KR940005712B1 - 잭 타입 아이씨 패키지(jack-type ic package) - Google Patents

잭 타입 아이씨 패키지(jack-type ic package) Download PDF

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Publication number
KR940005712B1
KR940005712B1 KR1019910020242A KR910020242A KR940005712B1 KR 940005712 B1 KR940005712 B1 KR 940005712B1 KR 1019910020242 A KR1019910020242 A KR 1019910020242A KR 910020242 A KR910020242 A KR 910020242A KR 940005712 B1 KR940005712 B1 KR 940005712B1
Authority
KR
South Korea
Prior art keywords
package
jack
type
substrate
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019910020242A
Other languages
English (en)
Korean (ko)
Other versions
KR930011138A (ko
Inventor
백승대
Original Assignee
금성일랙트론 주식회사
문정환
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일랙트론 주식회사, 문정환 filed Critical 금성일랙트론 주식회사
Priority to KR1019910020242A priority Critical patent/KR940005712B1/ko
Priority to TW081108248A priority patent/TW253984B/zh
Priority to US07/962,878 priority patent/US5365404A/en
Priority to DE4237267A priority patent/DE4237267C2/de
Priority to JP4302041A priority patent/JPH05218232A/ja
Publication of KR930011138A publication Critical patent/KR930011138A/ko
Application granted granted Critical
Publication of KR940005712B1 publication Critical patent/KR940005712B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1019910020242A 1991-11-14 1991-11-14 잭 타입 아이씨 패키지(jack-type ic package) Expired - Fee Related KR940005712B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019910020242A KR940005712B1 (ko) 1991-11-14 1991-11-14 잭 타입 아이씨 패키지(jack-type ic package)
TW081108248A TW253984B (https=) 1991-11-14 1992-10-16
US07/962,878 US5365404A (en) 1991-11-14 1992-10-19 Jack-type semiconductor integrated circuit packages
DE4237267A DE4237267C2 (de) 1991-11-14 1992-11-04 Steckerartiges Gehäuse für einen integrierten Halbleiterschaltkreis
JP4302041A JPH05218232A (ja) 1991-11-14 1992-11-12 ジャックタイプｉｃパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910020242A KR940005712B1 (ko) 1991-11-14 1991-11-14 잭 타입 아이씨 패키지(jack-type ic package)

Publications (2)

Publication Number Publication Date
KR930011138A KR930011138A (ko) 1993-06-23
KR940005712B1 true KR940005712B1 (ko) 1994-06-23

Family

ID=19322814

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910020242A Expired - Fee Related KR940005712B1 (ko) 1991-11-14 1991-11-14 잭 타입 아이씨 패키지(jack-type ic package)

Country Status (5)

Country Link
US (1) US5365404A (https=)
JP (1) JPH05218232A (https=)
KR (1) KR940005712B1 (https=)
DE (1) DE4237267C2 (https=)
TW (1) TW253984B (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340266A (en) * 1978-05-22 1982-07-20 Minnesota Mining And Manufacturing Company Connector system
US4331371A (en) * 1979-03-09 1982-05-25 Japan Aviation Electronics Industry, Ltd. Electrical connector
FR2554980B1 (fr) * 1983-11-10 1986-01-17 Socapex Connecteur a force d'insertion nulle pour support rectangulaire de circuit et pince de fermeture pour un tel connecteur
US4783695A (en) * 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
JPS63253653A (ja) * 1987-04-10 1988-10-20 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
US5180976A (en) * 1987-04-17 1993-01-19 Everett/Charles Contact Products, Inc. Integrated circuit carrier having built-in circuit verification
JPH0777255B2 (ja) * 1988-07-26 1995-08-16 松下電工株式会社 ピングリッドアレイおよび半導体素子塔載方法
US4936783A (en) * 1988-12-21 1990-06-26 Minnesota Mining And Manufacturing Company Electronic socket for IC quad pack
US4912547A (en) * 1989-01-30 1990-03-27 International Business Machines Corporation Tape bonded semiconductor device

Also Published As

Publication number Publication date
DE4237267A1 (en) 1993-05-19
TW253984B (https=) 1995-08-11
DE4237267C2 (de) 2000-03-09
JPH05218232A (ja) 1993-08-27
KR930011138A (ko) 1993-06-23
US5365404A (en) 1994-11-15

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