KR960002495B1 - 개량된 리드를 갖는 반도체장치 - Google Patents

개량된 리드를 갖는 반도체장치 Download PDF

Info

Publication number
KR960002495B1
KR960002495B1 KR1019920018856A KR920018856A KR960002495B1 KR 960002495 B1 KR960002495 B1 KR 960002495B1 KR 1019920018856 A KR1019920018856 A KR 1019920018856A KR 920018856 A KR920018856 A KR 920018856A KR 960002495 B1 KR960002495 B1 KR 960002495B1
Authority
KR
South Korea
Prior art keywords
lead
semiconductor device
palladium
film
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920018856A
Other languages
English (en)
Korean (ko)
Other versions
KR930009047A (ko
Inventor
가즈또 쓰지
요시유끼 요네다
준이찌 가사이
미찌오 소노
Original Assignee
후지쓰 가부시끼가이샤
세끼자와 다다시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰 가부시끼가이샤, 세끼자와 다다시 filed Critical 후지쓰 가부시끼가이샤
Publication of KR930009047A publication Critical patent/KR930009047A/ko
Application granted granted Critical
Publication of KR960002495B1 publication Critical patent/KR960002495B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019920018856A 1991-10-14 1992-10-14 개량된 리드를 갖는 반도체장치 Expired - Fee Related KR960002495B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26466591 1991-10-14
JP91-264665 1991-10-14

Publications (2)

Publication Number Publication Date
KR930009047A KR930009047A (ko) 1993-05-22
KR960002495B1 true KR960002495B1 (ko) 1996-02-17

Family

ID=17406508

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920018856A Expired - Fee Related KR960002495B1 (ko) 1991-10-14 1992-10-14 개량된 리드를 갖는 반도체장치

Country Status (3)

Country Link
US (1) US5521432A (https=)
EP (1) EP0537982A2 (https=)
KR (1) KR960002495B1 (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072239A (en) * 1995-11-08 2000-06-06 Fujitsu Limited Device having resin package with projections
US6558979B2 (en) * 1996-05-21 2003-05-06 Micron Technology, Inc. Use of palladium in IC manufacturing with conductive polymer bump
US5925930A (en) 1996-05-21 1999-07-20 Micron Technology, Inc. IC contacts with palladium layer and flexible conductive epoxy bumps
US6521358B1 (en) * 1997-03-04 2003-02-18 Matsushita Electric Industrial Co., Ltd. Lead frame for semiconductor device and method of producing same
US5923081A (en) * 1997-05-15 1999-07-13 Micron Technology, Inc. Compression layer on the leadframe to reduce stress defects
EP0887850A3 (en) 1997-06-23 2001-05-02 STMicroelectronics, Inc. Lead-frame forming for improved thermal performance
CN1134839C (zh) * 1997-12-26 2004-01-14 三星航空产业株式会社 引线框架及涂敷引线框架的方法
WO2001028726A1 (en) * 1998-04-20 2001-04-26 Senju Metal Industry Co., Ltd. Solder coating material and production method therefor
US6087714A (en) * 1998-04-27 2000-07-11 Matsushita Electric Industrial Co., Ltd. Semiconductor devices having tin-based solder film containing no lead and process for producing the devices
US8330270B1 (en) 1998-06-10 2012-12-11 Utac Hong Kong Limited Integrated circuit package having a plurality of spaced apart pad portions
US6229200B1 (en) 1998-06-10 2001-05-08 Asat Limited Saw-singulated leadless plastic chip carrier
US6194777B1 (en) * 1998-06-27 2001-02-27 Texas Instruments Incorporated Leadframes with selective palladium plating
US20030011048A1 (en) * 1999-03-19 2003-01-16 Abbott Donald C. Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered
US6544880B1 (en) * 1999-06-14 2003-04-08 Micron Technology, Inc. Method of improving copper interconnects of semiconductor devices for bonding
KR100322098B1 (ko) * 1999-11-18 2002-02-06 김순택 2차 전지
US6953986B2 (en) * 1999-12-10 2005-10-11 Texas Instruments Incorporated Leadframes for high adhesion semiconductor devices and method of fabrication
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
US6225684B1 (en) 2000-02-29 2001-05-01 Texas Instruments Tucson Corporation Low temperature coefficient leadframe
US20030151120A1 (en) * 2000-06-28 2003-08-14 Hundt Michael J. Lead-frame forming for improved thermal performance
US6790710B2 (en) 2002-01-31 2004-09-14 Asat Limited Method of manufacturing an integrated circuit package
US6667629B2 (en) 2001-09-24 2003-12-23 Rika Electronics International, Inc. Electrical test probes and methods of making the same
US20040109525A1 (en) * 2002-12-09 2004-06-10 Chieng Koc Vai Chieng Aka Michael Automatic chip counting system (process)
US20070272441A1 (en) * 2004-05-25 2007-11-29 Shinko Electric Industries Co., Ltd. Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device
KR20060030356A (ko) * 2004-10-05 2006-04-10 삼성테크윈 주식회사 반도체 리이드 프레임과, 이를 포함하는 반도체 패키지와,이를 도금하는 방법
US7268415B2 (en) * 2004-11-09 2007-09-11 Texas Instruments Incorporated Semiconductor device having post-mold nickel/palladium/gold plated leads
JP4499752B2 (ja) * 2006-03-03 2010-07-07 日本エレクトロプレイテイング・エンジニヤース株式会社 電子部品
DE102006023998B4 (de) 2006-05-22 2009-02-19 Infineon Technologies Ag Elektronische Schaltungsanordnung und Verfahren zur Herstellung einer solchen
JP2010055842A (ja) * 2008-08-26 2010-03-11 Panasonic Electric Works Co Ltd 照明装置
JP5894502B2 (ja) * 2012-06-04 2016-03-30 ローム株式会社 ワイヤボンディング構造および半導体装置
JP6095997B2 (ja) * 2013-02-13 2017-03-15 エスアイアイ・セミコンダクタ株式会社 樹脂封止型半導体装置の製造方法
US10796986B2 (en) * 2016-03-21 2020-10-06 Infineon Technologies Ag Leadframe leads having fully plated end faces
JP7192688B2 (ja) 2019-07-16 2022-12-20 Tdk株式会社 電子部品パッケージ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4529667A (en) * 1983-04-06 1985-07-16 The Furukawa Electric Company, Ltd. Silver-coated electric composite materials
US4785137A (en) * 1984-04-30 1988-11-15 Allied Corporation Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
DE3717246A1 (de) * 1986-05-23 1987-11-26 Mitsubishi Electric Corp Material auf nickelbasis fuer eine halbleiteranordnung
EP0250146A1 (en) * 1986-06-16 1987-12-23 Texas Instruments Incorporated Palladium plated lead frame for integrated circuit
JPH0828455B2 (ja) * 1988-02-24 1996-03-21 富士通株式会社 リードフレーム及びそれを用いた電子部品の製造方法
EP0335608B1 (en) * 1988-03-28 1995-06-14 Texas Instruments Incorporated Lead frame with reduced corrosion
EP0384586A3 (en) * 1989-02-22 1991-03-06 Texas Instruments Incorporated High reliability plastic package for integrated circuits
JP2734463B2 (ja) * 1989-04-27 1998-03-30 株式会社日立製作所 半導体装置
JPH0359972A (ja) * 1989-07-27 1991-03-14 Yazaki Corp 電気接点
KR920000127A (ko) * 1990-02-26 1992-01-10 미다 가쓰시게 반도체 패키지와 그것을 위한 리드프레임
US5175609A (en) * 1991-04-10 1992-12-29 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy

Also Published As

Publication number Publication date
KR930009047A (ko) 1993-05-22
EP0537982A3 (https=) 1994-02-16
US5521432A (en) 1996-05-28
EP0537982A2 (en) 1993-04-21

Similar Documents

Publication Publication Date Title
KR960002495B1 (ko) 개량된 리드를 갖는 반도체장치
KR100265563B1 (ko) 볼 그리드 어레이 패키지 및 그의 제조 방법
KR100299384B1 (ko) 볼 그리드 어레이 패키지
JP3062086B2 (ja) Ｉｃパッケージ
US20070269932A1 (en) Semiconductor Device Having Post-Mold Nickel/Palladium/Gold Plated Leads
JP3150926B2 (ja) 集積回路パッケージのリードフレーム及びその製造方法
JP2001110971A (ja) 半導体パッケージ用リードフレーム及びその製造方法
US5444293A (en) Structure and method for providing a lead frame with enhanced solder wetting leads
EP1938375B1 (en) Leadframes for improved moisture reliability of semiconductor devices
KR19990080573A (ko) 반도체 패키지용 리드프레임 및 리드프레임 도금방법
JP2000133763A (ja) 樹脂封止型半導体装置用の回路部材およびその製造方法
EP0384586A2 (en) High reliability plastic package for integrated circuits
CN1068064C (zh) 引线框架及其制造方法
KR100591235B1 (ko) 반도체 장치
US20050184366A1 (en) Lead frame and method for manufacturing semiconductor package with the same
US6518099B2 (en) Plated leadframes with cantilevered leads
KR100231832B1 (ko) 다중 도금층을 가진 반도체 리드프레임
JPH05211261A (ja) 半導体装置
KR100189818B1 (ko) 반도체 리드 프레임
KR100192845B1 (ko) 기판상에 전극 패턴을 형성하는 방법과 그를 이용한 모듈 패키지
KR100203334B1 (ko) 다층도금 리드프레임
KR0184119B1 (ko) 리드 프레임의 바깥리드부 도금방법
KR100254271B1 (ko) 다층 도금 리이드 프레임
KR100254268B1 (ko) 다층 구조의 도금층을 갖는 반도체용 리드프레임
KR20000009009A (ko) 리드 프레임 및 이 리드 프레임이 채용된 반도체패키지

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19990218

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19990218

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000