KR940018940A - 본딩장치 - Google Patents
본딩장치 Download PDFInfo
- Publication number
- KR940018940A KR940018940A KR1019930029608A KR930029608A KR940018940A KR 940018940 A KR940018940 A KR 940018940A KR 1019930029608 A KR1019930029608 A KR 1019930029608A KR 930029608 A KR930029608 A KR 930029608A KR 940018940 A KR940018940 A KR 940018940A
- Authority
- KR
- South Korea
- Prior art keywords
- vibration generating
- generating source
- horn
- ultrasonic horn
- ultrasonic
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
본딩 안정성의 향상을 도모한다.
초음파 혼(20)은 이 초음파 혼(20)을 본드아암(30)에 부착하기 위한 혼 지지부 양쪽에 각각 진동발생원(26,27)을 가지며, 진동발생원(26,27)을 가지며, 진동발생원(26,27)을 각각 별도의 출력으로 제어하는 총음파 발진장치(40)를 설치하였다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명이 되는 본딩장치이 초음파 혼부분 및 초음파 발진장치의 1실시예를 도시하는 주요부 단면도, 제2도는 본 발명이 되는 본딩장치의 초음파 혼부분 및 초음파 발진장치의 다른 실시예를 도시하는 주요부 단면도, 제3도는 본 발명이 되는 본딩장치의 초음파 혼부분의 1실시예를 도시하는 주요부 단면도, 제4도는 제3도의 정면도.
Claims (2)
- 한쪽 끝에 부착된 본딩툴과 전왜소자 또는 자왜소자등의 진동발생원을 구비하는 초음파 혼을 본드아암에 부착한 본딩장치에 있어서, 상기 초음파 혼은 이 초음파 혼을 상기 본드아암에 부착하기 위한 혼 지지부 양쪽에 각각 진동발생원을 가지며, 상기 진동발생원을 각각 별도의 출력으로 제어하는 초음파 발진장치를 설치한 것을 특징으로 하는 본딩장치.
- 한쪽 끝에 부착된 본딩툴과 전왜소자 또는 자왜소자등의 진동발생원을 구비하는 초음파 혼을 본드아암에 부착한 본딩장체 있어서, 상기 초음파 혼을 이 초음파 혼은 상기 본드아암에 부착하기 위한 혼 지지부 양쪽에 각각 진동발생원을 가지며, 상기 본딩툴측의 진동발생원의 전류 또는 전압의 변동을 검출하여 상기 양쪽의 진동 발생원을 제어하는 초음파 발진장치를 설치한 것을 특징으로 하는 본딩장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05023324A JP3128716B2 (ja) | 1993-01-18 | 1993-01-18 | ボンデイング装置 |
JP93-023324 | 1993-01-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940018940A true KR940018940A (ko) | 1994-08-19 |
KR970010769B1 KR970010769B1 (ko) | 1997-06-30 |
Family
ID=12107413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930029608A KR970010769B1 (ko) | 1993-01-18 | 1993-12-24 | 본딩장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5411195A (ko) |
JP (1) | JP3128716B2 (ko) |
KR (1) | KR970010769B1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3215084B2 (ja) * | 1998-04-28 | 2001-10-02 | 株式会社アルテクス | 超音波振動接合用共振器 |
DE10190130D2 (de) * | 2000-01-21 | 2002-12-19 | Hesse & Knipps Gmbh | Halteeinrichtung für Ultraschall-Transducer |
US6634539B2 (en) | 2001-09-21 | 2003-10-21 | 3M Innovative Properties Company | Adjustable-gap rotary ultrasonic horn mounting apparatus and method for mounting |
US7243894B2 (en) | 2002-02-15 | 2007-07-17 | 3M Innovative Properties Company | Mount for vibratory elements |
JP3727616B2 (ja) * | 2002-07-11 | 2005-12-14 | 株式会社新川 | ワイヤボンディング装置 |
JP4314306B1 (ja) * | 2008-02-07 | 2009-08-12 | 株式会社新川 | 超音波振動子 |
US20100163601A1 (en) * | 2008-12-31 | 2010-07-01 | General Electric Company | Friction weld vibration quality monitoring system |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3794236A (en) * | 1973-05-07 | 1974-02-26 | Raytheon Co | Monitoring and control means for evaluating the performance of vibratory-type devices |
GB1506164A (en) * | 1974-07-09 | 1978-04-05 | Mullard Ltd | Ultrasonic bonding apparatus |
JP2665080B2 (ja) * | 1991-08-02 | 1997-10-22 | 山形日本電気株式会社 | 半導体製造装置 |
-
1993
- 1993-01-18 JP JP05023324A patent/JP3128716B2/ja not_active Expired - Fee Related
- 1993-12-24 KR KR1019930029608A patent/KR970010769B1/ko not_active IP Right Cessation
-
1994
- 1994-01-18 US US08/182,858 patent/US5411195A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5411195A (en) | 1995-05-02 |
JPH06216203A (ja) | 1994-08-05 |
JP3128716B2 (ja) | 2001-01-29 |
KR970010769B1 (ko) | 1997-06-30 |
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G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060427 Year of fee payment: 12 |
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LAPS | Lapse due to unpaid annual fee |