KR960015836A - 집적회로 시험장치 - Google Patents
집적회로 시험장치 Download PDFInfo
- Publication number
- KR960015836A KR960015836A KR1019950038194A KR19950038194A KR960015836A KR 960015836 A KR960015836 A KR 960015836A KR 1019950038194 A KR1019950038194 A KR 1019950038194A KR 19950038194 A KR19950038194 A KR 19950038194A KR 960015836 A KR960015836 A KR 960015836A
- Authority
- KR
- South Korea
- Prior art keywords
- integrated circuit
- circuit tester
- tester
- integrated
- circuit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318516—Test of programmable logic devices [PLDs]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP94-267645 | 1994-10-31 | ||
JP6267645A JP2725615B2 (ja) | 1994-10-31 | 1994-10-31 | 集積回路試験装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960015836A true KR960015836A (ko) | 1996-05-22 |
KR100223077B1 KR100223077B1 (ko) | 1999-10-15 |
Family
ID=17447561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038194A KR100223077B1 (ko) | 1994-10-31 | 1995-10-30 | 집적회로 시험장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6031382A (ko) |
JP (1) | JP2725615B2 (ko) |
KR (1) | KR100223077B1 (ko) |
DE (1) | DE19540621A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8477468B2 (en) | 2011-11-04 | 2013-07-02 | Mersen Usa Newburyport-Ma, Llc | Circuit protection device |
US8810988B2 (en) | 2011-11-04 | 2014-08-19 | Mersen Usa Newburyport-Ma, Llc | Circuit protection device |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6525555B1 (en) | 1993-11-16 | 2003-02-25 | Formfactor, Inc. | Wafer-level burn-in and test |
US6275962B1 (en) * | 1998-10-23 | 2001-08-14 | Teradyne, Inc. | Remote test module for automatic test equipment |
US6499121B1 (en) * | 1999-03-01 | 2002-12-24 | Formfactor, Inc. | Distributed interface for parallel testing of multiple devices using a single tester channel |
JP3371869B2 (ja) | 1999-10-29 | 2003-01-27 | 日本電気株式会社 | ベアチップlsi搭載基板の高速テスト装置 |
US7337088B2 (en) * | 2001-05-23 | 2008-02-26 | Micron Technology, Inc. | Intelligent measurement modular semiconductor parametric test system |
US6764869B2 (en) * | 2001-09-12 | 2004-07-20 | Formfactor, Inc. | Method of assembling and testing an electronics module |
US7162386B2 (en) * | 2002-04-25 | 2007-01-09 | Micron Technology, Inc. | Dynamically adaptable semiconductor parametric testing |
US7010451B2 (en) * | 2003-04-17 | 2006-03-07 | Micron Technology, Inc. | Dynamic creation and modification of wafer test maps during wafer testing |
US8581610B2 (en) | 2004-04-21 | 2013-11-12 | Charles A Miller | Method of designing an application specific probe card test system |
US7803693B2 (en) * | 2007-02-15 | 2010-09-28 | John Trezza | Bowed wafer hybridization compensation |
US7888955B2 (en) * | 2007-09-25 | 2011-02-15 | Formfactor, Inc. | Method and apparatus for testing devices using serially controlled resources |
US7977959B2 (en) | 2007-09-27 | 2011-07-12 | Formfactor, Inc. | Method and apparatus for testing devices using serially controlled intelligent switches |
US8122309B2 (en) | 2008-03-11 | 2012-02-21 | Formfactor, Inc. | Method and apparatus for processing failures during semiconductor device testing |
US8095841B2 (en) | 2008-08-19 | 2012-01-10 | Formfactor, Inc. | Method and apparatus for testing semiconductor devices with autonomous expected value generation |
US7944225B2 (en) | 2008-09-26 | 2011-05-17 | Formfactor, Inc. | Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test |
JP4437508B1 (ja) * | 2009-02-27 | 2010-03-24 | 株式会社アドバンテスト | 試験装置 |
JP4437838B1 (ja) * | 2009-07-13 | 2010-03-24 | 株式会社アドバンテスト | 試験装置 |
JP4482707B1 (ja) * | 2009-07-13 | 2010-06-16 | 株式会社アドバンテスト | 試験装置 |
US7987591B2 (en) * | 2009-08-13 | 2011-08-02 | International Business Machines Corporation | Method of forming silicon chicklet pedestal |
US8400176B2 (en) | 2009-08-18 | 2013-03-19 | Formfactor, Inc. | Wafer level contactor |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3232215A1 (de) * | 1982-08-30 | 1984-03-01 | Siemens AG, 1000 Berlin und 8000 München | Monolithisch integrierte digitale halbleiterschaltung |
DE3526485A1 (de) * | 1985-07-24 | 1987-02-05 | Heinz Krug | Schaltungsanordnung zum pruefen integrierter schaltungseinheiten |
JPH0680708B2 (ja) * | 1986-04-15 | 1994-10-12 | 松下電子工業株式会社 | 半導体チツプの検査方法 |
JP2520234B2 (ja) * | 1986-05-10 | 1996-07-31 | 工業技術院長 | メモリ試験装置 |
JPS62284384A (ja) * | 1986-06-03 | 1987-12-10 | 日立電子エンジニアリング株式会社 | プロ−ビング方式 |
JPS6348479A (ja) * | 1986-08-19 | 1988-03-01 | Mitsubishi Electric Corp | Icテスト装置 |
DE3637502A1 (de) * | 1986-11-04 | 1988-05-11 | Messerschmitt Boelkow Blohm | Mikromechanische testeinrichtung |
DE3724144A1 (de) * | 1987-07-21 | 1989-02-02 | Siemens Ag | Anordnung zum pruefen von auf einem baustein integrierten schaltungen |
US5020219A (en) * | 1988-05-16 | 1991-06-04 | Leedy Glenn J | Method of making a flexible tester surface for testing integrated circuits |
EP0397937A3 (en) * | 1988-05-18 | 1991-07-24 | Hewlett-Packard Company | Control system and method for automated parametric test equipment |
US5206582A (en) * | 1988-05-18 | 1993-04-27 | Hewlett-Packard Company | Control system for automated parametric test equipment |
JP2660028B2 (ja) * | 1988-12-13 | 1997-10-08 | 株式会社東芝 | Lsiのテスト装置 |
JPH02237047A (ja) * | 1989-03-09 | 1990-09-19 | Mitsubishi Electric Corp | 半導体試験装置 |
JPH02239641A (ja) * | 1989-03-14 | 1990-09-21 | Toshiba Corp | 半導体ウエーハ用プロービング装置 |
US5023545A (en) * | 1990-06-04 | 1991-06-11 | The United States Of America | Circuit probing system |
JPH04366776A (ja) * | 1991-06-13 | 1992-12-18 | Nec Kyushu Ltd | Ic試験装置 |
US5177439A (en) * | 1991-08-30 | 1993-01-05 | U.S. Philips Corporation | Probe card for testing unencapsulated semiconductor devices |
JPH05275504A (ja) * | 1992-01-16 | 1993-10-22 | Toshiba Corp | プローブカード |
US5420520A (en) * | 1993-06-11 | 1995-05-30 | International Business Machines Corporation | Method and apparatus for testing of integrated circuit chips |
-
1994
- 1994-10-31 JP JP6267645A patent/JP2725615B2/ja not_active Expired - Lifetime
-
1995
- 1995-10-18 US US08/544,582 patent/US6031382A/en not_active Expired - Fee Related
- 1995-10-30 KR KR1019950038194A patent/KR100223077B1/ko not_active IP Right Cessation
- 1995-10-31 DE DE19540621A patent/DE19540621A1/de not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8477468B2 (en) | 2011-11-04 | 2013-07-02 | Mersen Usa Newburyport-Ma, Llc | Circuit protection device |
US8810988B2 (en) | 2011-11-04 | 2014-08-19 | Mersen Usa Newburyport-Ma, Llc | Circuit protection device |
Also Published As
Publication number | Publication date |
---|---|
KR100223077B1 (ko) | 1999-10-15 |
US6031382A (en) | 2000-02-29 |
DE19540621A1 (de) | 1996-05-02 |
JPH08129053A (ja) | 1996-05-21 |
JP2725615B2 (ja) | 1998-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
AMND | Amendment | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |