KR950012637A - 플라스틱제 기판 표면상의 박막 침착 방법 - Google Patents
플라스틱제 기판 표면상의 박막 침착 방법 Download PDFInfo
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- KR950012637A KR950012637A KR1019940027993A KR19940027993A KR950012637A KR 950012637 A KR950012637 A KR 950012637A KR 1019940027993 A KR1019940027993 A KR 1019940027993A KR 19940027993 A KR19940027993 A KR 19940027993A KR 950012637 A KR950012637 A KR 950012637A
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- 239000000758 substrate Substances 0.000 title claims abstract 16
- 239000004033 plastic Substances 0.000 title claims abstract 8
- 238000007736 thin film deposition technique Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 230000008021 deposition Effects 0.000 claims abstract description 7
- 239000007789 gas Substances 0.000 claims abstract 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract 8
- 239000000203 mixture Substances 0.000 claims abstract 8
- 239000001301 oxygen Substances 0.000 claims abstract 8
- 229910052760 oxygen Inorganic materials 0.000 claims abstract 8
- 150000003961 organosilicon compounds Chemical class 0.000 claims abstract 7
- 238000006116 polymerization reaction Methods 0.000 claims abstract 3
- 230000001681 protective effect Effects 0.000 claims abstract 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims 4
- -1 alkoxysilane Chemical class 0.000 claims 4
- 229920000642 polymer Polymers 0.000 claims 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims 2
- 239000003570 air Substances 0.000 claims 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims 2
- 239000001569 carbon dioxide Substances 0.000 claims 2
- 229910002091 carbon monoxide Inorganic materials 0.000 claims 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims 2
- AQXQIUZAGYLHQA-UHFFFAOYSA-N hexane silane Chemical compound [SiH4].CCCCCC AQXQIUZAGYLHQA-UHFFFAOYSA-N 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 229910001868 water Inorganic materials 0.000 claims 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 1
- 235000014653 Carica parviflora Nutrition 0.000 claims 1
- 241000243321 Cnidaria Species 0.000 claims 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical compound ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 239000004793 Polystyrene Substances 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- 230000003213 activating effect Effects 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 150000001993 dienes Chemical class 0.000 claims 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims 1
- 239000001272 nitrous oxide Substances 0.000 claims 1
- KNCYXPMJDCCGSJ-UHFFFAOYSA-N piperidine-2,6-dione Chemical group O=C1CCCC(=O)N1 KNCYXPMJDCCGSJ-UHFFFAOYSA-N 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
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- C08J7/18—Chemical modification with polymerisable compounds using wave energy or particle radiation
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- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
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Abstract
본 발명은 플라스틱제 기판의 표면상에 층 또는 보호막을 플라스마 중합에 의해 침착하는 방법.에 관한 것이다. 본 발명은 적어도 하기 단계들 약하게 편극화되거나 편극화되지 않은 기판-캐리어상에 플라스틱제 기판을 배치시키고, 이것을 산소를 도입할 수 있는 1종 이상의 예비처리 가스로 처리하고, 최소량의 에너지 를 기체상 예비처리 매질에 공급하여 기판 표면을 활성화시킬 수 있는 양의 산소를 플라스마에 발생시키고, 이 에너지를 전력 밀도로 펄스의 형태로 공급하는 것으로 구성된 예비처리 단계, 및 -산소의 도입을 가능케하는 1종 이상의 가스 및 유기규소 화합물을 함유하는 기체상 침착 혼합물로 구성된 플라스마에 의하여 상기 기판 표면상에 층 또는 막을 침착하는 단계를 포함한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 PMMA상에서 침착된 플라스마 층에 대해 수행된 타버 시험의 결과를 나타내는 그래프이며, 이중의 하나는 본 발명에 따른 방법.에 의해 02 플라스마로 예비처리된 PMMA 상에서 침탁되고, 다른 하나는 예비 터 리되 지 않은 PMMA상에서 침 착된다(실시예 2)
Claims (17)
1차 진공하의 반응기내에서 기체상 매질중의 방전에 의해 수득되는 플라스마로 기판을 처리하여 플라 스마 중합에 의해 플라스틱제 기판 포면상에 층 또는 보호막을 침착시키는 방법.에 있어서, 적어도 하기 단 계들 a) 약하게 편극화되거나 편극화되지 않은 기판-캐리어상에 플라스틱제 기판을 배치시키고, 이것을 상기 기판 표면을 황성화할 수 있는 형태의 산소를 도입할 수 있는 1종 이상의 예비처리 가스로 구성된 플 라스마로 처리하고. 이 플라스마에 의해 최소량의 에너지를 기체상 예비처리 매질에 공급하여 기판 표면을 활성화시킬 수 있는 양의 산소를 발생시키고, 이 에너지를 전력 밀도의 펄스의 형태로 공급하근 것으로 구 성된 플라스틱제 기판의 예비처리단계, 및 b) 산소의 도입을 가능케하는 1종 이상의 가스 및 1종 이상의유기극소 화합물을 함유하는 기체상 침착 혼합물로 구성된 플라스마에 의하여 상기 기판 표면상에 상기 층 또는 상기 막을 침착하는 단계를 포함함을 특징으로 하는 플라스틱제 기판의 표먼상에 층 또는 보호막을 플 라스마 중합에 의해 침착하는 방법.
제1항에 있어서, 기판-캐리어가 양극임을 특징으로 하는 방법.
제1항 또는 2항에 있민서, 전력 밀도가 50mW/㎤ 이상, 특헥 80mW/㎤ 내지 500mW/㎤, 더욱 특별하게는 165mW/㎤ 정도임을 특징으로 하는 방법.
제1항 또는 2항에 있어서, 전력 밀도 펄스가 약 1초 내지 약 100초, 특별 3초 내지 50초 정도. 더욱 특별하게는 30초 정도로 지속됨을 특징으로 하는 방법.
제1항 또는 2항에 있어서, 예비처리 가스가 특별 산소, 산호아질산. 일산화탄소 또는 이산화탄소, 물, 공기, 희귀 가스류, 질소, 수소 또는 이들의 혼합물로 구성된 군에서 선택됨을 특징으로 하는 방법.
제1항 또는 2항에 있어서, 예비처리 가스가 특헥 실란, 알콕시실란, 실록산 및 실라잔으로 구성된 군에서 선택된 1종 이상의 유기규소 화합물을 단독으로 또는 서로 혼합하여 추가로 함유함을 특징으로 하는방법.
제6항에 있어서, 예비처리 가스가 헥사메틸디실록산을 함유함을 특징으로 하는 방법.
제1항 또는 2항에 있어서, 기체상 침착 혼합물이 1종 이상의 유기규소 화합물 및 특헥 산소, 산화아 질산, 일산화탄소 또는 이산화탄소, 물, 공기, 희귀 가스, 질소 및 수소로 구성된 군에서 선택되는 1종 이상의 가스를 함유함을 특징으로 하는 방법.
제8항에 있어서, 유기규소 화합물이 특헥 실란, 알콕시실란, 실록산 및 실라잔으로 구성된 군에서 선택되는 화합물의 단독 또는 혼합물임을 특징으로 하는 방법.
제9항에 있어서, 유기규소 화합물이 헥사메틸디실록산임을 특징으로 하는 방법.
제1항 또는 2항에 있어서, 예비처리 가스가 기체상 침착 흔합물과 동일하거나 상이함을 특징으로 하는 방법.
제6항에 있어서, 예비처리 가스의 유기규소 화합물(들)이 기체상 침착 혼합물과 동일하거나 상이함 을 특징으로 하는 방법.
제1항 또는 2항에 있민서, 발전기 주파수가 0Hz 내지 수 GHz의 범위임을 특징으로 하는 방법.
제1항 또는 2항에 있어서, 플라스틱 기판이 특헥 폴리올레핀, 폴리아크릴, 폴리카르보네이트 및 비닐방향족 중합체로 구성된 군에서 선택되는 충진 또는 비충진 중합체로 구성됨을 특징으로 하는 방법.
제14항에 있어서, 기판이 폴리프로필렌, 폴리스티렌 및 메틸 메타트릴레이트 중합체로 구성된 군에서 선택됨을 특징으로 하는 방법.
제14항에 있어서. 플라스틱 기판이 메틸 메타크릴레이트 및 (메트)아크릴산, 헥드록시알킬(메트) 아크릴레이트, 알킬기가 탄소수 1 내지 8인 알콜시알킬(메트)아크릴레이트, (메트)아크릴로니트릴, (메트)아크릴아미드, 말레이미드, 말레산 무수물, 치환 또는 비치환 스티렌 및 디엔으로 구성된 군에서 선택되는 공단량체로 이루어진 공합체임을 특징으로 하는 방법.
제14항에 있어서, 기판이 글루타르이미드기를 함유하는 중합체임을 특징으로 하는 방법.
※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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FR9312946 | 1993-10-29 | ||
FR9312946A FR2711556B1 (fr) | 1993-10-29 | 1993-10-29 | Procédé de dépôt d'une couche mince sur la surface d'un substrat en matière plastique. |
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US (1) | US5569497A (ko) |
EP (1) | EP0650772B1 (ko) |
JP (1) | JP3038123B2 (ko) |
KR (1) | KR100305952B1 (ko) |
CN (1) | CN1090539C (ko) |
AT (1) | ATE209068T1 (ko) |
CA (1) | CA2134290C (ko) |
DE (1) | DE69429150T2 (ko) |
ES (1) | ES2167350T3 (ko) |
FR (1) | FR2711556B1 (ko) |
TW (1) | TW277006B (ko) |
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EP0752483A1 (de) * | 1995-06-28 | 1997-01-08 | ANTEC Angewandte Neue Technologien GmbH | Verfahren zur Beschichtung von Gegenständen aus Metall oder Kunststoff |
US5885751A (en) * | 1996-11-08 | 1999-03-23 | Applied Materials, Inc. | Method and apparatus for depositing deep UV photoresist films |
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DE19703538A1 (de) * | 1997-01-31 | 1998-08-06 | Fraunhofer Ges Forschung | Verfahren zur Modifizierung von Polymethylmethacrylat-Substratoberflächen |
US6515355B1 (en) * | 1998-09-02 | 2003-02-04 | Micron Technology, Inc. | Passivation layer for packaged integrated circuits |
KR20010088089A (ko) * | 2000-03-10 | 2001-09-26 | 구자홍 | 플라즈마 중합처리 시스템의 친수성 향상 방법 |
US20030185973A1 (en) * | 2002-03-30 | 2003-10-02 | Crawley Richard L. | Water vapor plasma method of increasing the surface energy of a surface |
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US8354138B2 (en) * | 2009-12-14 | 2013-01-15 | Chung-Shan Institute Of Science And Technology, Armaments Bureau, Ministry Of National Defense | Preparing method for coating PMMA particles with silicon dioxide |
CN101892452B (zh) * | 2010-08-06 | 2012-12-26 | 凌嘉科技股份有限公司 | 在塑料工件上形成电磁干扰防护层的方法 |
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- 1994-09-27 TW TW083108956A patent/TW277006B/zh active
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Cited By (1)
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KR100713877B1 (ko) * | 1998-12-18 | 2007-07-18 | 비오이 하이디스 테크놀로지 주식회사 | 박막 트랜지스터 액정표시장치 |
Also Published As
Publication number | Publication date |
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JPH0820658A (ja) | 1996-01-23 |
DE69429150D1 (de) | 2002-01-03 |
KR100305952B1 (ko) | 2001-12-01 |
CA2134290A1 (fr) | 1995-04-30 |
TW277006B (ko) | 1996-06-01 |
DE69429150T2 (de) | 2002-07-18 |
FR2711556A1 (fr) | 1995-05-05 |
EP0650772A1 (fr) | 1995-05-03 |
US5569497A (en) | 1996-10-29 |
ES2167350T3 (es) | 2002-05-16 |
JP3038123B2 (ja) | 2000-05-08 |
EP0650772B1 (fr) | 2001-11-21 |
CA2134290C (fr) | 2002-01-01 |
CN1090539C (zh) | 2002-09-11 |
FR2711556B1 (fr) | 1995-12-15 |
ATE209068T1 (de) | 2001-12-15 |
CN1110632A (zh) | 1995-10-25 |
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