KR940016443A - 본딩장치 - Google Patents

본딩장치 Download PDF

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Publication number
KR940016443A
KR940016443A KR1019930026752A KR930026752A KR940016443A KR 940016443 A KR940016443 A KR 940016443A KR 1019930026752 A KR1019930026752 A KR 1019930026752A KR 930026752 A KR930026752 A KR 930026752A KR 940016443 A KR940016443 A KR 940016443A
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KR
South Korea
Prior art keywords
length
bonding
ultrasonic horn
bonding tool
wavelength
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KR1019930026752A
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English (en)
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KR970010768B1 (ko
Inventor
료이찌 교마스
미츠아키 사카쿠라
미노루 가와기시
다카시 아키이케
Original Assignee
아라이 가즈오
가부시키가이샤 신가와
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Publication of KR940016443A publication Critical patent/KR940016443A/ko
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Publication of KR970010768B1 publication Critical patent/KR970010768B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78347—Piezoelectric transducers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

본딩중의 부하의 증대에 의해 진동발생원이 불안정하게 되는 것을 방지할 수 있고, 부하조건 및 온도조건의 변동에 의한 본딩품질의 열화를 방지할 수 있다.
혼지지부(23)의 양측 진동파장의 길이를 캐퍼레리(21)측의 반대측에서 3에 대하여 캐퍼레리(21)측을 7 이상, 예컨데 혼지지부(23)로부터 해방단(32)까지의 길이를 1/4파장으로 하고, 혼지지부(23)로부터 해방단(33)까지의 길이를 3/4파장으로 하였다.

Description

본딩장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명이 되는 본딩장치의 초음파혼 부분의 1실시예를 도시하는 주요부단면도, 제 2 도는 제 1 도의 정면도.

Claims (3)

  1. 한쪽끝에 부착된 본딩툴과, 전왜소자 또는 자왜소자 등의 진동발생원을 구비하는 초음파혼을 본드아암에 부착한 본딩장치에 있어서, 상기 초음파혼은 이 초음파혼을 본드아암에 부착하기 위한 혼지지부 양측의 진동파장의 길이를, 본딩툴측의 반대측에서 3에 대하여 본딩툴측을 7 이상으로 한 것을 특징으로 하는 본딩 장치.
  2. 한쪽끝에 부착된 본딩툴과, 전왜소자 또는 자왜소자 등의 진동발생원을 구비하는 초음파혼을 본드아암에 부착한 본딩장치에 있어서, 상기 초음파혼은 이 초음파혼을 본드아암에 부착하기 위한 혼지지부로부터 본딩툴측의 반대측의 해방단까지의 길이를 1/4파장으로 하고, 상기 흔지지부로부터 본딩툴측의 해방단까지의 길이를 3/4파장으로 한 것을 특징으로 하는 본딩장치.
  3. 한쪽끝에 부착된 본딩툴과, 전왜소자 또는 자왜소자 등의 진동발생원을 구비하는 초음파혼을 본드아암에 부착한 본딩장치에 있어서, 상기 초음파혼은 이 초음파혼을 본드아암에 부착하기 위한 혼지지부로부터 본딩툴축의 반대측의 해방단까지의 길이를 1/4파장으로 하고, 상기 혼지지부로부터 본딩툴측의 해방단까지의 길이를 5/4파장으로 한 것으로 하는 본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930026752A 1992-12-24 1993-12-07 본딩장치 KR970010768B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-357386 1992-12-24
JP04357386A JP3128715B2 (ja) 1992-12-24 1992-12-24 ボンデイング装置

Publications (2)

Publication Number Publication Date
KR940016443A true KR940016443A (ko) 1994-07-23
KR970010768B1 KR970010768B1 (ko) 1997-06-30

Family

ID=18453869

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930026752A KR970010768B1 (ko) 1992-12-24 1993-12-07 본딩장치

Country Status (3)

Country Link
US (1) US5385288A (ko)
JP (1) JP3128715B2 (ko)
KR (1) KR970010768B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100368624B1 (ko) * 1999-05-28 2003-01-24 가부시키가이샤 신가와 본딩장치의 초음파 트랜스듀서 및 그 제조방법

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3172901B2 (ja) * 1993-11-30 2001-06-04 株式会社新川 ボンデイング装置
JPH07221141A (ja) * 1994-02-03 1995-08-18 Matsushita Electric Ind Co Ltd 超音波ワイヤボンディング装置
US5603445A (en) * 1994-02-24 1997-02-18 Hill; William H. Ultrasonic wire bonder and transducer improvements
US5595328A (en) * 1994-12-23 1997-01-21 Kulicke And Soffa Investments, Inc. Self isolating ultrasonic transducer
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
JP3215084B2 (ja) * 1998-04-28 2001-10-02 株式会社アルテクス 超音波振動接合用共振器
US5976316A (en) * 1998-05-15 1999-11-02 3M Innovative Properties Company Non-nodal mounting system for acoustic horn
JP3546376B2 (ja) * 2000-08-07 2004-07-28 澁谷工業株式会社 ボンディング装置
JP3742332B2 (ja) 2001-11-12 2006-02-01 株式会社新川 ワイヤボンデイング装置
US7243894B2 (en) 2002-02-15 2007-07-17 3M Innovative Properties Company Mount for vibratory elements
JP3727616B2 (ja) * 2002-07-11 2005-12-14 株式会社新川 ワイヤボンディング装置
US6841921B2 (en) * 2002-11-04 2005-01-11 Kimberly-Clark Worldwide, Inc. Ultrasonic horn assembly stack component connector
US7537148B2 (en) * 2005-10-14 2009-05-26 Asm Technology Singapore Pte Ltd. Bonding apparatus comprising improved oscillation amplification device
JP4314306B1 (ja) * 2008-02-07 2009-08-12 株式会社新川 超音波振動子
US7718022B2 (en) * 2008-05-15 2010-05-18 3M Innovative Properties Company Resonant nodal mount for linear ultrasonic horns
DE102015120824A1 (de) * 2015-12-01 2017-06-01 Hesse Gmbh Betriebsverfahren für einen Ultraschalldrahtbonder

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438880A (en) * 1981-08-17 1984-03-27 Orthodyne Electronics Corporation Ultrasonic wire bond touchdown sensor
US4558596A (en) * 1983-10-24 1985-12-17 Kulicke And Soffa Industries Inc. Apparatus for detecting missing wires
US4591087A (en) * 1984-03-07 1986-05-27 Kulicke And Soffa Industries Inc. Apparatus for making rolling spot bonds
JPS6341037A (ja) * 1986-08-06 1988-02-22 Mitsubishi Electric Corp ワイヤボンデイング装置
JP2736914B2 (ja) * 1989-03-06 1998-04-08 株式会社新川 ワイヤボンデイング方法
JP2665080B2 (ja) * 1991-08-02 1997-10-22 山形日本電気株式会社 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100368624B1 (ko) * 1999-05-28 2003-01-24 가부시키가이샤 신가와 본딩장치의 초음파 트랜스듀서 및 그 제조방법

Also Published As

Publication number Publication date
US5385288A (en) 1995-01-31
KR970010768B1 (ko) 1997-06-30
JP3128715B2 (ja) 2001-01-29
JPH06196533A (ja) 1994-07-15

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