KR940016547A - 종형 열처리장치 - Google Patents

종형 열처리장치 Download PDF

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Publication number
KR940016547A
KR940016547A KR1019930028968A KR930028968A KR940016547A KR 940016547 A KR940016547 A KR 940016547A KR 1019930028968 A KR1019930028968 A KR 1019930028968A KR 930028968 A KR930028968 A KR 930028968A KR 940016547 A KR940016547 A KR 940016547A
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KR
South Korea
Prior art keywords
heat treatment
treatment apparatus
vertical heat
exchange medium
heat exchange
Prior art date
Application number
KR1019930028968A
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English (en)
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KR100250010B1 (ko
Inventor
가쓰신 미야기
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시끼가이샤
이노우에 다케시
도오교오 에레구토론 도오호쿠 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시끼가이샤, 이노우에 다케시, 도오교오 에레구토론 도오호쿠 가부시끼가이샤 filed Critical 이노우에 아키라
Publication of KR940016547A publication Critical patent/KR940016547A/ko
Application granted granted Critical
Publication of KR100250010B1 publication Critical patent/KR100250010B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/907—Passageway in rod or shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/91—O-ring seal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/93—Seal including heating or cooling feature

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

피처리체를 수용하는 처리용기의 마개체에, 자석 유체시일을 구비한 회전도입기를 설치하고, 이 회전도입기의 회전축내에 냉각매체를 순환시킬수가 있도록, 구성됨과 동시에 피처리체가 수용된 열처리용 보트(웨이퍼 보트)를 유지하는 보온통을 이 회전축에서 지지한다.
이것에 의하여, 반도체 웨이퍼를 가열한 열이 열처리용 보트를 통하여 회전기구를 쬐여 회전축이 고온으로 되는 것을 방지한다.

Description

종형 열처리장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 종형 열처리장치의 종단면도.

Claims (8)

  1. 피처리체를 수용하는 처리용기를 밀봉하는 승강이 자유로운 마개체와, 그 마개체에 설치된 회전축과, 그 자석유체 시일부재로 되는 회전도입기와, 그 회전도입기의 상기 회전축내에 열 교환매체를 순환시키는 수단과, 상기 회전축에 의하여 지지된 열처리용 보트로 이루어지는 종형 열처리장치.
  2. 제 1 항에 있어서, 상기 마개체에 상기 회전축의 관통구멍을 설치하고, 그 관통구멍에 불활성 가스를 공급하는 수단을 설치한 종형 열처리장치.
  3. 제 1 항에 있어서, 상기 열교환 매체가 냉각 매체인 종형 열처리장치.
  4. 제 1 항에 있어서, 상기 열교환 매체가 가열 매체인 종형 열처리장치.
  5. 제 1 항에 있어서, 상기 열교환 매체가 물인 종형 열처리장치.
  6. 제 1 항에 있어서, 상기 열교환 매체가 에틸렌글리콜인 종형 열처리장치.
  7. 제 1 항에 있어서, 상기 회전도입기에 온도 센서를 설치하고, 소정온도 이상의 온도가 감지된 때에 상기 열교환 매체를 순환시키는 수단으로부터 공급유량을 증가시키도록 한 종형 열처리장치.
  8. 제 2 항에 있어서, 상기 마개체의 상면에 관통구멍에 대향하여, 소정의 극간을 유지하여 버플판을 설치한 종형 열처리장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930028968A 1992-12-25 1993-12-22 종형 열처리장치 KR100250010B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-358987 1992-12-25
JP4358987A JPH06204157A (ja) 1992-12-25 1992-12-25 縦型熱処理装置

Publications (2)

Publication Number Publication Date
KR940016547A true KR940016547A (ko) 1994-07-23
KR100250010B1 KR100250010B1 (ko) 2000-03-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930028968A KR100250010B1 (ko) 1992-12-25 1993-12-22 종형 열처리장치

Country Status (3)

Country Link
US (1) US5421892A (ko)
JP (1) JPH06204157A (ko)
KR (1) KR100250010B1 (ko)

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Also Published As

Publication number Publication date
KR100250010B1 (ko) 2000-03-15
JPH06204157A (ja) 1994-07-22
US5421892A (en) 1995-06-06

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