KR960000729A - Ic 리이드 프레임의 폭좁히기 방법과 그 장치 - Google Patents

Ic 리이드 프레임의 폭좁히기 방법과 그 장치 Download PDF

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Publication number
KR960000729A
KR960000729A KR1019950014611A KR19950014611A KR960000729A KR 960000729 A KR960000729 A KR 960000729A KR 1019950014611 A KR1019950014611 A KR 1019950014611A KR 19950014611 A KR19950014611 A KR 19950014611A KR 960000729 A KR960000729 A KR 960000729A
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South Korea
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narrowing
substrate
lead frame
width
gap
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KR1019950014611A
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English (en)
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KR100232382B1 (ko
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미도미 이시이
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이시이 미도시
가부시기가이샤 이시이 고우사꾸겐 규우쇼
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Publication of KR960000729A publication Critical patent/KR960000729A/ko
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Publication of KR100232382B1 publication Critical patent/KR100232382B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/06—Storage devices mechanical with means for presenting articles for removal at predetermined position or level
    • B65G1/07—Storage devices mechanical with means for presenting articles for removal at predetermined position or level the upper article of a pile being always presented at the same predetermined level
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/10—Aligning parts to be fitted together
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/10—Aligning parts to be fitted together
    • B23P19/12—Alignment of parts for insertion into bores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/022—Feeding of components with orientation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Framework For Endless Conveyors (AREA)

Abstract

본 발명의 목적은 타 종류의 IC를 센터링 하기 위한 폭좁히기 판을 자동적으로 위치 결정하고, 그 구성은 나사 드라이버(2)를 손으로 꽉쥐고, 그 회전축(45)의 돌기(48)를 소켓 스패너(25)의 구동공(29)에 삽입하고, 소켓 스패너(25)측에 밀어서 들어가고, 코일 스프링(30)을 압축해서 나사봉(7)위를 미끄러 움직이게 시킨다. 동시에 이 미는 압력에 의해 회전축(45)는 코일 스프링(51)을 압축하고, 회전축(45)의 원통부(47)가 이동하고, 이동은 기동 스위치(52)에 검출된다. 서어보 모우터(41)는 기동되는 나사봉(7)을 회전 구동하고 폭좁히기판(16), (17)을 넓히고, 기계원점센서(24)에 검지될때 까지 이동한다. 이 좌표위치를 기계원점으로 인식하고 이 위치로부터 폭좁히기 위치 메모리에 미리 기억시켜 있는 IC의 폭의 거리까지 폭좁히기판(16), (17)을 이동시킨다.

Description

IC 리이드 프레임의 폭좁히기 방법과 그 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 IC리이드 프레임 폭좁히기 시스템의 입체분해 부품도.
제2도는 IC리이드 프레임 폭좁히기 시스템의 조립 단면도.
제3도는 제2도의 클러치 부분의 부분확대 단면도.
제4도는 폭좁히기 장치 나사드라이버로 구동할 때의 단면도.
제5도는 제4도의 부분 확대 단면도.

Claims (4)

  1. IC리이드 프레임을 위치결정하기 위해 폭접히기 판의 간격을 규정하는 IC리이드 프레임 폭좁히기 방법이며, 상기 폭좁히기 판의 기계고유 위치를 검출하기 위해 배치한 기계원점 위치를 검지(檢知)하는 기계원점위이 검출공정과, 상기 기계원점위치로 부터 미리 기억된 위치 데이터에 의해 상기 폭좁히기판의 간격을 결정하는 위치결정공정으로 되는 것을 특징으로 IC리이드 프레임 폭좁히기 방법.
  2. IC리이드 프레임을 위치결정하기 위해 폭좁히기판의 간격을 규정하는 IC리이드 프레임 폭좁히기 방법이며, 상기 폭좁히기판의 위치데이터를 기억해두는 기억공정과, 상기 위치 데이터로부터 이동시킬려고 하는 위치와의 차(差)만 상기 폭좁히기판의 간격을 규정하는 차분(差分) 이동공정으로 되는 것을 특징으로 하는 IC리이드 프레임 폭좁히기 방법.
  3. IC리이드 프레임을 위치결정하기 위한 폭좁히기판과, 상기 폭좁히기판의 간격을 조절하기 위한 폭조정기구와, 상기 폭좁히기판의 기계고유 위치를 검출하고, 또, 원점을 규정하기 위한 기계원점센서와, 상기 폭좁히기판의 간격을 조절하기 위해 상기 폭좁히기판을 구동시키기 위한 구동 모우터와, 상기 폭좁히기판의 폭조정기구를 구동시에 상기 구동모우터와 연결하기 위한 클러치수단과, 상기 폭좁히기판의 간격데이터를 IC리이드 프레임에 맞추어서 미리 기억하기 위한 기억수단과, 상기 구동모우터를 상기 간격데이터에 응해서 회전제어하기 위한 모우터 제어수단으로 되는 것을 특징으로 하는 IC리이드 프레임 폭좁히기 장치.
  4. 제3항에 있어서, 상기 폭조정기구가 비작동시에 작동하지 않도록 잠그기 위한 잠금기구로도 되는 것을 특징으로 하는 IC리이드 프레임 폭좁히기 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950014611A 1994-06-15 1995-06-02 Ic 리이드 프레임의 폭좁히기 장치 KR100232382B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-157867 1994-06-15
JP6157867A JP2798237B2 (ja) 1994-06-15 1994-06-15 Ｉｃリードフレーム幅寄せ装置

Publications (2)

Publication Number Publication Date
KR960000729A true KR960000729A (ko) 1996-01-25
KR100232382B1 KR100232382B1 (ko) 1999-12-01

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KR1019950014611A KR100232382B1 (ko) 1994-06-15 1995-06-02 Ic 리이드 프레임의 폭좁히기 장치

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Country Link
US (1) US5657538A (ko)
EP (1) EP0688154B1 (ko)
JP (1) JP2798237B2 (ko)
KR (1) KR100232382B1 (ko)
CN (1) CN1066575C (ko)
DE (1) DE69511471T2 (ko)
TW (1) TW278228B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103901B1 (ko) * 2009-12-07 2012-01-12 삼화왕관주식회사 진공 병마개 및 이의 제조방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4046391B2 (ja) * 1997-11-28 2008-02-13 松下電器産業株式会社 プリント基板の搬送装置および搬送方法
KR100332881B1 (ko) * 2000-06-21 2002-04-15 이형도 리드의 센터링 장치
DE102011113765A1 (de) * 2011-09-19 2013-03-21 Ludwig Ehrhardt Gmbh Spannvorrichtung mit einem Elektromotor
CN103406868B (zh) * 2013-07-11 2016-06-29 湖南红太阳新能源科技有限公司 一种太阳能电池组件拆框机构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942066U (ja) * 1982-09-10 1984-03-17 三和システムエンジニアリング株式会社 薄板状ワ−クのガイドの幅調整装置
JPS59172731A (ja) * 1983-03-22 1984-09-29 Toshiba Corp リ−ドフレ−ム搬送装置
JPS60242140A (ja) * 1984-05-15 1985-12-02 Mita Ind Co Ltd 給紙装置
JPS62144392A (ja) * 1985-12-19 1987-06-27 ティーディーケイ株式会社 電子部品実装方法
US4776080A (en) * 1986-12-15 1988-10-11 Hewlett-Packard Company Workpiece transport system with individually characterized offsets
US4833776A (en) * 1988-01-29 1989-05-30 Westinghouse Electric Corp. Tactile retrieval and insertion and method for electronic components in through-hole printed circuit boards
JPH0646645B2 (ja) * 1988-08-25 1994-06-15 株式会社東芝 リードフレーム搬送装置
JPH03211145A (ja) * 1990-01-09 1991-09-13 Mitsubishi Electric Corp リードフレーム搬送方法および装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103901B1 (ko) * 2009-12-07 2012-01-12 삼화왕관주식회사 진공 병마개 및 이의 제조방법

Also Published As

Publication number Publication date
CN1120242A (zh) 1996-04-10
DE69511471T2 (de) 1999-12-16
CN1066575C (zh) 2001-05-30
EP0688154B1 (en) 1999-08-18
EP0688154A2 (en) 1995-12-20
JPH0823001A (ja) 1996-01-23
KR100232382B1 (ko) 1999-12-01
JP2798237B2 (ja) 1998-09-17
DE69511471D1 (de) 1999-09-23
TW278228B (ko) 1996-06-11
EP0688154A3 (en) 1996-07-17
US5657538A (en) 1997-08-19

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