ATE211314T1 - Temperaturgeregelte mikrochip-laservorrichtung und dazugehörige trägerbaugruppe - Google Patents

Temperaturgeregelte mikrochip-laservorrichtung und dazugehörige trägerbaugruppe

Info

Publication number
ATE211314T1
ATE211314T1 AT99120915T AT99120915T ATE211314T1 AT E211314 T1 ATE211314 T1 AT E211314T1 AT 99120915 T AT99120915 T AT 99120915T AT 99120915 T AT99120915 T AT 99120915T AT E211314 T1 ATE211314 T1 AT E211314T1
Authority
AT
Austria
Prior art keywords
microchip laser
temperature
laser device
support assembly
temperature controlled
Prior art date
Application number
AT99120915T
Other languages
English (en)
Inventor
Brian L Peterson
Original Assignee
Litton Systems Inc Delaware
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litton Systems Inc Delaware filed Critical Litton Systems Inc Delaware
Application granted granted Critical
Publication of ATE211314T1 publication Critical patent/ATE211314T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/0627—Construction or shape of active medium the resonator being monolithic, e.g. microlaser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/0602—Crystal lasers or glass lasers
    • H01S3/0604—Crystal lasers or glass lasers in the form of a plate or disc
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H01S3/09415—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode the pumping beam being parallel to the lasing mode of the pumped medium, e.g. end-pumping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Lasers (AREA)
AT99120915T 1998-10-30 1999-10-29 Temperaturgeregelte mikrochip-laservorrichtung und dazugehörige trägerbaugruppe ATE211314T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/183,227 US6055815A (en) 1998-10-30 1998-10-30 Temperature-controlled microchip laser assembly and associated submount assembly

Publications (1)

Publication Number Publication Date
ATE211314T1 true ATE211314T1 (de) 2002-01-15

Family

ID=22671983

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99120915T ATE211314T1 (de) 1998-10-30 1999-10-29 Temperaturgeregelte mikrochip-laservorrichtung und dazugehörige trägerbaugruppe

Country Status (8)

Country Link
US (1) US6055815A (de)
EP (1) EP0997991B1 (de)
JP (1) JP2000156538A (de)
AT (1) ATE211314T1 (de)
AU (1) AU758016B2 (de)
CA (1) CA2287945A1 (de)
DE (1) DE69900629T2 (de)
IL (1) IL132626A (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6167721B1 (en) * 1998-07-14 2001-01-02 Borst, Inc. Electrochemical hydrogen pump and uses thereof for heat exchange applications
JP3228267B2 (ja) * 1999-04-27 2001-11-12 日本電気株式会社 電子デバイス
US6205790B1 (en) * 1999-05-28 2001-03-27 Lucent Technologies Inc. Efficient thermoelectric controller
US6425440B1 (en) 1999-07-06 2002-07-30 Borst, Inc. Reciprocal heat exchanger
US6233959B1 (en) * 1999-10-12 2001-05-22 International Business Machines Corporation Dehumidified cooling assembly for IC chip modules
US6233960B1 (en) * 1999-10-12 2001-05-22 International Business Machines Corporation Spot cooling evaporator cooling system for integrated circuit chip modules
DE10034262C1 (de) 2000-07-14 2001-09-20 Infineon Technologies Ag Halbleitervorrichtung mit Temperaturregelung, insb. geeignet für den Kfz-Bereich
JP2002101274A (ja) * 2000-09-26 2002-04-05 Fuji Photo Film Co Ltd 光源装置、画像読取装置及び画像読取方法
US6360544B1 (en) * 2000-12-19 2002-03-26 Intel Corporation Anticyclone powered active thermal control unit
KR100387035B1 (ko) 2001-01-30 2003-06-12 삼성전자주식회사 일체형 열전달모듈을 이용한 광소자 모듈
US6549550B2 (en) 2001-02-14 2003-04-15 Triquint Technology Holding Co. Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom
DE10113943B4 (de) * 2001-03-21 2009-01-22 Jenoptik Laserdiode Gmbh Diodenlaserbauelement
EP1262734A1 (de) * 2001-06-01 2002-12-04 Dalhoff, Ernst Dr. Vorrichtung zur berührungslosen Vermessung eines Messojektes, insbesondere zur Distanz- und/oder Schwingungsmessung
US20030012524A1 (en) * 2001-06-26 2003-01-16 The Furukawa Electric Co., Ltd. Optical module
US6581388B2 (en) * 2001-11-27 2003-06-24 Sun Microsystems, Inc. Active temperature gradient reducer
US6949873B2 (en) * 2002-03-08 2005-09-27 Chien-Min Sung Amorphous diamond materials and associated methods for the use and manufacture thereof
US7358658B2 (en) * 2002-03-08 2008-04-15 Chien-Min Sung Amorphous diamond materials and associated methods for the use and manufacture thereof
US6806629B2 (en) 2002-03-08 2004-10-19 Chien-Min Sung Amorphous diamond materials and associated methods for the use and manufacture thereof
US7235912B2 (en) * 2002-03-08 2007-06-26 Chien-Min Sung Diamond-like carbon thermoelectric conversion devices and methods for the use and manufacture thereof
US20070126312A1 (en) * 2002-03-08 2007-06-07 Chien-Min Sung DLC field emission with nano-diamond impregnated metals
US7085125B2 (en) * 2002-03-21 2006-08-01 Chien-Min Sung Carbon nanotube devices and uses therefor
US6621841B1 (en) * 2002-04-23 2003-09-16 The United States Of America As Represented By The Secretary Of The Air Force Phonon-pumped semiconductor lasers
US20040108857A1 (en) * 2002-07-23 2004-06-10 Paul Jarski Ionization detectors
US7308008B2 (en) * 2002-11-08 2007-12-11 Finisar Corporation Magnetically controlled heat sink
US6981380B2 (en) * 2002-12-20 2006-01-03 Intel Corporation Thermoelectric cooling for microelectronic packages and dice
US7228020B2 (en) * 2004-08-31 2007-06-05 Finisar Corporation Optoelectronic arrangement having a surface-mountable semiconductor module and a cooling element
EP1643603A1 (de) * 2004-09-29 2006-04-05 Wavelight Laser Technologie AG Lasersystem mit Festkörperlaserköpfen
US7290395B2 (en) * 2005-10-06 2007-11-06 Gentcorp Ltd High power thermoelectric controller
US8267983B2 (en) * 2007-01-11 2012-09-18 Scion Neurostim, Llc. Medical devices incorporating thermoelectric transducer and controller
US20080168775A1 (en) * 2007-01-11 2008-07-17 Nextreme Thermal Solutions, Inc. Temperature Control Including Integrated Thermoelectric Temperature Sensing and Related Methods and Systems
US8696724B2 (en) 2007-01-11 2014-04-15 Scion Neurostim, Llc. Devices for vestibular or cranial nerve stimulation
US8267984B2 (en) * 2007-08-03 2012-09-18 Scion Neurostim, Llc. Neurophysiological activation by vestibular or cranial nerve stimulation
US20080264464A1 (en) * 2007-01-11 2008-10-30 Nextreme Thermal Solutions, Inc. Temperature Control Including Integrated Thermoelectric Sensing and Heat Pumping Devices and Related Methods and Systems
WO2008147575A2 (en) * 2007-01-11 2008-12-04 Rensselaer Polytechnic Institute Systems, methods, and devices for handling terahertz radiation
KR100953441B1 (ko) 2009-06-25 2010-04-20 충북대학교 산학협력단 온도 제어 장치 및 그 구동 방법
US8460356B2 (en) 2009-12-18 2013-06-11 Scion Neurostim, Llc Devices and methods for vestibular and/or cranial nerve stimulation
WO2012083106A1 (en) 2010-12-16 2012-06-21 Scion Neurostim, Llc Combination treatments
JP5388913B2 (ja) * 2010-03-15 2014-01-15 三菱電機株式会社 画像表示装置
US9744074B2 (en) 2010-12-16 2017-08-29 Scion Neurostim, Llc Combination treatments
US10512564B2 (en) 2010-12-16 2019-12-24 Scion Neurostim, Llc Combination treatments
US10537467B2 (en) 2010-12-16 2020-01-21 Scion Neurostim, Llc Systems, devices and methods for bilateral caloric vestibular stimulation
US9001862B2 (en) 2012-03-09 2015-04-07 Raytheon Company Miniaturized solid-state lasing device, system and method
US10072881B2 (en) 2014-11-26 2018-09-11 Hoffman Enclosures, Inc. Reduced footprint thermoelectric cooler controller
US10502463B2 (en) 2014-11-26 2019-12-10 Hoffman Enclosures, Inc. Thermoelectric cooler controller and angled mounting thereof
US9755399B2 (en) * 2015-05-05 2017-09-05 Boreal Laser Inc. Packaged laser thermal control system
WO2017059443A1 (en) * 2015-10-01 2017-04-06 Hoffman Enclosures, Inc. Reduced footprint thermoelectric cooler controller
AU2017339894B2 (en) * 2016-10-04 2022-12-15 Boston Scientific Scimed, Inc. Tailored laser pulses for surgical applications
CN111721033A (zh) * 2020-06-03 2020-09-29 中筑科技股份有限公司 一种分布式热泵管控系统
IL291729B2 (en) * 2022-03-27 2023-11-01 Elbit Systems Electro Optics Elop Ltd Systems, subsystems and methods based on laser diodes, with temperature control

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061076A (en) * 1989-01-31 1991-10-29 Enzo Diagnostics, Inc. Time-resolved fluorometer
US5187714A (en) * 1990-10-19 1993-02-16 Fuji Photo Film Co., Ltd. Laser-diode-pumped solid-state laser
US5136261A (en) * 1990-12-11 1992-08-04 Ball Corporation Saturated absorption double resonance system and apparatus
DE4041130A1 (de) * 1990-12-21 1992-07-02 Messerschmitt Boelkow Blohm Festkoerper-lasersystem
US5140607A (en) * 1991-05-23 1992-08-18 Laser Diode, Inc. Side-pumped laser with angled diode pumps
US5329539A (en) * 1991-10-28 1994-07-12 Lightwave Electronics Efficient laser configuration
US5228923A (en) * 1991-12-13 1993-07-20 Implemed, Inc. Cylindrical thermoelectric cells
JPH07288351A (ja) * 1994-04-19 1995-10-31 Fujitsu Ltd ペルチェ制御回路及びその素子構造
US5454002A (en) * 1994-04-28 1995-09-26 The Board Of Regents Of The University Of Oklahoma High temperature semiconductor diode laser
US5796766A (en) * 1994-08-23 1998-08-18 Laser Power Corporation Optically transparent heat sink for longitudinally cooling an element in a laser
US5918469A (en) * 1996-01-11 1999-07-06 Silicon Thermal, Inc. Cooling system and method of cooling electronic devices
GB9606323D0 (en) * 1996-03-26 1996-05-29 Spectron Laser Systems Ltd Improvements in or relating to microchip lasers
DE19646072A1 (de) * 1996-11-08 1998-05-14 Daimler Benz Ag Diodengepumpter, frequenzverdoppelter Festkörperlaser

Also Published As

Publication number Publication date
EP0997991B1 (de) 2001-12-19
IL132626A (en) 2002-11-10
US6055815A (en) 2000-05-02
EP0997991A3 (de) 2000-11-22
EP0997991A2 (de) 2000-05-03
DE69900629D1 (de) 2002-01-31
AU758016B2 (en) 2003-03-13
CA2287945A1 (en) 2000-04-30
JP2000156538A (ja) 2000-06-06
DE69900629T2 (de) 2002-06-13
IL132626A0 (en) 2001-03-19
AU5714099A (en) 2000-05-04

Similar Documents

Publication Publication Date Title
ATE211314T1 (de) Temperaturgeregelte mikrochip-laservorrichtung und dazugehörige trägerbaugruppe
EP0920095A3 (de) Vorrichtung zur Stabilitätskontrolle der optischen Wellenlänge und optischer Sender
WO2003006964A8 (en) Submersible light-directing member for material excitation in microfluidic devices
DE60234298D1 (de) Kompaktes Laser Gehäuse mit integrierter Temperaturkontrolle
ATE343979T1 (de) Ultraschall-bearbeitungsinstrument
EP0814545A3 (de) Laserstrahlemittierendes Gerät
DE60201974D1 (de) Verbesserungen im bezug auf halbleiterlaser
CA2245313A1 (en) Double analog/digital automatic power controlling device in optical fiber amplifier
DE69119738D1 (de) Stimmgabelgesteuerter Kreisel
US20040179778A1 (en) Optical transmitting module and a method for controlling the same
DK563387D0 (da) Styreindretning til styring af energiforsyningen til en oscillerende motor til drift af en kompressorenhed af resonansstempeltypen, og en kompressorenhed af resonansstempeltypen med en saadan styreenhed
KR940016443A (ko) 본딩장치
ATE542114T1 (de) Lasersystem
DE50108510D1 (de) Laserbebilderung mit variabler Druckpunktgrösse
JP2008135491A (ja) 固体レーザ装置
JP2019168903A (ja) 温度制御回路
JP2008135492A (ja) 固体レーザ装置
EP0136872A3 (de) Stabilisierte optische Quelle
JP2006114774A (ja) 波長安定化半導体レーザ装置
KR960001826A (ko) 백라이트 밝기 자동 조절 장치
JPS6474780A (en) Stabilization of semiconductor laser light
JP2007149904A (ja) 波長変換レーザ温度制御回路
JP2737185B2 (ja) 温度制御回路
JPH0198282A (ja) 半導体レーザ装置
JPH0391277A (ja) レーザーダイオード駆動回路

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee