레지스터를 더 포함하는 제품.
  6. 제1항에 있어서, 상기 제2본체가 광섬유인 제품.
  7. (a) 표면상에 결합 패드(22)가 배치되어 있고, 상기 결합 패드상에 소정의 조성을 가진 다량의 땜납이 배치되어 있는 제1본체를 제공하는 단계, 및 (b) 상기 다량의 땜납을 제1본체와 접촉시키고, 상기 땜납을 상기 땜납의 용융온도 이상의 납땜온으로 가열한 다음, 상기 땜납을 냉각시킴으로써 재고화된 땜납(24′)을 수득하는 단계를 포함하고; (c) 이를 통하여 소정의 조성을 가진 땜납의 일부를 수용하기 위한 윈도우를 갖고 땜납온도에서 상기 땜납에 대해 실질적으로 불활성인 제한층(23)을 결합 패드상에 제공하는 단계를 더 포함하고, (d)상기 결합 패드가, 납땜 온도에서 상기 땜납과 상호작용하여 상기 땜납을 냉각시킨 후 재고화된 용융 물질(24')이 상기 윈도우를 넘어 상기 제한층(23)아래로 연장하도록 선택된 희생 물질의 제1층을 포함하는 것을 특징으로 하는, 제1본체 및 상기 제1본체에 납땜 결합된 제2본체(30)를 포함하는 제품의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950048063A 1994-12-13 1995-12-09 납땜 결합 방법 및 그 방법에 의해 제조된 제품 KR960021335A (ko)

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JPH08250851A (ja) 1996-09-27
EP0717441A3 (en) 1997-05-02
JP3078489B2 (ja) 2000-08-21
TW253856B (en) 1995-08-11
US5622788A (en) 1997-04-22
EP0717441A2 (en) 1996-06-19

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