KR940005196A - 혼성 집적 회로 장치 - Google Patents

혼성 집적 회로 장치 Download PDF

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KR940005196A
KR940005196A KR1019930016750A KR930016750A KR940005196A KR 940005196 A KR940005196 A KR 940005196A KR 1019930016750 A KR1019930016750 A KR 1019930016750A KR 930016750 A KR930016750 A KR 930016750A KR 940005196 A KR940005196 A KR 940005196A
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Prior art keywords
current
insulating resin
pattern
conductive path
bonding pad
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KR1019930016750A
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KR100223504B1 (ko
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료이치 다까하시
가쯔미 오까와
유스께 이가라시
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다까노 야스아끼
상요덴기 가부시끼가이샤
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Priority claimed from JP4229960A external-priority patent/JP2869261B2/ja
Priority claimed from JP4247913A external-priority patent/JP2975778B2/ja
Priority claimed from JP4252899A external-priority patent/JP2902871B2/ja
Priority claimed from JP4258379A external-priority patent/JP2989390B2/ja
Priority claimed from JP4258374A external-priority patent/JP2846776B2/ja
Priority claimed from JP4258376A external-priority patent/JP2962945B2/ja
Application filed by 다까노 야스아끼, 상요덴기 가부시끼가이샤 filed Critical 다까노 야스아끼
Publication of KR940005196A publication Critical patent/KR940005196A/ko
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Publication of KR100223504B1 publication Critical patent/KR100223504B1/ko

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Abstract

과전류를 검출하는데 온도 변화에 대해 매우 안정한 상태에서 전류 검출이 가능한 혼성 집적 회로 장치를 제공하는 것을 목적으로 한다.
금속 기판(1)상에, 절연 수지층(2)를 통해 형성된 도전로(3)에 전류 검출용 저항 소자(5)를 포함하는 복수의 회로 소자(4 및 7)에 접속된 혼성 집적 회로 장치의 전류 검출용 저항 소자(5)에 금속편(5B)의 한 주면상에 수지막(5C)를 개재하여 온도 계수가 약 1ppm∼500ppm인 합금재로 저항 패턴(5A)가 형성된 저항체 부품을 이용해서, 주변의 도전로(3)과 와이어 접속한다.

Description

혼성 집적 회로 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 제1발명의 혼성 집적 회로 장치를 도시하는 사시 확대도,
제2도는 본 발명에서 사용되는 인버터 회로를 도시하는 도면,
제3도는 제2발명의 혼성 집적 회로 장치를 도시하는 사시 확대도,
제4도는 제2발명을 설명하기 위한 도면.

Claims (6)

  1. 금속 기판상에 절연 수지층을 개재하여 동박으로 형성된 원하는 형상의 도전로에 저항 소자를 포함하는 복수의 회로 소자가 접속된 혼성 집적 회로 장치에 있어서. 상기 저항 소자는 금속편의 한 주면상에 절연 수지막을 개재하여 소정 형성의 저항 패턴이 형성되고, 그 저항 패턴의 연장선 상에 2개 이상의 본딩용 패드를 가진 저항체 부품으로, 상기 저항체 부품을 상기 기판상에 탑재하고, 상기 저항체 부품 근방에 뻗는 도전로와 상기 저항체 부품의 본딩 패드를 와이어 본딩 접속한 것을 특징으로 하는 혼성 집적 회로 장치.
  2. 금속 기관상에 절연 수지층을 개재하여 동박으로 형성된 원하는 형상의 도전로에 금속편의 한 주면상에 절연수지막을 개재하여 전류를 흘리는 전류용 패턴의 양단부에 설치된 전류용 본딩 패드화 상기 전류용 패턴에 흐르는 전류를 검출하기 위한 전압 검출용 본딩 패드를 가진 저항 패턴이 형성된 저항체 부품 및 복수의 회로 소자가 접속된 흔성 집적 회로장치에 있어서, 상기 전류용 패턴은 그 패턴에 흐르는 전류의 전류경로가 균일해지도록 형성되고, 상기 저항체 부품의 본딩 패드와 그 근방에 뻗는 상기 도전로를 와이어 본딩 접속한 것을 특징으로 하는 혼성 집적 회로 장치.
  3. 금속 기판상에 절연 수지층을 개재하여 동박으로 형성된 원하는 형상의 도전로에 금속편의 한 주면상에 절연 수지막을 개재하여 전류를 흘리는 전류용 패턴의 양단부에 설치된 전류용 본딩 패드와 상기 전류용 패턴에 흐르는 전류를 검출하기 위한 전압 검출용 본딩 패드를 가진 저항 패턴이 형성된 저항체 부품 및 복수의 회로 소자가 접속된 혼성 집적 회로장치에 있어서, 상기 전류용 본딩 패드와 상기 전압 검출용 본딩 패드의 주변 근방에 상기 도전로가 각각 뻗어있고, 상기 양 본딩 패드와 상기 도전로를 접속하는 본딩 와이어선이 다른 방향에서 본딩 접속되는 것을 특징으로 하는 혼성 집적 회로 장치.
  4. 금속 기판상에 절연 수지층를 개재하여 동박으로 형성된 원하는 형상의 도전로에 금속편의 한 주면상에 절연수지막을 개재하여 전류를 흘리는 전류용 패턴의 양단부가 설치된 전류용 본딩 패드와 상기 전류용 패턴에 흐르는 전류를 검출하기 위한 전압 검출용 본딩 패드를 가진 저항 패턴이 형성된 저항체 부품 및 복수의 회로 소자가 접속된 혼성 집적 회로장치에 있어서, 상기 저항체 부품은 상기 하나 이상의 전류용 본딩 패드와 접속되는 도전로가 뻗어서 형성된 고착 패드상에 탑재되고, 상기 저항체 부품의 각 본딩 패드와, 상기 고착 패드의 근방에 뻗어있는 상기 도전로를 와이어 본딩 접속한 것을 특징으로 하는 혼성 집적 회로 장치.
  5. 금속 기판상에 절연 수지층을 개재하여 동박으로 형성된 원하는 형상의 도전로에 전류 검출용 저항 소자를 포함하는 복수의 회로 소자가 접속된 혼성 집적 회로 장치에 있어서, 상기전류 검출용 저항 소자의 금속편의 한 주면상에 절연 수지막을 개재하여 원하는 형상의 저항 패턴이 형성되고, 그 저항 패턴의 연장선상에 복수의 전류용 본딩 패드 및 상기 저항 패턴의 저항값을 달리하는 1쌍의 복수의 전압 검출용 본딩 패드를 가진 저항체 부품으로, 상기 저항체 부분이 탑재되는 그 근방에 뻗어 배치된 전력용 및 소신호용 도전로와 상기 전류용 본딩 패드 및 전압 검출용 본딩 패드를 와이어 본딩 접속한 것을 특징으로 하는 혼성 집적 회로 장치.
  6. 금속 기판상에 절연 수지층을 개재하여 동박으로 형성된 원하는 형상의 도전로에 전류 검출용 저항 소자를 포함하는 복수의 횔 소자가 접속된 혼성 집적 회로 장치에 있어서, 상기 전류 검출용 저항 소자는 금속편의 한 주면상에 절연 수지막을 개재하여 저항 온도 계수가 약 1ppm∼500ppm인 합금재로 이루어지는 원하는 형상의 저항 패턴이 형성되고, 이 저항 패턴의 연장선상에 2개 이상의 전류용 및 전압 검출용 패드를 가진 저항체 부품으로 이 저항체 부품을 상기 기판상에 표면 실장하며, 상기 저항체 부품을 열전도성에 양호한 절연성 수지로 피복한 것을 특징으로 하는 혼성 집적 회로 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930016750A 1992-08-28 1993-08-27 혼성 집적 회로 장치 KR100223504B1 (ko)

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JP92-229960 1992-08-28
JP4229960A JP2869261B2 (ja) 1992-08-28 1992-08-28 混成集積回路装置
JP92-247913 1992-09-17
JP4247913A JP2975778B2 (ja) 1992-09-17 1992-09-17 混成集積回路装置
JP92-252899 1992-09-22
JP4252899A JP2902871B2 (ja) 1992-09-22 1992-09-22 混成集積回路装置
JP4258379A JP2989390B2 (ja) 1992-09-28 1992-09-28 混成集積回路装置
JP92-258374 1992-09-28
JP92-258376 1992-09-28
JP4258374A JP2846776B2 (ja) 1992-09-28 1992-09-28 混成集積回路装置
JP4258376A JP2962945B2 (ja) 1992-09-28 1992-09-28 混成集積回路装置
JP92-258379 1992-09-28

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US5675310A (en) * 1994-12-05 1997-10-07 General Electric Company Thin film resistors on organic surfaces
US5683928A (en) * 1994-12-05 1997-11-04 General Electric Company Method for fabricating a thin film resistor
US6040226A (en) * 1997-05-27 2000-03-21 General Electric Company Method for fabricating a thin film inductor
JP3803025B2 (ja) * 2000-12-05 2006-08-02 富士電機ホールディングス株式会社 抵抗器
JP2004241416A (ja) * 2003-02-03 2004-08-26 Alps Electric Co Ltd 電子回路ユニットおよびその製造方法
JP4342232B2 (ja) * 2003-07-11 2009-10-14 三菱電機株式会社 半導体パワーモジュールおよび該モジュールの主回路電流値を計測する主回路電流計測システム
JP4452196B2 (ja) * 2004-05-20 2010-04-21 コーア株式会社 金属板抵抗器
JP4595665B2 (ja) * 2005-05-13 2010-12-08 富士電機システムズ株式会社 配線基板の製造方法
JP2008118067A (ja) * 2006-11-08 2008-05-22 Hitachi Ltd パワーモジュール及びモータ一体型コントロール装置
WO2016027692A1 (ja) 2014-08-18 2016-02-25 株式会社村田製作所 電子部品および電子部品の製造方法

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JPS5469768A (en) * 1977-11-14 1979-06-05 Nitto Electric Ind Co Printing circuit substrate with resistance
US4196411A (en) * 1978-06-26 1980-04-01 Gentron Corporation Dual resistor element
DE2919433A1 (de) * 1979-05-15 1980-12-04 Bosch Gmbh Robert Messonde zur messung der masse und/oder temperatur eines stroemenden mediums und verfahren zu ihrer herstellung
FR2516739A1 (fr) * 1981-11-17 1983-05-20 Rhone Poulenc Spec Chim Procede de fabrication de circuits electroniques de type hybride a couches epaisses, des moyens destines a la mise en oeuvre de ce procede et les circuits obtenus selon ce procede
US5262615A (en) * 1991-11-05 1993-11-16 Honeywell Inc. Film resistor made by laser trimming

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