KR940008018A - 실리콘에서의 오염물 제거와 소수 캐리어 수명 개선 - Google Patents
실리콘에서의 오염물 제거와 소수 캐리어 수명 개선 Download PDFInfo
- Publication number
- KR940008018A KR940008018A KR1019930019495A KR930019495A KR940008018A KR 940008018 A KR940008018 A KR 940008018A KR 1019930019495 A KR1019930019495 A KR 1019930019495A KR 930019495 A KR930019495 A KR 930019495A KR 940008018 A KR940008018 A KR 940008018A
- Authority
- KR
- South Korea
- Prior art keywords
- silicon
- minority carrier
- wafer
- silicon body
- carrier recombination
- Prior art date
Links
- 229910052710 silicon Inorganic materials 0.000 title claims description 12
- 239000010703 silicon Substances 0.000 title claims description 12
- 239000000356 contaminant Substances 0.000 title description 2
- 238000005215 recombination Methods 0.000 claims abstract description 7
- 230000006798 recombination Effects 0.000 claims abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract 7
- 238000000034 method Methods 0.000 claims abstract 5
- 229910052742 iron Inorganic materials 0.000 claims abstract 4
- 229910052751 metal Inorganic materials 0.000 claims abstract 4
- 239000002184 metal Substances 0.000 claims abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 230000007547 defect Effects 0.000 claims 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 abstract 3
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 229910052723 transition metal Inorganic materials 0.000 abstract 1
- 150000003624 transition metals Chemical class 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 3
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/024—Defect control-gettering and annealing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Silicon Compounds (AREA)
- Ladders (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Heat Treatment Of Sheet Steel (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Abstract
천이 금속 물질, 특히 철로 오염된 실리콘 몸체에서의 소수 캐리어 재결합 수명을 증가시키기 위한 방법. 실리콘 몸체는 금속이 실리콘 몸체로 부터 실리콘 몸체의 표면까지 소수 캐리어 재결합 수명을 저장할 수 있게 증가시키는 정도로 확산을 일으키기에 충분한 온도에서 및 기간동안 저장된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따라 다양한 길이의 시간동안 280℃에서 저장된(stored) 두께 625마이크론, 직경 150㎜의 CZ 실리콘 위이퍼에 대한 데이타를 도시한다. 단위가 마이크로초인 웨이퍼의 소수 캐리어 재결합 수명이 수직축상에, 단위가 시간인 저장 기간이 수평 축상에 나타나 있다.
제2도는 본 발명에 따라 다양한 길이의 시간동안 400℃에서 저장된 두께 1400마이크론, 직경 150㎜의 MCZ 실리콘 웨이퍼에 대한 데이타를 도시한다. 단위가 마이크로초인 웨이퍼의 소수 캐리어 재결합 수명이 수직 축상에, 단위가 시간인 저장 기간이 수평 축상에 나타나 있다. 실리콘에서의 오염물 제거와 소수 캐리어 수명 개선.
Claims (5)
- 철, 크롬, 코발트, 망간, 아연 그리고 바나듐으로 이루어진 군으로부터 선택된 금속으로 오염된 실리콘 몸체에서의 소수 캐리어 재결합 수명을 증가시키는 방법에 있어서, 상기 실리콘 몸체는 상기 금속을 실리콘 몸체의 벌크로부터 실리콘 몸체의 표면으로 확산시키기에 충분한 저장 온도와 저장 기간 동안 저장되어 실리콘 몸체의 소수 캐리어 재결합 수명을 측정할 수 잇게 증가시키며 상기 저장 기간은 약 48시간 이상인 것을 특징으로 하는 방법.
- 제1항에 있어서, 상기 실리콘 몸체는 광기전 셀의 충분한 셀의 성분임을 특징으로 하는 방법.
- 제1항에 있어서, 상기 실리콘 몸체는 실리콘 웨이퍼이고, 상기 금속은 철이고, 상기 웨어펀 철을 웨이퍼 두께의 10%보다 더 크게 웨이퍼 표면으로부터 떨어진 웨이퍼 벌크 영역들로 부터 상기 웨이퍼 표면으로 확산시키기에 충분한 저장 온도 및 저장 기간 동안 저장되고, 상기 저장 온도가 실리콘에서 산소 관련 결함을 생성하기에 불충분하지만 약 200℃이상인 것을 또한 특징으로 하는 방법.
- 제1항에 있어서, 상기 저장 온도는 200℃와 약 500℃ 사이인 것을 특징으로 하는 방법.
- 제1항에 있어서, 상기 소수 캐리어 재결합 수명은 약 200마이크로초 이상 증가됨을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
USRM92A000687 | 1992-09-23 | ||
IT92RM687 IT1258487B (it) | 1992-09-23 | 1992-09-23 | Procedimento per migliorare il tempo di vita dei portatori di minoranza in fette di silicio o in dispositivi a semiconduttore con esse prodotti |
ITRM92A000687 | 1992-09-23 | ||
US07/971,056 US5272119A (en) | 1992-09-23 | 1992-11-03 | Process for contamination removal and minority carrier lifetime improvement in silicon |
US07/971,056 | 1992-11-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940008018A true KR940008018A (ko) | 1994-04-28 |
KR100298529B1 KR100298529B1 (ko) | 2001-11-30 |
Family
ID=26332021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930019495A KR100298529B1 (ko) | 1992-09-23 | 1993-09-23 | 실리콘에서의오염물제거와소수캐리어수명개선을위한방법 |
Country Status (9)
Country | Link |
---|---|
US (1) | US5272119A (ko) |
EP (1) | EP0590508B1 (ko) |
JP (1) | JP2735772B2 (ko) |
KR (1) | KR100298529B1 (ko) |
CN (1) | CN1034893C (ko) |
AT (1) | ATE220477T1 (ko) |
DE (1) | DE59310292D1 (ko) |
FI (1) | FI934149A (ko) |
MY (1) | MY110011A (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3562588B2 (ja) * | 1993-02-15 | 2004-09-08 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
US6997985B1 (en) | 1993-02-15 | 2006-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor, semiconductor device, and method for fabricating the same |
JP3193803B2 (ja) * | 1993-03-12 | 2001-07-30 | 株式会社半導体エネルギー研究所 | 半導体素子の作製方法 |
US5418172A (en) * | 1993-06-29 | 1995-05-23 | Memc Electronic Materials S.P.A. | Method for detecting sources of contamination in silicon using a contamination monitor wafer |
KR100240023B1 (ko) * | 1996-11-29 | 2000-01-15 | 윤종용 | 반도체 웨이퍼 열처리방법 및 이에 따라 형성된 반도체 웨이퍼 |
US5913103A (en) * | 1997-05-13 | 1999-06-15 | Integrated Device Technology, Inc. | Method of detecting metal contaminants in a wet chemical using enhanced semiconductor growth phenomena |
US6100167A (en) * | 1997-05-29 | 2000-08-08 | Memc Electronic Materials, Inc. | Process for the removal of copper from polished boron doped silicon wafers |
US6482269B1 (en) | 1997-05-29 | 2002-11-19 | Memc Electronic Materials, Inc. | Process for the removal of copper and other metallic impurities from silicon |
US20030104680A1 (en) * | 2001-11-13 | 2003-06-05 | Memc Electronic Materials, Inc. | Process for the removal of copper from polished boron-doped silicon wafers |
US6838321B2 (en) * | 2002-09-26 | 2005-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor substrate with defects reduced or removed and method of manufacturing the same, and semiconductor device capable of bidirectionally retaining breakdown voltage and method of manufacturing the same |
US20040063302A1 (en) * | 2002-09-26 | 2004-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor substrate with defects reduced or removed and method of manufacturing the same, and semiconductor device capable of bidirectionally retaining breakdown voltage and method of manufacturing the same |
JP4781616B2 (ja) * | 2002-09-26 | 2011-09-28 | 三菱電機株式会社 | 半導体基板の製造方法及び半導体装置の製造方法 |
JP5042445B2 (ja) * | 2004-04-14 | 2012-10-03 | 株式会社Sumco | シリコンウェーハのゲッタリング効率を評価する方法 |
JP4743010B2 (ja) * | 2005-08-26 | 2011-08-10 | 株式会社Sumco | シリコンウェーハの表面欠陥評価方法 |
US7657390B2 (en) * | 2005-11-02 | 2010-02-02 | Applied Materials, Inc. | Reclaiming substrates having defects and contaminants |
US8133800B2 (en) * | 2008-08-29 | 2012-03-13 | Silicon Genesis Corporation | Free-standing thickness of single crystal material and method having carrier lifetimes |
CN102709181B (zh) * | 2012-05-08 | 2014-12-31 | 常州天合光能有限公司 | 提高硅晶体电池片转换效率的方法 |
CN106505004B (zh) * | 2015-09-07 | 2019-05-03 | 中芯国际集成电路制造(上海)有限公司 | 检测晶圆中铁含量异常的装置及其方法 |
CN111398774B (zh) * | 2020-03-18 | 2022-02-15 | 西安奕斯伟材料科技有限公司 | 硅片少子寿命的测试方法及装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3929529A (en) * | 1974-12-09 | 1975-12-30 | Ibm | Method for gettering contaminants in monocrystalline silicon |
US4053335A (en) * | 1976-04-02 | 1977-10-11 | International Business Machines Corporation | Method of gettering using backside polycrystalline silicon |
JPS583375B2 (ja) * | 1979-01-19 | 1983-01-21 | 超エル・エス・アイ技術研究組合 | シリコン単結晶ウエハ−の製造方法 |
US4231809A (en) * | 1979-05-25 | 1980-11-04 | Bell Telephone Laboratories, Incorporated | Method of removing impurity metals from semiconductor devices |
US4410395A (en) * | 1982-05-10 | 1983-10-18 | Fairchild Camera & Instrument Corporation | Method of removing bulk impurities from semiconductor wafers |
EP0165364B1 (fr) * | 1984-06-20 | 1988-09-07 | International Business Machines Corporation | Procédé de standardisation et de stabilisation de tranches semiconductrices |
US4732874A (en) * | 1986-10-15 | 1988-03-22 | Delco Electronics Corporation | Removing metal precipitates from semiconductor devices |
JPS63136531A (ja) * | 1986-11-27 | 1988-06-08 | Toshiba Corp | 半導体装置 |
JPH0290531A (ja) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | 半導体装置の製造方法およびウエハ |
US4929564A (en) * | 1988-10-21 | 1990-05-29 | Nippon Mining Co., Ltd. | Method for producing compound semiconductor single crystals and method for producing compound semiconductor devices |
JP2671494B2 (ja) * | 1989-05-16 | 1997-10-29 | 富士通株式会社 | ゲッタリング方法 |
-
1992
- 1992-11-03 US US07/971,056 patent/US5272119A/en not_active Expired - Fee Related
-
1993
- 1993-09-22 FI FI934149A patent/FI934149A/fi not_active Application Discontinuation
- 1993-09-23 MY MYPI93001930A patent/MY110011A/en unknown
- 1993-09-23 CN CN93117900A patent/CN1034893C/zh not_active Expired - Fee Related
- 1993-09-23 DE DE59310292T patent/DE59310292D1/de not_active Expired - Fee Related
- 1993-09-23 EP EP93115307A patent/EP0590508B1/de not_active Expired - Lifetime
- 1993-09-23 KR KR1019930019495A patent/KR100298529B1/ko not_active IP Right Cessation
- 1993-09-23 AT AT93115307T patent/ATE220477T1/de not_active IP Right Cessation
- 1993-09-24 JP JP5237794A patent/JP2735772B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE59310292D1 (de) | 2002-08-14 |
CN1087208A (zh) | 1994-05-25 |
ATE220477T1 (de) | 2002-07-15 |
EP0590508A3 (en) | 1997-10-08 |
MY110011A (en) | 1997-11-29 |
FI934149A0 (fi) | 1993-09-22 |
JPH06196488A (ja) | 1994-07-15 |
EP0590508A2 (de) | 1994-04-06 |
CN1034893C (zh) | 1997-05-14 |
EP0590508B1 (de) | 2002-07-10 |
JP2735772B2 (ja) | 1998-04-02 |
KR100298529B1 (ko) | 2001-11-30 |
US5272119A (en) | 1993-12-21 |
FI934149A (fi) | 1994-03-24 |
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