KR950015684A - 본딩장치 - Google Patents

본딩장치 Download PDF

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Publication number
KR950015684A
KR950015684A KR1019940030728A KR19940030728A KR950015684A KR 950015684 A KR950015684 A KR 950015684A KR 1019940030728 A KR1019940030728 A KR 1019940030728A KR 19940030728 A KR19940030728 A KR 19940030728A KR 950015684 A KR950015684 A KR 950015684A
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KR
South Korea
Prior art keywords
bonding apparatus
vibration
bonding
ultrasonic horn
horn
Prior art date
Application number
KR1019940030728A
Other languages
English (en)
Other versions
KR0151698B1 (ko
Inventor
다다시 아키이케
미노루 가와기시
미츠아키 사카쿠라
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 후지야마 겐지, 가부시키가이샤 신가와 filed Critical 후지야마 겐지
Publication of KR950015684A publication Critical patent/KR950015684A/ko
Application granted granted Critical
Publication of KR0151698B1 publication Critical patent/KR0151698B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B3/02—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency involving a change of amplitude
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/04—Gramophone pick-ups using a stylus; Recorders using a stylus
    • H04R17/08—Gramophone pick-ups using a stylus; Recorders using a stylus signals being recorded or played back by vibration of a stylus in two orthogonal directions simultaneously

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Wire Bonding (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

본드면에 안정된 접합에너지를 부여할 수가 있으며, 접합에 필요한 합금의 균일한 생성을 가능케하여, 본딩품질의 향상을 도모한다.
초음파 혼(3)의 선단부에는 추(20)를 부착, 진동의 상하방향의 성분을 발생시키고 있다.

Description

본딩장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명을 이룬 본딩장치의 초음파 혼의 제1실시예를 도시한 측면도.
제2도는 본 발명을 이룬 본딩장치의 초음파 혼의 제2실시예를 도시한 측면도.
제3도는 본 발명을 이룬 본딩장치의 초음파 혼의 제3실시예를 도시한 주요부 단면도.
제4도는 본 발명을 이룬 본딩장치의 초음파 혼의 제4실시예를 도시한 주요부 단면도.

Claims (5)

  1. 한쪽끝에 부착된 본딩투울과 전왜소자 또는 자왜소자등의 진동발생원을 구비하는 초음파 혼을 본드아암에 부착한 본딩장치에 있어서, 상기 초음파 혼은 진동의 상하방향의 성분을 조정하는 상하방향 진동 조정부를 가지고 있는 것을 특징으로 하는 본딩장치.
  2. 제1항에 있어서, 상기 상하방향 진동 조정부는 초음파 혼의 진동의 배(腹) 또는 마디(節)부분의 상하를 비대칭 형상으로 형성하여 이루어진 것을 특징으로 하는 본딩장치.
  3. 제2항에 있어서, 상기 비대칭 형상은 추의 돌기 또는 오목부 또는 비중이 다른 금속을 조립하여 형성하여 이루어진 것을 특징으로 하는 본딩장치.
  4. 제2항에 있어서, 상기 비대칭 형상은 본드아암에 고정하는 초음파 혼의 혼 지지부를 상하로 편심시켜서 형성이 되어 이루어진 것을 특징으로 하는 본딩장치.
  5. 제1항에 있어서, 상기 상하방향 진동 조정부는 혼본체의 축심과 진동자의 축심을 상하로 어긋나게 부착함으로써 형성하여 이루어진 것을 특징으로 하는 본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940030728A 1993-11-30 1994-11-22 본딩장치 KR0151698B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32612193A JP3172901B2 (ja) 1993-11-30 1993-11-30 ボンデイング装置
JP93-326121 1993-11-30

Publications (2)

Publication Number Publication Date
KR950015684A true KR950015684A (ko) 1995-06-17
KR0151698B1 KR0151698B1 (ko) 1998-12-01

Family

ID=18184314

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940030728A KR0151698B1 (ko) 1993-11-30 1994-11-22 본딩장치

Country Status (3)

Country Link
US (1) US5540807A (ko)
JP (1) JP3172901B2 (ko)
KR (1) KR0151698B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11877405B2 (en) 2018-06-15 2024-01-16 Samsung Electronics Co., Ltd. Electronic device including display

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW334622B (en) * 1996-04-17 1998-06-21 Esec Sa Apparatus for making wire connections on semiconductor chips
US6121716A (en) * 1997-07-11 2000-09-19 The United States Of America As Represented By The United States Department Of Energy Apparatus and method for prevention of cracking in welded brittle alloys
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
JP3215084B2 (ja) * 1998-04-28 2001-10-02 株式会社アルテクス 超音波振動接合用共振器
US6073827A (en) * 1998-08-27 2000-06-13 Kulicke & Soffa Investments, Inc. Wire bonding capillary with a conical surface
US6190497B1 (en) 1999-04-23 2001-02-20 The Hong Kong Polytechnic University Ultrasonic transducer
JP3704253B2 (ja) * 1999-05-28 2005-10-12 株式会社新川 ボンディング装置の超音波トランスデューサ及びその製造方法
US6286747B1 (en) 2000-03-24 2001-09-11 Hong Kong Polytechnic University Ultrasonic transducer
JP3546376B2 (ja) * 2000-08-07 2004-07-28 澁谷工業株式会社 ボンディング装置
JP2002368036A (ja) * 2001-06-11 2002-12-20 Nec Kyushu Ltd ワイアボンディング装置
DE10160228A1 (de) * 2001-12-07 2003-06-18 Hesse & Knipps Gmbh Kreuztransducer
DE102004045575A1 (de) * 2004-09-17 2006-04-06 Hesse & Knipps Gmbh Ultraschalltransducer mit einem in der Lagerung angeordneten Sensor
DE102005044048B4 (de) * 2004-09-30 2007-05-03 Unaxis International Trading Ltd. Wire Bonder
JP5930423B2 (ja) * 2014-05-09 2016-06-08 株式会社カイジョー ボンディング装置
CN104624467B (zh) * 2015-01-23 2017-01-25 陕西师范大学 具有夹角结构的纵振动变幅杆
CN105013686B (zh) * 2015-07-29 2017-07-11 陕西师范大学 可换向的纵振动方向变换器的设计方法和应用
WO2020105434A1 (ja) * 2018-11-20 2020-05-28 株式会社Ｌｉｎｋ－Ｕｓ 超音波接合装置
US20210016409A1 (en) * 2019-07-16 2021-01-21 Facebook Technologies, Llc Ultrasonic sub-aperture polishing of an optical element

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US3451607A (en) * 1966-03-14 1969-06-24 Sola Basic Ind Apparatus for effecting bonding of semiconductor parts
GB1506164A (en) * 1974-07-09 1978-04-05 Mullard Ltd Ultrasonic bonding apparatus
CA1037237A (en) * 1976-10-01 1978-08-29 Jean M. Dupuis Apparatus for preforming wire leads and alignment for bonding
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
JP2665080B2 (ja) * 1991-08-02 1997-10-22 山形日本電気株式会社 半導体製造装置
JP3128715B2 (ja) * 1992-12-24 2001-01-29 株式会社新川 ボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11877405B2 (en) 2018-06-15 2024-01-16 Samsung Electronics Co., Ltd. Electronic device including display

Also Published As

Publication number Publication date
JP3172901B2 (ja) 2001-06-04
JPH07153801A (ja) 1995-06-16
KR0151698B1 (ko) 1998-12-01
US5540807A (en) 1996-07-30

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