KR950000805A - 폴리이미드실옥산 용액 및 기판의 피복방법 - Google Patents

폴리이미드실옥산 용액 및 기판의 피복방법 Download PDF

Info

Publication number
KR950000805A
KR950000805A KR1019940013875A KR19940013875A KR950000805A KR 950000805 A KR950000805 A KR 950000805A KR 1019940013875 A KR1019940013875 A KR 1019940013875A KR 19940013875 A KR19940013875 A KR 19940013875A KR 950000805 A KR950000805 A KR 950000805A
Authority
KR
South Korea
Prior art keywords
solution
weight
siloxane
solvent
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019940013875A
Other languages
English (en)
Korean (ko)
Inventor
로스트아크세르 세르기오
와이. 탕 데이비드
에이. 타이렐 존
Original Assignee
리챠드 디.퓨어를
옥시덴탈 케미칼 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리챠드 디.퓨어를, 옥시덴탈 케미칼 코포레이션 filed Critical 리챠드 디.퓨어를
Publication of KR950000805A publication Critical patent/KR950000805A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
    • C08J3/096—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/10—Block- or graft-copolymers containing polysiloxane sequences
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
KR1019940013875A 1993-06-21 1994-06-20 폴리이미드실옥산 용액 및 기판의 피복방법 Withdrawn KR950000805A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/078,339 US5317049A (en) 1993-06-21 1993-06-21 Polyimidesiloxane solution and method of coating substrates
US08/078,339 1993-06-21

Publications (1)

Publication Number Publication Date
KR950000805A true KR950000805A (ko) 1995-01-03

Family

ID=22143410

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940013875A Withdrawn KR950000805A (ko) 1993-06-21 1994-06-20 폴리이미드실옥산 용액 및 기판의 피복방법

Country Status (6)

Country Link
US (1) US5317049A (enExample)
EP (1) EP0630934A3 (enExample)
JP (1) JP3491968B2 (enExample)
KR (1) KR950000805A (enExample)
CA (1) CA2120272A1 (enExample)
TW (1) TW288039B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554684A (en) * 1993-10-12 1996-09-10 Occidental Chemical Corporation Forming polyimide coating by screen printing
US5849607A (en) * 1993-11-27 1998-12-15 Samsung Electronics Co., Ltd. Process for attaching a lead frame to a semiconductor chip
US6451955B1 (en) * 2000-09-28 2002-09-17 Sumitomo Bakelite Company Limited Method of making a polyimide in a low-boiling solvent
JP4602151B2 (ja) * 2004-04-22 2010-12-22 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜
US8491997B2 (en) * 2006-06-22 2013-07-23 Sabic Innovative Plastics Ip B.V. Conductive wire comprising a polysiloxane/polyimide copolymer blend
US8168726B2 (en) * 2006-06-22 2012-05-01 Sabic Innovative Plastics Ip B.V. Process for making polysiloxane/polymide copolymer blends
KR102091994B1 (ko) 2012-12-21 2020-03-23 다우 실리콘즈 코포레이션 층상 중합체 구조물 및 방법
TWI522421B (zh) * 2014-03-18 2016-02-21 Daxin Materials Corp Liquid crystal alignment composition

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168943A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Coating liquid for thin film formation
JPS59202259A (ja) * 1983-04-30 1984-11-16 Hitachi Chem Co Ltd 芳香族ポリエ−テルアミドイミド重合体ワニス
US4624978A (en) * 1983-11-14 1986-11-25 Rogers Corporation High temperature polyimide processing aid
JPS60118741A (ja) * 1983-11-14 1985-06-26 ロジヤース・コーポレイシヨン 高温ポリイミド加工助剤
GB2157303A (en) * 1984-03-05 1985-10-23 Rogers Corp Co-solvent accelerator and method for conversion of polyamide-acid, solution to polylmide
US4639485A (en) * 1985-07-31 1987-01-27 Rogers Corporation Co-solvent accelerator for conversion of polyamide-acid solution to polyimide
CA1299801C (en) * 1987-03-31 1992-04-28 Chung J. Lee Soluble polyimidesiloxanes and methods for their preparation and use
EP0363737A3 (en) * 1988-10-11 1990-09-26 Ethyl Corporation Compositions for production of electronic coatings
US4956451A (en) * 1988-10-11 1990-09-11 Ethyl Corporation Compositions for production of electronic coatings
US5068131A (en) * 1988-10-11 1991-11-26 Ethyl Corporation Method for production of electronic coatings
US4996254A (en) * 1988-10-11 1991-02-26 Ethyl Corporation Production of electronic coatings by spin coating a partially fluorinated polyamic acid composition
US5206337A (en) * 1990-05-10 1993-04-27 Sumitomo Bakelite Company Limited Solvent-soluble polyimidesiloxane oligomer and process for producing the same
JP2526845B2 (ja) * 1991-10-25 1996-08-21 日産化学工業株式会社 ポリイミドワニス組成物及びその使用法

Also Published As

Publication number Publication date
CA2120272A1 (en) 1994-12-22
EP0630934A3 (en) 1995-09-27
TW288039B (enExample) 1996-10-11
JP3491968B2 (ja) 2004-02-03
JPH0718181A (ja) 1995-01-20
US5317049A (en) 1994-05-31
EP0630934A2 (en) 1994-12-28

Similar Documents

Publication Publication Date Title
KR980700686A (ko) 스크린 프린팅에 의한 폴리이미드 코팅막의 형성방법 (Forming polyimide coatings by screen printing)
JP7131651B2 (ja) タッチパネルセンサーの製造方法
US5209981A (en) Polyimidesiloxane extended block copolymers
KR900701877A (ko) 디아미드산 첨가제를 사용하여 폴리아미드의 유전율을 저하시키는 방법
KR960701166A (ko) 3층 폴리이미드실록산 접착 테이프(Three-layer polyimidesiloxane adhesive tape)
US6451955B1 (en) Method of making a polyimide in a low-boiling solvent
KR950000805A (ko) 폴리이미드실옥산 용액 및 기판의 피복방법
JPS63221126A (ja) 吸水特性に優れたポリイミド樹脂
KR910002949A (ko) 고분자량 폴리이미드 축합 생성 조성물 및 이들로 구성된 중합체 필름
KR950032556A (ko) 폴리이미드실록산 접착제
KR900003303A (ko) 열경화성 수지조성물
JPH0219862B2 (enExample)
JP3168827B2 (ja) ポリイミド共重合体及びその製造方法
TW202239889A (zh) 聚醯亞胺前體清漆及其製造方法、聚醯亞胺及其製造方法、可撓性器件及配線基板用層疊體
KR102803347B1 (ko) 폴리아믹산 조성물
KR102826246B1 (ko) 폴리아믹산 조성물
JPH107985A (ja) ワニス
US5254361A (en) Method for producing printed circuit boards
US5294696A (en) Process for producing polyisoimide
TWI864718B (zh) 聚醯亞胺前體
JP2597214B2 (ja) 塗膜形成用のポリイミドシロキサン組成物および膜
JPH01165623A (ja) 光透過性が高いポリイミドおよびその前駆体
CN120380055A (zh) 聚酰胺酸组合物
KR20230148076A (ko) 폴리이미드 전구체
JP2025511793A (ja) ポリイミド前駆体

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000