KR940016641A - 본딩장치 - Google Patents

본딩장치 Download PDF

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Publication number
KR940016641A
KR940016641A KR1019930026350A KR930026350A KR940016641A KR 940016641 A KR940016641 A KR 940016641A KR 1019930026350 A KR1019930026350 A KR 1019930026350A KR 930026350 A KR930026350 A KR 930026350A KR 940016641 A KR940016641 A KR 940016641A
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KR
South Korea
Prior art keywords
ultrasonic horn
bonding
attached
attaching
source
Prior art date
Application number
KR1019930026350A
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English (en)
Other versions
KR970010767B1 (ko
Inventor
노부토 야마자키
요이치 교마스
Original Assignee
아라이 가즈오
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 아라이 가즈오, 가부시키가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR940016641A publication Critical patent/KR940016641A/ko
Application granted granted Critical
Publication of KR970010767B1 publication Critical patent/KR970010767B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)

Abstract

목적 : 본딩의 안정성 향상을 도모한다.
구성 : 초음파혼(20)은 초음파혼(20)을 본드아암(30)에 부착하기 위한 혼지지부(28) 양측에 각각 진동발생원(26,27)을 갖는다.

Description

본딩장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명이 되는 본딩장치의 초음파 혼부분의 제 1 실시예를 나타내는 주요부 단면도, 제 2 도는 제 1 도의 정면도, 제 3 도는 본 발명이 되는 본딩장치의 초음파 혼부분의 제 2 실시예를 나타내는 주요부 단면도, 제 4 도는 제 2 도의 혼지지부 부품의 사시도, 제 5 도는 본 발명이 되는 본딩장치의 초음파 혼부분의 제 3 실시예를 나타내는 주요부 단면도.

Claims (3)

  1. 한쪽끝에 부착된 본딩툴과, 전왜소자 또는 자왜소자 등의 진동발생원을 구비하는 초음파혼을 본드아암에 부착한 본딩장치에 있어서, 상기 초음파혼은 그 초음파혼을 상기 본드아암에 부착하기 위한 혼지지부 양측에 각각 진동발생원을 갖는 것을 특징으로 하는 본딩장치.
  2. 한쪽끝에 부착된 본딩툴과, 전왜소자 또는 자왜소자 등의 진동발생원을 구비하는 초음파혼을 본드아암에 부착한 본딩장치에 있어서, 상기 초음파혼은 그 초음파혼을 상기 본드아암에 부착하기 위한 혼지지부와 본딩툴 사이에만 진동발생원을 갖는 것을 특징으로 하는 본딩장치.
  3. 한쪽끝에 부착된 본딩툴과, 전왜소자 또는 자왜소자 등의 진동발생원을 구비하는 초음파혼을 본드아암에 부착한 본딩장치에 있어서, 상기 초음파혼은 그 초음파혼을 상기 본드아암에 부착하기 위한 혼지지부 양측에 각각 진동발생원 부착축과 그 진동발생원 부착축 단부에 형성된 나사부를 일체로 설치하고, 상기 혼지지부 양측의 진동발생원 부착축에 진동발생원을 부착하고, 상기 진동발생원 부착축 단부의 나사부를 혼본본체에 나사결합한 것을 특징으로 하는 본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930026350A 1992-12-24 1993-12-03 본딩장치 KR970010767B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP04357385A JP3138973B2 (ja) 1992-12-24 1992-12-24 ボンデイング装置
JP92-357385 1992-12-24

Publications (2)

Publication Number Publication Date
KR940016641A true KR940016641A (ko) 1994-07-23
KR970010767B1 KR970010767B1 (ko) 1997-06-30

Family

ID=18453863

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930026350A KR970010767B1 (ko) 1992-12-24 1993-12-03 본딩장치

Country Status (3)

Country Link
US (1) US5486733A (ko)
JP (1) JP3138973B2 (ko)
KR (1) KR970010767B1 (ko)

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AU7299698A (en) * 1996-11-22 1998-06-10 Redwood Rubber Llc Magnetostriction-based ultrasound in rubber devulcanization and related process es
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SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
JP3215084B2 (ja) * 1998-04-28 2001-10-02 株式会社アルテクス 超音波振動接合用共振器
US5976316A (en) * 1998-05-15 1999-11-02 3M Innovative Properties Company Non-nodal mounting system for acoustic horn
JP3802284B2 (ja) 1999-07-05 2006-07-26 株式会社新川 ワイヤボンディング装置
JP4797150B2 (ja) * 2000-03-14 2011-10-19 オリンパス株式会社 走査機構およびこれを用いた機械走査型顕微鏡
DE10040344A1 (de) * 2000-08-17 2002-02-28 Sick Ag Ultraschallwandler
JP2002368036A (ja) * 2001-06-11 2002-12-20 Nec Kyushu Ltd ワイアボンディング装置
TW548759B (en) 2001-06-28 2003-08-21 Shinkawa Kk Transducer and bonding device
US6766936B2 (en) 2001-09-07 2004-07-27 Kabushiki Kaisha Shinkawa Transducer and a bonding apparatus using the same
US6871770B2 (en) * 2001-10-01 2005-03-29 Asm Assembly Automation Limited Ultrasonic transducer
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US6897628B2 (en) * 2003-05-16 2005-05-24 Sulphco, Inc. High-power ultrasound generator and use in chemical reactions
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US7275440B2 (en) * 2004-11-18 2007-10-02 Sulphco, Inc. Loop-shaped ultrasound generator and use in reaction systems
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EP1866104B1 (en) * 2005-03-23 2013-07-24 3L-Ludvigsen A/S Rotary ultrasonic sealer
CN101506331A (zh) * 2006-06-28 2009-08-12 Osat有限责任公司 从页岩和类似物质中释放有机物以生产液体页岩燃料的方法
US7766067B2 (en) 2006-09-28 2010-08-03 3-L Ludvigsen A/S Rotary ultrasonic sealer
JP5583179B2 (ja) * 2012-08-03 2014-09-03 株式会社カイジョー ボンディング装置
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Also Published As

Publication number Publication date
KR970010767B1 (ko) 1997-06-30
JP3138973B2 (ja) 2001-02-26
JPH06196532A (ja) 1994-07-15
US5486733A (en) 1996-01-23

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