KR950032387A - 공유결합의 형성에의한 폴리이미드 표면에 대한 접착 방법 - Google Patents

공유결합의 형성에의한 폴리이미드 표면에 대한 접착 방법 Download PDF

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KR950032387A
KR950032387A KR1019950004226A KR19950004226A KR950032387A KR 950032387 A KR950032387 A KR 950032387A KR 1019950004226 A KR1019950004226 A KR 1019950004226A KR 19950004226 A KR19950004226 A KR 19950004226A KR 950032387 A KR950032387 A KR 950032387A
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polyimide surface
polyimide layer
hydroxyl group
polyimide
group amine
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KR1019950004226A
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KR100341945B1 (ko
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케이. 뮤커지 프로산토
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빈센트 비. 인그라시아
모토로라 인코포레이티드
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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    • C08J5/122—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using low molecular chemically inert solvents, swelling or softening agents
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    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H05K1/03—Use of materials for the substrate
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

반도체 장치(12)의 폴리이미드 표면(18)은 폴리이미드 층이 승온 상태에서 하이드록실기 아민 용액으로 예비처리되어서 하부 충전 캡슐재(16)와 반응하는 작용기를 형성하고 경화 공정중에 반도체 장치와 기판(10) 사이의 캡슐재와 폴리이미드 층 사이에 공유결합을 형성한다. 하이드록실기 아민 용액은 65℃에서 60초 동안 N-메틸 파이로리디온과 같은 용매에 용해되는 2,(2-아미노에톡시) 에탄올과 같은 시약을 포함한다. 하이드록실기아민 용액은 폴리이미드층에 용사되거나 증착법으로 증착될수 있다. 처리된 폴리이미드 층을 갖는 반도체다이는 조립체 사이에 틈새를 남겨두고서 DCA 방법으로 기판에 부착된다. 반도체 다이와 기판 사이에 캡슐제가 도입되어 경화되므로써 폴리임드층과의 공유 결합 및 조립체 사이의 외부 밀봉을 형성하여 향상된 접착성을 부여한다.

Description

공유결합의 형성에의한 폴로이미드 표면에 대한 접착 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
본 도면은 기판에 접합된 반도체 장치의 도시도.

Claims (5)

  1. 폴리이미드 표면(18)에 대한 접착 방법에 있어서, 아미노-에스테르와 아미드를 형성하도록 폴리이미드 표면을 예비처리하기 위하여 승온 상태에서 폴리이미드 표면상에 유기 염기 용액을 배치하는 단계를 포함하는 것을 특징으로 하는 폴리이미드 표면에 대한 접착 방법.
  2. 제1항에 있어서, 상기 유기 염기 용액은 하이드록실기 아민 용액인 것을 특징으로 하는 폴리이미드 표면에 대한 접착 방법.
  3. 폴리이미드 표면에 대한 접착 방법에 있어서, 아미노-에스테르 및 아미드기를 형성하도록 폴리이미드 표면을 예비처리하기 위하여 승온 상태에서 폴리이미드 표면상에 하이드록실기 아민 용액을 배치하는 단계와, 폴리이미드 표면상에 에폭시 재료를 배치하는 단계와, 폴리이미드 표면에 공유 결합을 형성하도록 상기 에폭시 재료를 경화하는 단계를 포함하는 것을 특징으로 하는 폴리이미드 표면에 대한 접착 방법
  4. 제3항에 있어서, 상기 캡슐재와 상기 공유 결합을 형성하는 폴리이미드 표면상에 상기 아미노-에스테르 및 아미드기를 형성하도록 50 내지 90℃의 범위에서 상기 하이드록실기 아민용액을 가열하는 단계를 더 포함하는 것을 특징으로 하는 폴리이미드 표면에 대한 접착 방법.
  5. 아미노-에스테르 및 아미드기를 형성하도록 승온 상태에서 하이드록실기 아민 용액으로 예비처리된 폴리이미드 표면(18)과, 상기 접착 표면과 공유 결합을 갖는 캡슐재(16)를 포함하는것을 특징으로 하는 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950004226A 1994-04-05 1995-02-24 공유결합의형성에의한폴리이미드표면에대한접착방법 KR100341945B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/223,184 US5391397A (en) 1994-04-05 1994-04-05 Method of adhesion to a polyimide surface by formation of covalent bonds
US223,184 1994-04-05

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KR950032387A true KR950032387A (ko) 1995-12-20
KR100341945B1 KR100341945B1 (ko) 2002-11-23

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US (2) US5391397A (ko)
EP (1) EP0676803A3 (ko)
JP (1) JPH07283244A (ko)
KR (1) KR100341945B1 (ko)
CN (1) CN1059913C (ko)

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CN1121090A (zh) 1996-04-24
US5391397A (en) 1995-02-21
EP0676803A2 (en) 1995-10-11
JPH07283244A (ja) 1995-10-27
KR100341945B1 (ko) 2002-11-23
US5442240A (en) 1995-08-15
EP0676803A3 (en) 1998-05-13
CN1059913C (zh) 2000-12-27

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