KR950030291A - 와이어본딩방법 및 장치 - Google Patents

와이어본딩방법 및 장치 Download PDF

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KR950030291A
KR950030291A KR1019950008246A KR19950008246A KR950030291A KR 950030291 A KR950030291 A KR 950030291A KR 1019950008246 A KR1019950008246 A KR 1019950008246A KR 19950008246 A KR19950008246 A KR 19950008246A KR 950030291 A KR950030291 A KR 950030291A
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capillary
offset
camera
amount
bonding
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KR0161330B1 (ko
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도시아키 사사노
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후지야마 겐지
가부시키가이샤 신가와
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
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    • H01L2224/481—Disposition
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
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    • H01L2224/7825—Means for applying energy, e.g. heating means
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    • H01L2224/852—Applying energy for connecting
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

목적 : 오프셋의 어긋남량이 자동적으로 수정되고, 또 수정정밀도 향상이 도모됨과 동시에 경시적인 오프셋 변동도 수정가능하게 한다.
구성 : 와이어본딩후에 본딩된 볼 또는 캐필러리의 압흔 상방으로 상기 시료검출중심축을 이동시키는 오프셋의 수정시기 및 오프셋 수정수순이 기억된 오프셋 수정용 제어메모리(35), 오프셋량이 기억된 오프셋메모리(39), 및 오프셋 수정용 제어메모리(35)에 의해 XY 테이블을 구동하여 카메라(11)의 시료검출중심축을 상기볼 도는 캐필러리의 압흔 상방으로 이동시켜 화상처리부(20)의 연산제어부(24)에서 산출한 어긋남량에 의해 오프셋메모리(39)에 기억되어 있는 오프셋량을 보정하는 장치구동부(30)의 연산제어부(36)를 구비하고 있다.

Description

와이어본딩방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 와이어본딩 방법에 사용하는 제어회로부의 일실시예를 나타내는 블록도, 제2도는 본딩된 볼의 어긋남 검출표시도, 제3도는 리드부의 본딩부분 평면도.

Claims (2)

  1. 리드프레임과 반도체 칩이 부착된 시료를 와이어본딩하는 캐필러리, 이 캐필러리와 일정한 오프셋량을 가지고 설치된 시료검출 중심축을 갖는 카메라, 및 캐필러리 및 카메라를 함께 XY 축방향으로 구동하는 XY테이블을 구비하고, 상기 카메라로 시료의 어긋남량을 검출하여 본딩좌표를 수정하고, 상기 오프셋량만큼 이동시켜 예정된 프로그램에 따라 상기 수정된 본딩좌표로 캐필러리를 순차이동시켜서 본딩하는 와이어 본딩방법에 있어서, 와이어본딩 후에 본딩된 볼 또는 캐필럴리의 압흔 상방으로 상기 시료 검출중심축이 이동하도록 상기 XY 테이블이 자동적으로 구동되어, 볼 또는 캐필러리의 압흔이 위치 어긋남을 검출하여 상기 오프셋의 어긋남량을 보정하는 것을 특징으로 하는 와이어본딩방법.
  2. 리드페리임과 반도체 칩이 부착된 시료를 와이어본딩하는 캐필러리, 이 캐필러리와 일정한 오프셋량을 가지고 설치된 시료검출 중심축을 갖는 카메라, 캐필러리 및 카메라를 함께 XY 축방향으로 구동하는 XY 테이블 및 상기 카메라로 촬상한 화상을 처리하여 화상의 위치어긋남량을 산출하는 화상처리부의 연산제어부를 구비한 와이어본딩장치에 있어서, 와이어본딩 후에 본딩된 볼 또는 캐필러리의 압흔 상방으로 상기 시료검출중심축을 이동시키는 오프셋의 수정시기 및 오프셋 수정수순이 기억된 오프셋 수정용 제어 메모리, 상기 오프셋량이 기억된 오프셋 메모리 및 상기 오프셋 수정용 제어메모리에 의해 상기 XY 테이블을 구동하여 상기 시료검출중심축을 상기 볼 또는 캐필러리의 압흔상방으로 이동시켜 상기 화상처리부의 연산제어부에서 산출한 어긋남량에 의해 상기 오프셋 메모리에 기억되고 있는 오프셋량을 보정하는 장치구동부의 연산제어부를 구비한 것을 특징으로 하는 와이어본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950008246A 1994-04-27 1995-04-10 와이어본딩방법 및 장치 KR0161330B1 (ko)

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JP94-110241 1994-04-27
JP06110241A JP3101854B2 (ja) 1994-04-27 1994-04-27 ワイヤボンデイング装置

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US9314869B2 (en) * 2012-01-13 2016-04-19 Asm Technology Singapore Pte. Ltd. Method of recovering a bonding apparatus from a bonding failure
CN110899893A (zh) * 2019-12-24 2020-03-24 上海和达汽车配件有限公司 一种焊接机器人偏移量十字检查方法

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JP2841126B2 (ja) * 1991-04-19 1998-12-24 株式会社新川 ワイヤボンデイング方法及び装置
JP3009564B2 (ja) * 1993-07-16 2000-02-14 株式会社カイジョー ワイヤボンディング装置及びその方法

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* Cited by examiner, † Cited by third party
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KR100332128B1 (ko) * 1995-11-02 2002-12-02 주식회사 하이닉스반도체 와이어본더의툴오프셋방법및장치

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JPH07297220A (ja) 1995-11-10
US5615821A (en) 1997-04-01
JP3101854B2 (ja) 2000-10-23

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