KR940005651B1 - 경화성 폴리오가노실옥산 조성물 - Google Patents
경화성 폴리오가노실옥산 조성물 Download PDFInfo
- Publication number
- KR940005651B1 KR940005651B1 KR1019860010543A KR860010543A KR940005651B1 KR 940005651 B1 KR940005651 B1 KR 940005651B1 KR 1019860010543 A KR1019860010543 A KR 1019860010543A KR 860010543 A KR860010543 A KR 860010543A KR 940005651 B1 KR940005651 B1 KR 940005651B1
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- component
- alkenyl
- platinum
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60277703A JPS62135561A (ja) | 1985-12-10 | 1985-12-10 | 硬化性オルガノポリシロキサン組成物 |
| JP277703/85 | 1985-12-10 | ||
| JP277703 | 1985-12-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR870006066A KR870006066A (ko) | 1987-07-09 |
| KR940005651B1 true KR940005651B1 (ko) | 1994-06-22 |
Family
ID=17587134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019860010543A Expired - Fee Related KR940005651B1 (ko) | 1985-12-10 | 1986-12-10 | 경화성 폴리오가노실옥산 조성물 |
Country Status (6)
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4686271A (en) * | 1986-03-03 | 1987-08-11 | Dow Corning Corporation | Hydraulic silicone crumb |
| JPS62205159A (ja) * | 1986-03-04 | 1987-09-09 | Toray Silicone Co Ltd | オルガノポリシロキサン組成物の硬化方法 |
| JPH0684476B2 (ja) * | 1986-07-23 | 1994-10-26 | 東レ・ダウコ−ニング・シリコ−ン株式会社 | 硬化性オルガノポリシロキサン組成物 |
| GB2208650B (en) * | 1987-08-15 | 1991-09-04 | Dow Corning Sa | Curable organopolysiloxane compositions |
| US4753978A (en) * | 1987-08-25 | 1988-06-28 | Dow Corning Corporation | Curable organosiloxane compositions |
| JP2614472B2 (ja) * | 1987-12-29 | 1997-05-28 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性オルガノポリシロキサン組成物 |
| GB8819568D0 (en) * | 1988-08-17 | 1988-09-21 | Dow Corning Ltd | Method of coating flexible polyester film |
| JP3270489B2 (ja) * | 1991-01-30 | 2002-04-02 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性オルガノポリシロキサン組成物 |
| JP3268801B2 (ja) * | 1991-11-22 | 2002-03-25 | ジーイー東芝シリコーン株式会社 | シリコーンゴム組成物およびシリコーンゴム加工布 |
| JP3318356B2 (ja) * | 1992-06-29 | 2002-08-26 | 東レ・ダウコーニング・シリコーン株式会社 | 剥離性硬化皮膜形成用オルガノポリシロキサン組成物 |
| US5399650A (en) * | 1993-08-17 | 1995-03-21 | Dow Corning Corporation | Adhesion promoting additives and low temperature curing organosiloxane compositions containing same |
| US5516823A (en) * | 1994-05-10 | 1996-05-14 | Dow Corning Corporation | Adhesion promoting compositions and curable organosiloxane compositions containing same |
| US5567764A (en) * | 1995-07-28 | 1996-10-22 | Dow Corning Corporation | Curable silicone coatings containing alkoxy and alkenyl functional siloxanes |
| FR2740479B1 (fr) | 1995-10-31 | 1998-01-09 | Rhone Poulenc Chimie | Utilisation d'une composition organopolysiloxanique pour l'enduction d'une bande transporteuse et bande transporteuse ainsi obtenue |
| US6716533B2 (en) | 2001-08-27 | 2004-04-06 | General Electric Company | Paper release compositions having improved adhesion to paper and polymeric films |
| JP3919001B2 (ja) * | 2002-08-08 | 2007-05-23 | 信越化学工業株式会社 | 付加反応硬化型オルガノポリシロキサン組成物 |
| RU2230348C1 (ru) * | 2002-12-27 | 2004-06-10 | Гущо Юрий Петрович | Электрооптический преобразователь, гелеобразный слой для электрооптического преобразователя, способ приготовления гелеобразного слоя (варианты) и композиция для осуществления способа |
| US7090923B2 (en) | 2003-02-12 | 2006-08-15 | General Electric Corporation | Paper release compositions having improved adhesion to paper and polymeric films |
| US7005475B2 (en) | 2003-06-10 | 2006-02-28 | General Electric Company | Curable silicone compositions having improved adhesion to polymeric films |
| JP5090000B2 (ja) * | 2007-01-24 | 2012-12-05 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | プライマー組成物及びそれを用いた光半導体装置 |
| JP5388681B2 (ja) * | 2009-04-30 | 2014-01-15 | 電気化学工業株式会社 | 構造体 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4810947B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1969-08-15 | 1973-04-09 | ||
| JPS5224258A (en) * | 1975-08-19 | 1977-02-23 | Toray Silicone Co Ltd | Curable organopolysiloxane composition |
| US4087585A (en) * | 1977-05-23 | 1978-05-02 | Dow Corning Corporation | Self-adhering silicone compositions and preparations thereof |
| JPS5434362A (en) * | 1977-08-24 | 1979-03-13 | Shin Etsu Chem Co Ltd | Curable organopolysiloxane composition |
| JPS5541702A (en) * | 1978-09-18 | 1980-03-24 | Hitachi Ltd | Glass film coating method for semiconductor |
| DE2937854A1 (de) * | 1978-09-27 | 1980-04-17 | Hauser Raimund | Filmgeraet |
| JPS59133252A (ja) * | 1983-01-19 | 1984-07-31 | Toray Silicone Co Ltd | オルガノポリシロキサン組成物 |
| JPS61197448A (ja) * | 1985-02-22 | 1986-09-01 | Toray Silicone Co Ltd | 光通信ガラスフアイバ用被覆剤 |
| JPH0641563B2 (ja) * | 1985-07-30 | 1994-06-01 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性オルガノポリシロキサン組成物 |
| US4645815A (en) * | 1985-10-31 | 1987-02-24 | General Electric Company | Heat curable organopolysiloxane compositions |
-
1985
- 1985-12-10 JP JP60277703A patent/JPS62135561A/ja active Granted
-
1986
- 1986-11-07 CA CA000522434A patent/CA1287434C/en not_active Expired - Lifetime
- 1986-12-09 EP EP86117116A patent/EP0226934B1/en not_active Expired - Lifetime
- 1986-12-09 DE DE3650074T patent/DE3650074T2/de not_active Expired - Fee Related
- 1986-12-10 KR KR1019860010543A patent/KR940005651B1/ko not_active Expired - Fee Related
- 1986-12-10 AU AU66387/86A patent/AU588067B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| DE3650074T2 (de) | 1995-03-02 |
| AU588067B2 (en) | 1989-09-07 |
| KR870006066A (ko) | 1987-07-09 |
| EP0226934A2 (en) | 1987-07-01 |
| AU6638786A (en) | 1987-06-11 |
| JPH0423663B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-04-22 |
| EP0226934B1 (en) | 1994-09-21 |
| DE3650074D1 (de) | 1994-10-27 |
| EP0226934A3 (en) | 1990-05-16 |
| JPS62135561A (ja) | 1987-06-18 |
| CA1287434C (en) | 1991-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR940005651B1 (ko) | 경화성 폴리오가노실옥산 조성물 | |
| EP0203753B1 (en) | Curable organosiloxane compositions | |
| EP0497349B1 (en) | Organosiloxane compositions exhibiting improved adhesion | |
| US4087585A (en) | Self-adhering silicone compositions and preparations thereof | |
| KR960002480B1 (ko) | 경화성 오가노폴리실록산 조성물 | |
| CA1065986A (en) | Solvent resistant room temperature vulcanizable silicone rubber composition | |
| KR101176581B1 (ko) | 광가교성 실리콘 혼합물로부터 실리콘 코팅 및 실리콘 몰딩을 제조하는 방법 | |
| EP0228775B1 (en) | Curable organopolysiloxane compositions with improved adhesion | |
| KR840001758B1 (ko) | 내연성 실리콘 발포 조성물 | |
| KR101610964B1 (ko) | 액상 경화성 플루오로실리콘 조성물의 탈포성을 향상시키는 방법 | |
| EP0714936B1 (en) | Organosilicon compounds and low temperature curing organosiloxane compositions containing same | |
| US5516823A (en) | Adhesion promoting compositions and curable organosiloxane compositions containing same | |
| TW201843239A (zh) | 加成硬化型聚矽氧組成物、該組成物之製造方法、聚矽氧硬化物及光學元件 | |
| US4786701A (en) | Curable organosiloxane composition | |
| KR20240023416A (ko) | 백금 촉매 혼합물, 경화성 액상 실리콘 조성물, 경화성 액상 실리콘 조성물의 경화 방법 및 백금 촉매 혼합물의 조제 방법 | |
| EP0721952B1 (en) | Adhesion additives and curable organosiloxane compositions containing same | |
| JPS6334901B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH08269331A (ja) | シリコーンゲル組成物及びポッティング材 | |
| JP2624596B2 (ja) | 一液型の熱硬化可能なオルガノポリシロキサン組成物 | |
| JP2632606B2 (ja) | 硬化性オルガノポリシロキサン組成物 | |
| KR20230108289A (ko) | 2-파트 축합 경화성 실리콘 조성물 및 이의 적용 | |
| JPH0515729B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JP2006137895A (ja) | 光学材料用ポリオルガノシロキサン組成物 | |
| JPH0641563B2 (ja) | 硬化性オルガノポリシロキサン組成物 | |
| JP5605925B2 (ja) | オルガノポリシルメチレン及びオルガノポリシルメチレン組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 19990615 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20000623 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20000623 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |