KR960003139B1 - 칩 부품 프레스 방법 - Google Patents

칩 부품 프레스 방법 Download PDF

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Publication number
KR960003139B1
KR960003139B1 KR1019920005228A KR920005228A KR960003139B1 KR 960003139 B1 KR960003139 B1 KR 960003139B1 KR 1019920005228 A KR1019920005228 A KR 1019920005228A KR 920005228 A KR920005228 A KR 920005228A KR 960003139 B1 KR960003139 B1 KR 960003139B1
Authority
KR
South Korea
Prior art keywords
plate
holding
press
holding plate
chip component
Prior art date
Application number
KR1019920005228A
Other languages
English (en)
Korean (ko)
Other versions
KR930014874A (ko
Inventor
나오유끼 모리
히데마사 이와미
시게오 하야시
노부유끼 하야시
도오루 마쯔무라
미쯔로 하무로
히로까즈 히구찌
아끼히꼬 다까하시
Original Assignee
가부시끼가이샤 무라따 세이사꾸쇼
무라따 야스따까
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3347939A external-priority patent/JP2976658B2/ja
Priority claimed from JP7897992A external-priority patent/JP2870676B2/ja
Application filed by 가부시끼가이샤 무라따 세이사꾸쇼, 무라따 야스따까 filed Critical 가부시끼가이샤 무라따 세이사꾸쇼
Publication of KR930014874A publication Critical patent/KR930014874A/ko
Application granted granted Critical
Publication of KR960003139B1 publication Critical patent/KR960003139B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1019920005228A 1991-12-03 1992-03-30 칩 부품 프레스 방법 KR960003139B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3347939A JP2976658B2 (ja) 1991-12-03 1991-12-03 チップ部品のプレス装置
JP91-347939 1991-12-03
JP92-078979 1992-02-28
JP7897992A JP2870676B2 (ja) 1992-02-28 1992-02-28 チップ部品のプレス方法

Publications (2)

Publication Number Publication Date
KR930014874A KR930014874A (ko) 1993-07-23
KR960003139B1 true KR960003139B1 (ko) 1996-03-05

Family

ID=26420021

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920005228A KR960003139B1 (ko) 1991-12-03 1992-03-30 칩 부품 프레스 방법

Country Status (4)

Country Link
US (1) US5244073A (de)
KR (1) KR960003139B1 (de)
DE (1) DE4210650C2 (de)
GB (1) GB2262057B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2285759B (en) * 1994-01-05 1998-01-07 Murata Manufacturing Co Apparatus for pushing chip components into holding plate
NL1006562C2 (nl) * 1997-07-11 1999-01-12 Fico Bv Opspaninrichting, werktuig en werkwijze voor bevestiging van werktuigen.
US7895738B2 (en) * 2006-11-16 2011-03-01 Porter Group, Llc Apparatus and system part assembly fasteners
JP6643578B2 (ja) * 2016-09-08 2020-02-12 パナソニックＩｐマネジメント株式会社 部品搭載装置及び部品搭載方法
DE102020106985B4 (de) 2020-03-13 2023-04-27 Tdk Electronics Ag Verfahren zum Aufbringen einer Metallisierung auf mehrere elektronische Bauteile

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
JPS60109204A (ja) * 1983-11-17 1985-06-14 株式会社村田製作所 チップ部品の外部電極形成方法
US4561954A (en) * 1985-01-22 1985-12-31 Avx Corporation Method of applying terminations to ceramic bodies
JPH0680602B2 (ja) * 1987-11-28 1994-10-12 株式会社村田製作所 電子部品チップ保持治具および電子部品チップ取扱い方法
US4847991A (en) * 1988-02-05 1989-07-18 Murata Manufacturing Co., Ltd. Method for inserting chip parts into a holding plate and apparatus used for the same

Also Published As

Publication number Publication date
DE4210650C2 (de) 2000-07-06
GB9206905D0 (en) 1992-05-13
GB2262057A (en) 1993-06-09
DE4210650A1 (de) 1993-06-24
US5244073A (en) 1993-09-14
KR930014874A (ko) 1993-07-23
GB2262057B (en) 1995-05-10

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Year of fee payment: 17

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