TW253856B - Method of solder bonding, and article produced by the method - Google Patents

Method of solder bonding, and article produced by the method Download PDF

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Publication number
TW253856B
TW253856B TW084101216A TW84101216A TW253856B TW 253856 B TW253856 B TW 253856B TW 084101216 A TW084101216 A TW 084101216A TW 84101216 A TW84101216 A TW 84101216A TW 253856 B TW253856 B TW 253856B
Authority
TW
Taiwan
Prior art keywords
solder
layer
soldering
pad
substrate
Prior art date
Application number
TW084101216A
Other languages
English (en)
Inventor
Ii John Vanatta Gates
Gerard Edmond Henein
Joseph Shmulovich
Original Assignee
At & T Corp
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Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Application granted granted Critical
Publication of TW253856B publication Critical patent/TW253856B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
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  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Wire Bonding (AREA)
  • Optical Couplings Of Light Guides (AREA)
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A7 B7 ^53856 五、發明説明（ 發明範圍 在發明係關於軟焊結合。 發明背置 在許多技術領域中都需要用到軟焊以使兩.物體相結合 。例如，US專利第5307434號提出了 一個具有矽基材本體 的光嫌雷射傳送器，即同時將雷射與光嫌線束以軟焊結合 於基材上。 .<LV. 雖然軟焊既方便且應用廣泛，但仍存有些&問題。例 如，在焊接光嫌於脆性基材時，即發現在軟焊3^^；或其 附近有基材破裂的情形。這種破裂是極不希望發生的，/所 以希望能有一種軟焊法可以減少或消除這種破裂的問題。 本申請害即提出了這樣的方法。 發明概述 我們發現用以往的軟焊技術，在焊料與基材之間會因 爲熱膨脹的不同而造成應力導致接合失效和/或基材破裂 。我們已找出了能有效分散應力的方法，因而能確實的消 除先前所說的失效。 詳細地說，本發明係以已知成份的焊料實施軟焊於一 個含有焊接墊在表面的第一物體及藉焊接墊與第一物體相 接的第二物體的物品上。例如，焊料是MS η焊料，其中 Μ代表金或銀。MS η並不意謂著Μ與錫以相同莫耳比例 存在。重要的是，該物品具有一層位在焊接墊上的限制層 ，該限制層上有一開口貫穿限制層到焊接墊上（該開口不 一定要是連績的邊緣）。限制層在焊接溫度下與已知成份 本紙張尺度適用中國國家樣準（CNS ) Α4说格（210X297公釐） J— - 訂 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 經濟部中央標準局員工消費合作杜印製 <53856 A7 B7 五、發明説明（2 ) 的熔融焊料是不易產生反應的。焊接墊具有在焊接溫度下 能與已知成份的熔融焊料作用之材料作成的第一（作用） 層。因此，當熔融的焊料冷却至其熔點以下，重新凝固的 材料會在該限制層之下延伸到該開口外去。 上述的作用涉及熔融焊料與作用層之間的交互作用， 特別包括此兩者之間的擴散作用，並隨之局部降低了作用 層材料的熔點。 本發明也實施於一種具有第一物體和以軟焊接合於第 一物體之第二物體的物品。該方法包括了提供具有焊接墊 於基表面的第一物體，一些位於焊接墊上已知成份的焊料 ，和將焊料與第二物體接觸並加熱焊料至高於熔化溫度以 上之焊接溫度的方法。它還包括了允許焊料冷却以重新凝 固焊料。 重要的是，本方法還包括提供了位於焊接墊之上的限 制層，該限制層具有開口貫穿至焊接墊且它在焊接溫度下 與焊料不易產生反應。同時，該方法也包括了提供一種具 有能在焊接溫度下與焊料發生作用之第一層作用材料的焊 接墊，可使焊料在冷却後，重新凝固的材料能夠在該限制 層之下延伸於開口外。 這項新的方法很顯然地並不只限於將光織焊接於矽基 材上之用，它具有廣泛的應用性。例如，它可以用於將矽 晶片焊接於矽基材的”晶圃比例整合”應用上。 附圖簡述 圖1爲以往軟焊接合技術之圇示； 本紙張尺度逋用中國國家標準（CNS ) A4規格（21 Ox297公釐） (請先閲讀背面之注意事項再填寫本頁) -s Γ 25385β at Β7 經濟部中央標準局男工消費合作杜印製 五、發明説明（3 ) 圖2爲本發明在焊接前焊接區域的例子的圖示： 圖3爲本發明焊接完成後的圖示： 詳細說明 我們發現在許多第一物體/焊料/第二物體焊接接合 時，存在有明顯的墊膨脹的差異，例如在焊料與第一物體 (基材）間。這種差異會造成顯著的應力，致使接合失效 甚或基材破裂，尤其是當基材含有矽或是玻璃之類的脆性 材料時。這個問題尤其是在熔融的焊料未用如焊接墊或焊 接閘等方法限制於基材表面的預設區域內時更爲明顯。如 圖1所示，熔融的焊材沾附於焊接埜但並未散開於其上， 而呈如圖中假設之與基材有較大接觸角度的形狀。通常道 會造成應力集中於空氣/焊料介面處的基材上，而產生如 破裂17的裂痕。在圖1中，編第11至15依序表示第 一物體，第二物體，第一物體上的接合墊，第2物髋上的 接合墊及重新凝固之焊料。第一物體爲比例中之包括矽本 體1 8及二氧化矽層1 6的複合物。在層1 6處的箭頭(ί) 示該層內的應力方向，此係基於焊料之熱膨眼係數大於基' 材之熱膨脹係數的假設。若此應力夠大，則基材便會發生 破裂。 圓2則爲本發明在焊接之前，基材/焊料之組合的圖 示，其中編號2 1至2 4依序表示基材（可以是複合物） ，接合墊，限制層，及位於限制層開口內的焊料塊。圓示 之接合墊包括了選用層2 5及作用材料層2 6。選用層可 以是多層結構，例如包括了可使基材與焊接墊較易接合的 (請先閲讀背面之注意事項再填寫本頁) 一 本紙張尺度適用中國國家標準（CNS ) Α4规格（210 X 297公釐） 經濟部中央揉準局貝工消費合作社印製 -53856 A7 B7____ 五、發明説明（4 ) 黏附層（如鈦），和用以防止黏附層與覆蓋層（如金）交 互作用的阻隔層（如鉑）等層所構成。這些結構已爲該技 術所硏發，另外地可以在鈦層與鉑層間採用氮化鈦層。 作用層是用以在焊接溫度下與焊料產生作用，而使熔 融的材料可以擴展至限制層的開口之外。熔融材料在限制 層下的橫向延伸，會形成如腳般楔形的焊料塊將限制層稍 稍頂起。此作用如圖3所示，圖中第二物體3 0焊接於第 —物體2 1 ，而重新凝固的材料2 4，延伸於限制層2 3 之下。材料2 6是圖2中作用層2 6的殘餘未熔融的部份 ，編號3 2則表示介於原作用層及重新凝固的材料之間的 介面。未熔融的作用層是可以選擇性的保留的。 我們目前相信熔融的焊料（如共融的錫金，包含有約 8 0 %重量的金）與作用層的材料作用後，在局部形成了 成份不同於原焊料的熔融合金。熔融的焊料消耗（熔解） 了在開口中的作用層材料，並開始在限制層下橫向延伸， 並漸渐增加作用材料的含量。當在限制層下固/液態界面 處的熔融混合物中作用材料的含量愈來來愈多，界面的延 伸便愈來愈慢最後終於停止。在許多例子中，熔融材料不 只與作用層材料發生作用，而且與與作用層下的材料發生 作用。例如，我們相信錫與限制層的鉑材料發生作用，這 種作用可能更增强了本發明技術之效果。 以上對此新方法之作用機柳的描述僅供說明之用，本 發明並不需依賴所以上所提出之機構的正確性。 依本發明之方法產生之焊接接合的幾合形狀可以有效 本紙張尺度適用中國國家橾率（匚~5)久4規格（210'犬297公釐>_ I—-：-----^4------1T------f (請先閱讀背面之注意事項再填寫本頁) _ 經濟部中央標準局員工消費合作杜印装 ^53856 A7 ____B7 五、發明説明（5 ) 的分佈於接合與非接合面之間，隨之，應力也可分散於較 大體積之基材上。結果可以大幅減少基材破裂的情形。例 如，在一項特別的試作中，將光纖焊接於3 5個舊有技術 之結構上（即包括有焊接墊但沒有限制層及作用層）。檢 驗最後的產品發現，3 5個試件中有3 3個基材都發生破 裂。在另一項試作中，不同於前述只使用接合墊的例子， 而是將光纖焊接於15個如本發明之結構上，例如包含 0.5# m厚之金的作用層及0.1# m厚之鉻的限制層的結構。 檢驗結果發現沒有結構破裂發生。再將其中10個以本發明 焊接之結構作溫度循環（-40°C到8 5 °C做4 0次）也沒有 導致破裂。很明顯的，這些試驗證明本發明能有效的消除 上述破裂的問題。 例3 :將光嫌以軟焊接合於如U S專利第5307434號 所述之基材上。其特點在於矽本體上有以傳統方法成形之 二氧化矽薄膜（0 · 4至2 0i/m厚）。薄膜電阻層被置 放並成形於薄膜電熱器中。中間介電層（如約1 0 0 nm厚 的二氧化矽或氮化矽）藉PECVD置放並成形，以使介 面質在光纖焊接處保留但在其它地方被除去。焊接墊之形 成如下：黏附層（例如，1 0 Onm厚的鈦，或5 0nm厚的 鈦和2 5 nm的氮化鈦），接著是阻隔層（如，0.2# m的 鉑），及最外層的作用材料層（如，0 . 5//m的金）。 可以用任何方便的方法產生這些材料層，如濺鍍或電子束 蒸鍍。層稹之材料層再成形成所薔之焊接墊。接著再屠積 限制層（如0 . 的鈦或銘），然後再以傅統的成形 本紙張尺度適用中國國家標準（CNS > Α4規格（210X297公釐） I--.------—— (請先閲讀背面之注意事項再填寫本頁) 訂 253S56 at B7 經濟部中央標準局員工消費合作社印製 五、發明説明（6 ) 方法將在焊接墊的作用層材料上的限制層成形出延伸穿過 限制層的開口。最後，再以電子束蒸鍍將薄膜焊料（如， 6 厚的共融錫金合金）透過開口蒸鍍於作用層材料上 。再置放經適度硬化的光纖維於開口內的焊料之上後，加 熱電熱器使焊料熔化。焊接溫度大約3 2 0 °C並持績3 0 秒。在切斷電熱器之後，焊料重新凝固而將光繊接合於矽 本體上。以光學顯微鏡觀察發現，限制層不再爲平行於其 下之矽表面的平面，而是有些凸起如圖3中所示，這表示 固/液態介面在限制層之下橫向移動過。在限制層之下的 重新凝固材料經成份分析顯示較共融之成份含有更多的金 Ο 雖然上述的討論都採用錫金焊料及金作用層，但本發 明並不只限於此。事實上，本發明可用於任何多種成份之 焊料（如，共融錫銀，或錫鉛），並採用適當的作用層材 料°必需選擇具有較焊料高的熔點且在焊接溫度下易與焊 料作用的材料爲作用材料，同時這種作用材料還要具有少 置局部加入熔融焊料即能明顯改變熔融材料之局部冷凝溫 度的特性。例如，若焊料是共融錫銀或錫鉛，則適用之作 用材料是金。必須注意的是，選用的作用材料並不只限於 所用的焊料成份中有的元素。 (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家棣準（CNS ) A4規格（210X297公釐）

Claims (1)

  1. 經濟部中央標準局貝工消费合作社印製 A8253856 I六、申請專利範圍 1 · 一種物品，包括 a)第一物體（11)，具有焊接墊（22)於第一 物體之表面上： b )第二物體（1 2 )，經由已知成份之焊料在焊接 墊處與第一物體相連接； 其特徵在於此物品還包括 c )限制層，位於該焊接墊之上具有開口貫穿，該限 制層在焊接溫度下與已知成份之熔融焊料不易產生反應： 其中 d )焊接墊包含作用材料之第一層，該材料在焊接溫 度下可與已知成份之熔融焊料作用，因此，當焊料冷却至 熔點之下後，重新凝固之熔融材料（2 4’ ）會在該限制 層之下延伸於該開口之外。 2 ·如申請專利範圍第1項之物品，其中焊料是MSn ，該作用材料是Μ，此處Μ是選自包括金和銀的群組。 3·如申請專利範圍第2項的物品，其中限制層的材 料是選自包括鈦和鉻的群組。 4 ·如申請專利範圍第3項的物品，其中第一物體包 括了一層2氧化矽及依序包含以下各層的焊接墊， i) 鈦層、鉑層及金作用層：或包括 ii) 鈦層、氮化鈦層、鉑層及金作用層。 5 ·如申請專利範園第1項的物品，還包括了電阻器 用以加熱至焊接溫度。 6 ·如申請專利範園第1項的物品，其中第二物體是 「--：------^ -4-------、訂 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標隼（CNS M4規格（210X297公釐） 11 253856 ii D8 六、申請專利範圍 光嫌維。 7 ·—種軟焊結合之方法，用來製作一個包括了第一 物體和以軟焊接合於第一物體之第二物體的物品，該方法 包括 a )提供具有焊接墊於其表面上之第一物體，且有一 些已知成份之焊料於焊接墊上； b )將該一些焊料接觸於第二物體，加熱焊料至高於 焊料之熔化溫度的焊接溫度，並使焊料冷却而使之重新凝 LLa| · 固， 其特點在於該方法還包括 C )提供了限制層於焊接墊上，該限制層有一開口貫 穿且在焊接溫度下與該焊料不易產生作用；且 d )提供了焊接墊，它包括具有在焊接溫度下可與該 焊料作用之作用材料的第一層，可以使焊料在冷却之後， 重新凝固之溶融材料會在該限制層之下延伸到該開口之外 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消费合作社印装 本紙張尺度適用中國國家橾準（CNS ) A4規格（210X297公釐} 12
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US8212943B2 (en) 2006-10-25 2012-07-03 Mstar Semiconductor, Inc. Triple-conversion television tuner

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JPH08250851A (ja) 1996-09-27
EP0717441A2 (en) 1996-06-19
EP0717441A3 (en) 1997-05-02
JP3078489B2 (ja) 2000-08-21
US5622788A (en) 1997-04-22
KR960021335A (ko) 1996-07-18

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